Attributes

No	Name	Definition	Type
1	ActionName	The name of Action. For RosettaNet usually any of Request/Confirm/Notify/Query/Response.	string
2	Address1	Failing tester primary address; integer.	integer
3	Address2	Failing tester secondary address; integer.	integer
4	AddressLine1	The first line of a physical address.	string
5	AddressLine2	The second line of a physical address.	string
6	AddressLine3	The third line of a physical address.	string
7	AddressLine4	The fourth line of a physical address.	string
8	AddressLine5	The fifth line of a physical address.	string
9	AttachID	A string that defines the prober handler or any physical device/system that can be attached to the tester used in wafer sort or final test.	string
10	AttachName	A string to identify the tools attached to the tester system. e.g. Schlumberger 3100.	string
11	AttachmentID	String. A barcode, electronic ID or alphanumeric identifier for the FEHType used on a tester.	string
12	Authority	The name of the organization that a code is utilized from.	string
13	BinAssignment	A user defined integer designation for hard bins.	integer
14	Bits	Datalog values in series of bits (0s and 1s).	string
15	BufferNumber	Pattern buffer number.	integer
16	BuildID	A string that identifies the build version of the software. Example: BuildID=Java, JDK, 118, o118-199990910.	string
17	BusinessProcessInstanceIdentifier	The identifier for the public business process instance being sent that both the sender and receiver can identify.	string
18	Calculation	A string describing the mathematical expression to derive a result.	string
19	Category	A string that describes a category of tests.	string
20	CensorHLim	FLOAT value for the high boundary for legitimate or valid test data.	float
21	CensorLLim	FLOAT value for the low boundary for legitimate or valid test data.	float
22	CenterX	The vector in X direction for index units form the (0,0) coordinate to the index containing the physical center of the wafer. For PCM data the index is reticle steps. For Wafer Sort and Final Test data the index is die steps.	float
23	CenterY	The vector in Y direction for index units form the (0,0) coordinate to the index containing the physical center of the wafer. For PCM data the index is reticle steps. For Wafer Sort and Final Test data the index is die steps.	float
24	Channel	Integer, tester channel number.	integer
25	CharFlag	Used as a indicator for the presence of characterization data for a die.	boolean
26	ChipPN	A string that describes the part number for the device.	string
27	ChipPinName	Alphanumeric string to describe the name of the pin.	string
28	CityName	The name of a city.	string
29	ComponentDescription	A user defined description of the component.	string
30	ComponentID	A unique identification of the component per the componentType (e.g. Frame, Card). Note: The ChipID may be identified by waferid/X/Y. This may be an actual component serial number or may be the primary ECID value waferid/X/Y. If there is an invalid ECID read, the value that is typically used is lotnum/seq/bad-waferid/bad-X/bad-Y or equivalent.	string
31	ComponentLocation	The location of a sub-component on the parent component.	string
32	ComponentNumber	A number associating a CalcFailReport to a specific component in BuildInfoReport.	integer
33	ComponentNumber	A number associating a FPReport to a specific component in BuildInfoReport.	integer
34	ComponentNumber	A number associating a FunctionalPinReport to a specific component in BuildInfoReport.	integer
35	ComponentNumber	A number associating a PPReport to a specific component in BuildInfoReport.	integer
36	ComponentNumber	A number associating a PRReport to a specific component in BuildInfoReport.	integer
37	ComponentNumber	A number associating a key value pair to a specific component in BuildInfoReport.	integer
38	ComponentNumber	A number associating an ECIDReport to a specific component in BuildInfoReport.	integer
39	ComponentNumber	A unique number associated with the component or subcomponent being tested relative to the device. In general the highest level of the componentNumber equals 0 and all identified subcomponents are componentNumber equal 1-n. Subsequent Reports can be associated to the sub-component via the componentNumber.	integer
40	ComponentParentNumber	For the highest level of packaged component the value is null. For any sub-component, the corresponding componentNumber is from a previous BuildInfoReport.	integer
41	ComponentSerialNumber	A scribed serial number on the component.	string
42	CompositeFailSort	A user initiated failure override of first fail sort to allow for the collection of additional sort fail data. The additional sort fails can be combined in a comma separated list of sort numbers as a composite fail. The compositeFailSort describes the content of the data in the sortID tag.	string
43	Condition	A string specifying the test parameter. Example: TestTemperature etc.	string
44	Contact	The name of the department, service or individual to be contacted within the organization.	Contact
45	ContractIdentifier	Unique identification of a contract between the Sender and the Receiver	string
46	ContractType	The type of the contract: an attribute describing the type of the ContractIndentification. Valid values are URI, URN,ebXMLCPA, or other values defined by partners.	string
47	Creation	The creation date and time of the specified Business Document (i.e. the Purchase Order date).	dateTime
48	CustomerTestProgramEC	Customer Supplied Test Program EC. In a foundry model, the customer can have a different test program EC than the one used by the test house.	string
49	CustomerTestProgramName	Customer Supplied Test Program Name. In a foundry model, the customer can have a different test program name than the one used by the test house.	string
50	CycleCnt	Integer, Cycle count for ABIST/LBIST diagnostic data collection or the T0 count for a pattern.	integer
51	DUNSPlus4	A identifier to specify a specific location within a business location.	DUNSPlus4
52	DUNS	A number assigned by Dun and Bradstreet to identify a business location.	DUNS
53	DecodedID	Value that could represent waferID or lotID.	string
54	Decoder	Identifies the decoding scheme if ECID is used.	string
55	Description	A description of the attachment.	string
56	Description	A string that describes the kind of chip periodicity is being defined.	string
57	DieReticlePN	A string which defines the unique part numbers for die associated with a multi-project wafer.	string
58	ECIDType	When multiple types of electronic chip identification can be used, the ECIDTYPE field can be used to determine which type is being logged. e.g. Wafer_X_Y, MAC, GUID.	string
59	Email	The electronic mail for the specified contact.	string
60	End	The end date time of a period.	dateTime
61	EquipmentID	An alphanumeric string to identify the tester used at PCM, wafer sort or final test.	string
62	ErrorCode	A user defined code for how the calculation failed.	integer
63	FailLimExceeded	Flag indicator to whether more fails exists than were datalogged. False = all fails datalogged; True = More fails present.	boolean
64	FailValue	The resultant failed value from the calculation test.	float
65	Fax	The fax number for the specified contact.	string
66	FileDataVersion	User defined changes i.e. rules changes to content of data in the data file transfer. Examples: version update to loaders, parsers, or operating system, specification limits etc.	string
67	FirstFailSort	Described the sort ID for the first fail on the device. See content of data in sortID tag .	integer
68	GLN	Global Location Number (GLN) - A identifier to identify legal entities, trading parties and location.	GLN
69	GTIN	Global Trade Identification Number (GTIN).	GTIN
70	GlobalLotStatusCode	Describes lot or sublot status.	string
71	GlobalWorkInProcessLocationCode	References where fabrication, bond, assembly, test and related activities were performed on a lot or sublot.	string
72	GoodDieQuantity	Integer that describes the number of die or packages that are functional in a lot or sublot.	integer
73	GrossDiePerWafer	Integer, Describes the number of complete die on a wafer.	integer
74	HardSortName	Represents the hard sort name of the Sort Test.	string
75	HardSortSymbol	A user defined grouping of hard sort fails on a wafer map.	string
76	HardSort	Represents the hard sort ID of the Sort test.	string
77	HeadID	Identifies the test head used for wafer sort and final test.	string
78	HeaderVersion	The UN/CEFACT version of the document header.	string
79	HighLimit	Describes the high limit value for a test specification.	float
80	IdSuffix	An alphanumeric string that could be used to identify a lot at a location. The suffix string is user defined. It can be used to identify a lot split, a bond assembly location, wafer sort or final test location.	string
81	Identifier	Identifies the role of the contact (i.e. Service Technician, Account Manager) in the Business Process.	string
82	Identifier	The specified code to represent an entity (e.g. product, location, partner, etc.).	string
83	Identifier	The unique identifier for the document being sent.	string
84	Keyword	An optional keyword.	string
85	Length	The size of the attachment in bytes (i.e. 1 000 000 bytes)	positiveInteger
86	LogicalMax	The logiscal maximum dimensions. For PCM data, units are reticle index steps. For Wafer Sort and Final Test data, units are die index steps.	float
87	LogicalMin	The logiscal minimum dimensions. For PCM data, units are reticle index steps. For Wafer Sort and Final Test data, units are die index steps.	float
88	LotEndDateTime	Defines the end time of a lot for a test.	dateTime
89	LotStartDateTime	Defines the start time of the lot for a test.	dateTime
90	LowLimit	Describes the low limit value for a test specification.	float
91	ManufacturingID	Alphanumeric string which describes the lot.	string
92	MaxX	The maximum X coordinate on a semiconductor wafer.	float
93	MaxY	The maximum Y coodinate on a semiconductor wafer.	float
94	Maximum	Describes the maximum dimensional measurement for X, Y or Z axis.	float
95	Measurement	A data measurement that are collected from each pin measured.	float
96	Measurement	Measurement in base units.	float
97	MinX	The minimum X coodinate on a semiconductor wafer.	float
98	MinY	The minimum Y coodinate on a semiconductor wafer.	float
99	Minimum	Describes the minimum dimensional measurement for X, Y or Z axis.	float
100	ModulePinName	Alphanumeric string to describe the package pin name.	string
101	MultipleType	Indicates whether the manifest contains documents of multiple types. True if yes, and False if no.	boolean
102	Name	A string that specifically labels the FEH type.	string
103	Name	The name of software type. Examples: AIX, Windows.	string
104	NominalSize	Describes the diameter of the wafer in mm, or inches.	float
105	NonRepudiableReceipt	The value "true" will indicate that a signed acknowledgement for the business document is necessary.	boolean
106	Notch	Describes the orientation of the wafer notch in a tester: Valid options are: 12 o’clock; 3 o’clock, 6 o’clock, 9 o’clock, notch up, notch down, notch right or notch left, Up=U, Down=D, Left=L, or Right=R, 0, 90, 180 or 270 degrees. Reference SEMI G81, Appendix 1.	string
107	NumberOfItems	Total number of documents in the message. The physical count of the attachments in the payload plus the RosettaNet Business Message (for Service Content). The value of this field will be at least 1.	positiveInteger
108	OtherDefectQuantity	String. User defined Quality Control inspection at wafer sort and final test to identify defects. User defined Valid Values.	string
109	PackageDescription	User definable element for package size (default=mm), package type (string), and pin count (Integer).	string
110	ParallelTest	Tthe number of devices or parallel tests for wafer sort.	integer
111	PartText	String. A user defined comment field to attach additional die information.	string
112	PartnerId	The Trading Partner Identification of MNC that is creating this TPIR PIP.	DUNSPlus4
113	PartnerName	The name of the partner’s company/business.	string
114	PartnerSecurityID	An optional string that would indicate a project name to restrict access to the data to those employees working on that project.	string
115	PassKeyItemDefect	A flag to identify if a failing parameter is PCM or optional.	boolean
116	PassVisualInspection	A user defined pass/fail quality control inspection flag of wafer after wafer sort.	boolean
117	PersistentEncryption	The value "true" will indicate that the Business Document (including the header) needs to be encrypted when stored or transported.	boolean
118	PersistentSignature	The value "true" will indicate that a signature is required to be stored with the document while stored or transported.	boolean
119	Phone	The telephone number for the specified contact.	string
120	Pin	A Pin IDs for each pin measured.	integer
121	Pins	String. Comma separated list of Pin IDs as defined in PinReport.	string
122	PipIdentifier	PIP Identification.[ i.e. PIP3A4]	PipIdentifier
123	PipVersion	PIP version number (i.e. 02.02.00).	PipVersion
124	PosDirX	The positive direction of the X-axis. Values illustrate Up (U), Down (D), Left (L)and Right (R).	float
125	PosDirY	The positive direction of the Y-axis. Values illustrate Up (U), Down (D), Left (L)and Right (R).	float
126	PositionID	Integer to reference ID for pin.	integer
127	PostOfficeBox	The Post Office Box identifier used to identify a party's post office box.	string
128	PostalCode	Identifying geographic location as specified by a national postal code.	string
129	PrimaryIdentifier	A reference back to TestSpecificationReport. This identifier references the electrical attributes only once per lot.	integer
130	PrimaryIdentifier	An integer used as a reference back to TestSpecificationReport. This identifier references the electrical attributes only once per lot.	integer
131	PrimaryIdentifier	Reference to link the test report for a lot.	integer
132	PrimaryIdentifier	Reference to link the test report to a lot.	integer
133	ProbeName	Describes the probe recipe or pattern file.	string
134	ProcessIdentifier	The name of the PIP e.g. Notify of Forecast Reply.	string
135	ProcessReference	The URN for the PIP that includes Cluster/Segment/Process pattern used to identify the interface process (such as PIP3A4)	string
136	ProcessState	The business process (or service) state of the sender of a document. When a service receives this document, the receiver may use the state as a precondition.	string
137	ProductName	A customer defined descriptor or code name for a part being fabricated or tested at a Foundry or Test Service trading partner. Example are Neptune, Big Dog, Antares 6.	string
138	ProductName	The name of the product.	string
139	ProprietaryLabel	User defined label to uniquely identify a facility that is represented in any of the scenarios.	string
140	Quadrant	A user defined division of the wafer into 4 quadrants. Valid values: I, II, III, IV, Q1,Q2, Q3, Q4, Upper Left, Upper Right, Lower Left, Lower Right and User defined labels. Reference SEMI G81, Appendix 1.	string
141	QualityCode	Designate a quality condition of a lot. This can be a proprietary label defined by the Foundry of the Test Services trading partner.	string
142	RawBits	Raw Bits data in hexadecimal format.	Hexadecimal
143	RepairableFlag	A flag to indicate if product (die or module) are repairable based on user definition.	boolean
144	RequestingDocumentCreationDateTime	The date-time of the requesting business document.	dateTime
145	RequestingDocumentInstanceIdentifier	The Business Document identification number that identifies the requesting Business Document.	string
146	ResponseDateTime	The expected time to receive the response. This can not be greater than the PIP TimeToPerform.	dateTime
147	RetDieRelationX	The X coordinate of the center die within the center reticle.	float
148	RetDieRelationY	The Y coordinate of the center die within the center reticle.	float
149	RetDimensionX	The size of the reticle in the X direction , expressed in number of die incements.	float
150	RetDimensionY	The size of the reticle in the Y direction , expressed in number of die incements.	float
151	RetestSorts	A list of sort numbers from prior pass that will be retested in this pass.	string
152	RetestType	Describes how test data should be combined with prior data for the same LotID, test and level. Valid Options are: First: Replace all previous data for test and level; Sorts: Removal of module data from prior pass where sort matches a sort in a prior pass; Chip: Replaces data on a by chip basis; TestReplace: replaces data on a wafer sort test basis (deletes prior data for wafer or parameter having a non-null retest value.	string
153	Revision	Referenced the specified product revision.	string
154	SampleRate	Describes the percentage of die in wafer sort that are being tested under a characterization test plan.	PercentAmount
155	Sequence	An index indicating at which step of the calculation that it failed.	integer
156	SerialNumber	An alphanumeric string that uniquely defines the numbering of packaged die.	string
157	ServiceName	The name of the Business Activity with the "Request/Confirm" part removed. E.g., for the Activity "Request Purchase Order"==> "Purchase Order".	string
158	SetupName	A string that describes test conditions.	string
159	SetupVersion	Describes the version for the test conditions specified in setupName.	float
160	Signal	Alphanumeric string to describes name of signal pin.	string
161	SlotID	Slot Identification Number for a particular wafer. Companies prefer to use a slot id to keep track of which slot in the carrier the wafer is in.	string
162	SortCount	A string that describes the number of counts for each sortID during a test.	integer
163	SortID	The sortid represents the sort name of the Sort Test for which the firstFailSort and compositeFailSort are related to this sort identification.	string
164	SortName	Describes the test in the SortID.	string
165	SortSymbol	A user defined grouping of fails on a wafer map.	string
166	Standard	Identifies the standard used to submit the business document. (e.g. RosettaNet).	string
167	Start	The start date time of a period.	dateTime
168	StripTestID	Identify the packaged die numbering on a strip.	string
169	StripTestOrientation	Describes the orientation by strip test substrate: Valid values: 0, 90, 180, 270 degrees. Reference SEMI G81, Appendix 2.	integer
170	TargetTestTemperature	The targeted temperature value in either Centigrade or Fahrenheit at which a test is performed for lot or sublot.	float
171	Target	Describes the expected value for the test.	float
172	Technology	An alphanumeric string that is associated with a fabrication technology. Example. CMOS8SF, MOS-11.	string
173	TestID	An integer that uniquely identifies a test.	integer
174	TestLevel	A string that describes the test in further detail. Label may change. This is user definable.	string
175	TestMode	A string which is used to identify the type of test: PCM, Wafer Sort or Final Test. Within each major test type their may be multiple tests undertaken for each lot or sublot.	string
176	TestName	A string that describes the test.	string
177	TestPass	The number of times a test occurs. The test start and end time needs to be associated with each pass.	integer
178	TestProgEC	A string that indicates the version number for the TestProgName (Req. #43) used for testing a lot or sublot.	string
179	TestProgramName	A string that describes the test program for either a lot or sublot.	string
180	TestQty	Used for calculation of yield for die and packaged die for a lot or sublot tested.	integer
181	TestYld	A TPA defined calculation for yield at wafer sort and final test.	PercentAmount
182	TesterAlarm	An indicator status flag on whether the tester was in alarm during wafer sort or final test.	boolean
183	TesterControlSoftware	Describes the software and its version that control the tester.	string
184	TesterType	This object describes the tester model, version and ID number.	string
185	TotalFunctionalDie	String. User defined identifier on the level of functionality of die.	string
186	TpirBusinessProcessIdentifier	A Business Process Identifier to uniquely define the TPIR-PIP 'role' within a Business Scenario at a company or MNC level. The identifier MUST be composed of alphanumeric characters only and its length MUST be between one and twelve characters.	BusinessProcessIdentifier
187	TpirPipVersion	A TPIR-PIP Version Number (i.e., major and minor version number as XX.XX).	VersionIdentifier
188	Type	A string that describes the type hardware. It can be an Attachment Sets or FEH (Front End Hardware) that is attached to a tester system. Example: Probe Heads, Sockets, BIB, DIB and user definable attachments.	string
189	Type	Alphanumeric string listing the driver/receiver book types.	string
190	Type	Name of the Action Message	string
191	Type	The type of software described by this item. Valid examples are: Operating system, OEM tool control, Software system, Local Software and user defined.	string
192	Units	Special description or code of the units for the measurement value.	string
193	UniversalResourceIdentifier	The generic set of all names/addresses that are short strings that refer to resources.	string
194	Uri	Describes the destination uri for the TPIR form.	anyURI
195	UserSite	A user-defined die coordinate represented as an integer which is often associated with the serial number assigned by the tester or prober executive.	integer
196	UserSite	Identifies the corresponding device site number (0-1).	integer
197	UserSite	Identifies the corresponding device site number.	integer
198	UsingPatternCnts	A flag indicator to whether failing addresses or counts were datalogged. True = using pattern counts; False = datalogging vector addresses.	boolean
199	Value	Any character string value necessary for defining ASCI test results off card testers.	string
200	VectorLabel	String, Label for failing vector.	string
201	Version	PIP3A4v01.00	string
202	Version	The software version being utilized. Example: 4.1.3.	string
203	WaferShortID	Alternate identifier for the wafer unique ID. Companies prefer to use a wafer short name as the data key for their data analysis tools versus the wafer unique id.	string
204	WaferUniqueID	An alphanumeric string which describes the wafer serial number for traceability in a lot or sublot.	string
205	X	Coordinate value for X-axis.	float
206	Y	Coordinate value for Y-axis.	float
207	Z	Coordinate value for Z-axis.	float

Code Lists

1	Axis	Lines: 246
Indicate three dimensional direction.
Entity Instances
X		X-axis.
Y		Y-axis.
Z		Z-axis.

2	ComponentType	Lines: 310 433 549
Valid component values are: CAG, CHP, COR, CRD, FRM, MCM, MOD, NOD, SCM.
Entity Instances
CAG		A cage containing multiple boards or cards.
CHP		A row chip or die.
COR		Core, a subcomponent of a chip (e.g. Mult-core processor).
CRD		A card or board containing multiple module (MCM or SCM).
FRM		A frame containing multiple cages and user definded.
MCM		A multi chip module.
MOD		Module, a single packaged chip (SCM-e.g. Single Chip Module) or set of chips (MCM - e.g. Multi-Chip Module). Use this code when SCM or MCM can not be determined.
NOD		Node, a grouping of cards within a cage. A node may include cards, memory, and cooling unit systems.
SCM		A single chip module.

3	Confidentiality	Lines: 110
A string which describes the level of security associated with the data, as defined by TPA.
Entity Instances
CON		Confidential security level.
NON		No security restriction (None).
RES		Restricted security level.

4	CoordinateFlag	Lines: 244
A status flag to indicate the coordinate measurement is for a single die on a reticle or a multi-chip die on a reticle.
Entity Instances
MUL		Multi-chip die on a reticle.
SIN		Single Die on a reticle.

5	CountrySubdivision	Lines: 106 129 152 205 696
For representation of a Countries subdivisions RosettaNet has adopted ISO 3166-3; 1999. Refer to the following web page to get the latest version of the standard: http://www.iso.ch/iso/en/prods-services/iso3166ma/02iso-3166-code-lists/index.html If you need more information about the ISO standard please contact ISO for more details.

6	Country	Lines: 105 128 151 204 695
For representation of Country name RosettaNet has adopted ISO 3166-3; 1999. Refer to the following web page to get the latest version of the standard: http://www.iso.ch/iso/en/prods-services/iso3166ma/02iso-3166-code-lists/index.html If you need more information about the ISO standard please contact ISO for more details.

7	FileType	Lines: 22
Describes the file type of the TPIR form (PDF, XDP or XML).
Entity Instances
PDF		Portable Document Format.
XDP		XML Data Package.
XML		eXtensible Markup Language.

8	Language	Lines: 32
For representation of Language name RosettaNet has adopted ISO 639-2; 1998. Refer to the following web page to get the latest version of the standard: http://www.loc.gov/standards/iso639-2/iso639jac.html If you need more information about the ISO standard please contact ISO for more details.

9	LotStatusCompletion	Lines: 235
Status completion of lot or sublot at the end of testing.
Entity Instances
ABO		Aborted: process has been terminated; data is invalid and is purged.
COM		Completed: all process have been completed; data is valid and can be migrated.
SUS		Suspend: process is partially done; data is valid and can be migrated.

10	LotType	Lines: 180
Describes the mode in which product was tested.
Entity Instances
DEV		Development.
ENG		Engineering - State where product is made using test processes on non-production tools or equipment.
EUH		EUH type.
MFG		Manufacturing.
NCL		NonConformingLot - Lots affected by a nonconformity to preset quality characteristics.
PLT		Pilot - The first lot of the product (never produced at the dedicated subcontractor).
PPD		Pre-Production.
PQC		Process Qualification Check - Process to qualify manufacturing processes in preparation for volume manufacturing.
PRD		Production - State where product is made using all production tools, processes, equipment, environment, facility, and cycle time.
RND		Research and Development - Process for developing prototype products.
RWK		Rework - Parts sent back from further down the manufacturing line.
SVC		Service.
TST		Test - The manufacturing stage in which the packaged die is tested.

11	MimeTypeQualifier	Lines: 34
The MIME type as defined by IANA. Please refer to http://www.iana.org/assignments/media-types/ for a list of types.
Entity Instances
application/EDI-Consent		[RFC1767]
application/EDI-X12		[RFC1767]
application/EDIFACT		[RFC1767]
application/activemessage		[Shapiro]
application/andrew-inset		[Borenstein]
application/applefile		[Faltstrom]
application/atomicmail		[Borenstein]
application/batch-SMTP		[RFC2442]
application/beep+xml		[RFC3080]
application/cals-1840		[RFC1895]
application/cnrp+xml		[RFCCNRP]
application/commonground		[Glazer]
application/cpl+xml
application/cybercash		[Eastlake]
application/dca-rft		[Campbell]
application/dec-dx		[Campbell]
application/dicom		[RFC3240]
application/dvcs		[RFC3029]
application/eshop		[Katz]
application/font-tdpfr		[RFC3073]
application/http		[RFC2616]
application/hyperstudio		[Domino]
application/iges		[Parks]
application/index		[RFC2652]
application/index.cmd		[RFC2652]
application/index.obj		[RFC2652]
application/index.response		[RFC2652]
application/index.vnd		[RFC2652]
application/iotp		[RFC2935]
application/ipp		[RFC2910]
application/isup		[RFC3204]
application/mac-binhex40		[Faltstrom]
application/macwriteii		[Lindner]
application/marc		[RFC2220]
application/mathematica		[Van Nostern]
application/msword		[Lindner]
application/news-message-id		[RFC1036,Spencer]
application/news-transmission		[RFC1036, Spencer]
application/ocsp-request		[RFC2560]
application/ocsp-response		[RFC2560]
application/octet-stream		[RFC2045,RFC2046]
application/oda		[RFC2045,RFC2046]
application/ogg		[RFC-walleij-ogg-mediatype-08.txt]
application/parityfec		[RFC3009]
application/pdf		[Lindner]
application/pgp-encrypted		[RFC3156]
application/pgp-keys		[RFC3156]
application/pgp-signature		[RFC3156]
application/pkcs10		[RFC2311]
application/pkcs7-mime		[RFC2311]
application/pkcs7-signature		[RFC2311]
application/pkix-cert		[RFC2585]
application/pkix-crl		[RFC2585]
application/pkixcmp		[RFC2510]
application/postscript		[RFC2045,RFC2046]
application/prs.alvestrand.titrax-sheet		[Alvestrand]
application/prs.cww		[Rungchavalnont]
application/prs.nprend		[Doggett]
application/prs.plucker		[Janssen]
application/qsig		[RFC3204]
application/reginfo+xml		[RFC-ietf-sipping-reg-event-00.txt]
application/remote-printing		[RFC1486,Rose]
application/riscos		[Smith]
application/rtf		[Lindner]
application/sdp		[RFC2327]
application/set-payment		[Korver]
application/set-payment-initiation		[Korver]
application/set-registration		[Korver]
application/set-registration-initiation		[Korver]
application/sgml		[RFC1874]
application/sgml-open-catalog		[Grosso]
application/sieve		[RFC3028]
application/slate		[Crowley]
application/timestamp-query		[RFC3161]
application/timestamp-reply		[RFC3161]
application/tve-trigger		[Welsh]
application/vemmi		[RFC2122]
application/vnd.3M.Post-it-Notes		[O'Brien]
application/vnd.3gpp.pic-bw-large		[Meredith]
application/vnd.3gpp.pic-bw-small		[Meredith]
application/vnd.3gpp.pic-bw-var		[Meredith]
application/vnd.3gpp.sms		[Meredith]
application/vnd.FloGraphIt		[Floersch]
application/vnd.Mobius.DAF		[Kabayama]
application/vnd.Mobius.DIS		[Kabayama]
application/vnd.Mobius.MBK		[Devasia]
application/vnd.Mobius.MQY		[Devasia]
application/vnd.Mobius.MSL		[Kabayama]
application/vnd.Mobius.PLC		[Kabayama]
application/vnd.Mobius.TXF		[Kabayama]
application/vnd.Quark.QuarkXPress		[Scheidler]
application/vnd.accpac.simply.aso		[Leow]
application/vnd.accpac.simply.imp		[Leow]
application/vnd.acucobol		[Lubin]
application/vnd.acucorp		[Lubin]
application/vnd.adobe.xfdf		[Perelman]
application/vnd.aether.imp		[Moskowitz]
application/vnd.amiga.ami		[Blumberg]
application/vnd.anser-web-certificate-issue-initiation		[Mori]
application/vnd.anser-web-funds-transfer-initiation		[Mori]
application/vnd.audiograph		[Slusanschi]
application/vnd.blueice.multipass		[Holmstrom]
application/vnd.bmi		[Gotoh]
application/vnd.businessobjects		[Imoucha]
application/vnd.canon-cpdl		[Muto]
application/vnd.canon-lips		[Muto]
application/vnd.cinderella		[Kortenkamp]
application/vnd.claymore		[Simpson]
application/vnd.commerce-battelle		[Applebaum]
application/vnd.commonspace		[Chandhok]
application/vnd.contact.cmsg		[Patz]
application/vnd.cosmocaller		[Dellutri]
application/vnd.ctc-posml		[Kohlhepp]
application/vnd.cups-postscript		[Sweet]
application/vnd.cups-raster		[Sweet]
application/vnd.cups-raw		[Sweet]
application/vnd.curl		[Byrnes]
application/vnd.cybank		[Helmee]
application/vnd.data-vision.rdz		[Fields]
application/vnd.dna		[Searcy]
application/vnd.dpgraph		[Parker]
application/vnd.dreamfactory		[Appleton]
application/vnd.dxr		[Duffy]
application/vnd.ecdis-update		[Buettgenbach]
application/vnd.ecowin.chart		[Olsson]
application/vnd.ecowin.filerequest		[Olsson]
application/vnd.ecowin.fileupdate		[Olsson]
application/vnd.ecowin.series		[Olsson]
application/vnd.ecowin.seriesrequest		[Olsson]
application/vnd.ecowin.seriesupdate		[Olsson]
application/vnd.enliven		[Santinelli]
application/vnd.epson.esf		[Hoshina]
application/vnd.epson.msf		[Hoshina]
application/vnd.epson.quickanime		[Gu]
application/vnd.epson.salt		[Nagatomo]
application/vnd.epson.ssf		[Hoshina]
application/vnd.ericsson.quickcall		[Tidwell]
application/vnd.eudora.data		[Resnick]
application/vnd.fdf		[Zilles]
application/vnd.ffsns		[Holstage]
application/vnd.framemaker		[Wexler]
application/vnd.fsc.weblaunch		[D.Smith]
application/vnd.fujitsu.oasys		[Togashi]
application/vnd.fujitsu.oasys2		[Togashi]
application/vnd.fujitsu.oasys3		[Okudaira]
application/vnd.fujitsu.oasysgp		[Sugimoto]
application/vnd.fujitsu.oasysprs		[Ogita]
application/vnd.fujixerox.ddd		[Onda]
application/vnd.fujixerox.docuworks		[Taguchi]
application/vnd.fujixerox.docuworks.binder		[Matsumoto]
application/vnd.fut-misnet		[Pruulmann]
application/vnd.grafeq		[Tupper]
application/vnd.groove-account		[Joseph]
application/vnd.groove-help		[Joseph]
application/vnd.groove-identity-message		[Joseph]
application/vnd.groove-injector		[Joseph]
application/vnd.groove-tool-message		[Joseph]
application/vnd.groove-tool-template		[Joseph]
application/vnd.groove-vcard		[Joseph]
application/vnd.hbci		[Hammann]
application/vnd.hhe.lesson-player		[Jones]
application/vnd.hp-HPGL		[Pentecost]
application/vnd.hp-PCL		[Pentecost]
application/vnd.hp-PCLXL		[Pentecost]
application/vnd.hp-hpid		[Gupta]
application/vnd.hp-hps		[Aubrey]
application/vnd.httphone		[Lefevre]
application/vnd.hzn-3d-crossword		[Minnis]
application/vnd.ibm.MiniPay		[Herzberg]
application/vnd.ibm.afplinedata		[Buis]
application/vnd.ibm.electronic-media		[Tantlinger]
application/vnd.ibm.modcap		[Hohensee]
application/vnd.ibm.secure-container		[Tantlinger]
application/vnd.informix-visionary		[Gales]
application/vnd.intercon.formnet		[Gurak]
application/vnd.intertrust.digibox		[Tomasello]
application/vnd.intertrust.nncp		[Tomasello]
application/vnd.intu.qbo		[Scratchley]
application/vnd.intu.qfx		[Scratchley]
application/vnd.irepository.package+xml		[Knowles]
application/vnd.is-xpr		[Natarajan]
application/vnd.japannet-directory-service		[Fujii]
application/vnd.japannet-jpnstore-wakeup		[Yoshitake]
application/vnd.japannet-payment-wakeup		[Fujii]
application/vnd.japannet-registration		[Yoshitake]
application/vnd.japannet-registration-wakeup		[Fujii]
application/vnd.japannet-setstore-wakeup		[Yoshitake]
application/vnd.japannet-verification		[Yoshitake]
application/vnd.japannet-verification-wakeup		[Fujii]
application/vnd.jisp		[Deckers]
application/vnd.kde.karbon		[Faure]
application/vnd.kde.kchart		[Faure]
application/vnd.kde.kformula		[Faure]
application/vnd.kde.kivio		[Faure]
application/vnd.kde.kontour		[Faure]
application/vnd.kde.kpresenter		[Faure]
application/vnd.kde.kspread		[Faure]
application/vnd.kde.kword		[Faure]
application/vnd.kenameaapp		[DiGiorgio-Haag]
application/vnd.koan		[Cole]
application/vnd.liberty-request+xml		[McDowell]
application/vnd.llamagraphics.life-balance.desktop		[White]
application/vnd.lotus-1-2-3		[Wattenberger]
application/vnd.lotus-approach		[Wattenberger]
application/vnd.lotus-freelance		[Wattenberger]
application/vnd.lotus-notes		[Laramie]
application/vnd.lotus-organizer		[Wattenberger]
application/vnd.lotus-screencam		[Wattenberger]
application/vnd.lotus-wordpro		[Wattenberger]
application/vnd.mcd		[Gotoh]
application/vnd.mediastation.cdkey		[Flurry]
application/vnd.meridian-slingshot		[Wedel]
application/vnd.micrografx.flo		[Prevo]
application/vnd.micrografx.igx		[Prevo]
application/vnd.mif		[Wexler]
application/vnd.minisoft-hp3000-save		[Bartram]
application/vnd.mitsubishi.misty-guard.trustweb		[Tanaka]
application/vnd.mophun.application		[Wennerstrom]
application/vnd.mophun.certificate		[Wennerstrom]
application/vnd.motorola.flexsuite		[Patton]
application/vnd.motorola.flexsuite.adsi		[Patton]
application/vnd.motorola.flexsuite.fis		[Patton]
application/vnd.motorola.flexsuite.gotap		[Patton]
application/vnd.motorola.flexsuite.kmr		[Patton]
application/vnd.motorola.flexsuite.ttc		[Patton]
application/vnd.motorola.flexsuite.wem		[Patton]
application/vnd.mozilla.xul+xml		[McDaniel]
application/vnd.ms-artgalry		[Slawson]
application/vnd.ms-asf		[Fleischman]
application/vnd.ms-excel		[Gill]
application/vnd.ms-lrm		[Ledoux]
application/vnd.ms-powerpoint		[Gill]
application/vnd.ms-project		[Gill]
application/vnd.ms-tnef		[Gill]
application/vnd.ms-works		[Gill]
application/vnd.ms-wpl		[Plastina]
application/vnd.mseq		[Le Bodic]
application/vnd.msign		[Borcherding]
application/vnd.music-niff		[Butler]
application/vnd.musician		[Adams]
application/vnd.netfpx		[Mutz]
application/vnd.noblenet-directory		[Solomon]
application/vnd.noblenet-sealer		[Solomon]
application/vnd.noblenet-web		[Solomon]
application/vnd.novadigm.EDM		[Swenson]
application/vnd.novadigm.EDX		[Swenson]
application/vnd.novadigm.EXT		[Swenson]
application/vnd.obn		[Hessling]
application/vnd.osa.netdeploy		[Klos]
application/vnd.palm		[Peacock]
application/vnd.pg.format		[Gandert]
application/vnd.pg.osasli		[Gandert]
application/vnd.powerbuilder6		[Guy]
application/vnd.powerbuilder6-s		[Guy]
application/vnd.powerbuilder7		[Shilts]
application/vnd.powerbuilder7-s		[Shilts]
application/vnd.powerbuilder75		[Shilts]
application/vnd.powerbuilder75-s		[Shilts]
application/vnd.previewsystems.box		[Smolgovsky]
application/vnd.publishare-delta-tree		[Ben-Kiki]
application/vnd.pvi.ptid1		[Lamb]
application/vnd.pwg-multiplexed		[RFC3391]
application/vnd.pwg-xhtml-print+xml		[Wright]
application/vnd.rapid		[Szekely]
application/vnd.s3sms		[Tarkkala]
application/vnd.sealed.net		[Lambert]
application/vnd.seemail		[Webb]
application/vnd.shana.informed.formdata		[Selzler]
application/vnd.shana.informed.formtemplate		[Selzler]
application/vnd.shana.informed.interchange		[Selzler]
application/vnd.shana.informed.package		[Selzler]
application/vnd.smaf		[Takahashi]
application/vnd.sss-cod		[Dani]
application/vnd.sss-dtf		[Bruno]
application/vnd.sss-ntf		[Bruno]
application/vnd.street-stream		[Levitt]
application/vnd.svd		[Becker]
application/vnd.swiftview-ics		[Widener]
application/vnd.triscape.mxs		[Simonoff]
application/vnd.trueapp		[Hepler]
application/vnd.truedoc		[Chase]
application/vnd.ufdl		[Manning]
application/vnd.uplanet.alert		[Martin]
application/vnd.uplanet.alert-wbxml		[Martin]
application/vnd.uplanet.bearer-choice		[Martin]
application/vnd.uplanet.bearer-choice-wbxml		[Martin]
application/vnd.uplanet.cacheop		[Martin]
application/vnd.uplanet.cacheop-wbxml		[Martin]
application/vnd.uplanet.channel		[Martin]
application/vnd.uplanet.channel-wbxml		[Martin]
application/vnd.uplanet.list		[Martin]
application/vnd.uplanet.list-wbxml		[Martin]
application/vnd.uplanet.listcmd		[Martin]
application/vnd.uplanet.listcmd-wbxml		[Martin]
application/vnd.uplanet.signal		[Martin]
application/vnd.vcx		[T.Sugimoto]
application/vnd.vectorworks		[Pharr]
application/vnd.vidsoft.vidconference		[Hess]
application/vnd.visio		[Sandal]
application/vnd.visionary		[Aravindakumar]
application/vnd.vividence.scriptfile		[Risher]
application/vnd.vsf		[Rowe]
application/vnd.wap.sic		[WAP-Forum]
application/vnd.wap.slc		[WAP-Forum]
application/vnd.wap.wbxml		[Stark]
application/vnd.wap.wmlc		[Stark]
application/vnd.wap.wmlscriptc		[Stark]
application/vnd.webturbo		[Rehem]
application/vnd.wrq-hp3000-labelled		[Bartram]
application/vnd.wt.stf		[Wohler]
application/vnd.wv.csp+wbxml		[Salmi]
application/vnd.xara		[Matthewman]
application/vnd.xfdl		[Manning]
application/vnd.yellowriver-custom-menu		[Yellow]
application/whoispp-query		[RFC2957]
application/whoispp-response		[RFC2958]
application/wita		[Campbell]
application/wordperfect5.1		[Lindner]
application/x400-bp		[RFC1494]
application/xhtml+xml		[RFC3236]
application/xml		[RFC3023]
application/xml-dtd		[RFC3023]
application/xml-external-parsed-entity		[RFC3023]
application/zip		[Lindner]
audio/32kadpcm		[RFC2421,RFC2422]
audio/AMR		[RFC3267]
audio/AMR-WB		[RFC3267]
audio/CN		[RFC3389]
audio/DAT12		[RFC3190]
audio/DVI4
audio/EVRC		[RFC-ietf-avt-evrc-smv-03.txt]
audio/EVRC0		[RFC-ietf-avt-evrc-smv-03.txt]
audio/G.722.1		[RFC3047]
audio/G722
audio/G723
audio/G726-16
audio/G726-24
audio/G726-32
audio/G726-40
audio/G728
audio/G729
audio/G729D
audio/G729E
audio/GSM
audio/GSM-EFR
audio/L16		[RFC2586]
audio/L20		[RFC3190]
audio/L24		[RFC3190]
audio/L8
audio/LPC
audio/MP4A-LATM		[RFC3016]
audio/MPA
audio/PCMA
audio/PCMU
audio/QCELP
audio/RED
audio/SMV		[RFC-ietf-avt-evrc-smv-03.txt]
audio/SMV0		[RFC-ietf-avt-evrc-smv-03.txt]
audio/VDVI
audio/basic		[RFC2045,RFC2046]
audio/mpa-robust		[RFC3119]
audio/mpeg		[RFC3003]
audio/parityfec		[RFC3009]
audio/prs.sid		[Walleij]
audio/telephone-event		[RFC2833]
audio/tone		[RFC2833]
audio/vnd.3gpp.iufp		[Belling]
audio/vnd.cisco.nse		[Kumar]
audio/vnd.cns.anp1		[McLaughlin]
audio/vnd.cns.inf1		[McLaughlin]
audio/vnd.digital-winds		[Strazds]
audio/vnd.everad.plj		[Cicelsky]
audio/vnd.lucent.voice		[Vaudreuil]
audio/vnd.nortel.vbk		[Parsons]
audio/vnd.nuera.ecelp4800		[Fox]
audio/vnd.nuera.ecelp7470		[Fox]
audio/vnd.nuera.ecelp9600		[Fox]
audio/vnd.octel.sbc		[Vaudreuil]
audio/vnd.qcelp		[Lundblade]
audio/vnd.rhetorex.32kadpcm		[Vaudreuil]
audio/vnd.vmx.cvsd		[Vaudreuil]
image/cgm		Computer Graphics Metafile
image/g3fax		[RFC1494]
image/gif		[RFC2045,RFC2046]
image/ief		[RFC1314] Image Exchange Format
image/jpeg		[RFC2045,RFC2046]
image/naplps		[Ferber]
image/png		[Randers-Pehrson]
image/prs.btif		[Simon]
image/prs.pti		[Laun]
image/t38		[RFC3362]
image/tiff		[RFC3302] Tag Image File Format
image/tiff-fx		[RFC3250] Tag Image File Format Fax eXtended
image/vnd.cns.inf2		[McLaughlin]
image/vnd.djvu		[Bottou]
image/vnd.dwg		[Moline]
image/vnd.dxf		[Moline]
image/vnd.fastbidsheet		[Becker]
image/vnd.fpx		[Spencer]
image/vnd.fst		[Fuldseth]
image/vnd.fujixerox.edmics-mmr		[Onda]
image/vnd.fujixerox.edmics-rlc		[Onda]
image/vnd.globalgraphics.pgb		[Bailey]
image/vnd.mix		[Reddy]
image/vnd.ms-modi		[Vaughan]
image/vnd.net-fpx		[Spencer]
image/vnd.svf		[Moline]
image/vnd.wap.wbmp		[Stark]
image/vnd.xiff		[S.Martin]
message/delivery-status		[RFC1894]
message/disposition-notification		[RFC2298]
message/external-body		[RFC2045,RFC2046]
message/http		[RFC2616]
message/news		[RFC 1036, H.Spencer]
message/partial		[RFC2045,RFC2046]
message/rfc822		[RFC2045,RFC2046]
message/s-http		[RFC2660]
message/sip		[RFC3261]
message/sipfrag		[RFC3420]
model/iges		[Parks]
model/mesh		[RFC2077]
model/vnd.dwf		[Pratt]
model/vnd.flatland.3dml		[Powers]
model/vnd.gdl		[Babits]
model/vnd.gs-gdl		[Babits]
model/vnd.gtw		[Ozaki]
model/vnd.mts		[Rabinovitch]
model/vnd.parasolid.transmit.binary		[Parasolid]
model/vnd.parasolid.transmit.text		[Parasolid]
model/vnd.vtu		[Rabinovitch]
model/vrml		[RFC2077]
multipart/alternative		[RFC2045,RFC2046]
multipart/appledouble		[Faltstrom]
multipart/byteranges		[RFC2068]
multipart/digest		[RFC2045,RFC2046]
multipart/encrypted		[RFC1847]
multipart/form-data		[RFC2388]
multipart/header-set		[Crocker]
multipart/mixed		[RFC2045,RFC2046]
multipart/parallel		[RFC2045,RFC2046]
multipart/related		[RFC2387]
multipart/report		[RFC1892]
multipart/signed		[RFC1847]
multipart/voice-message		[RFC2421,RFC2423]
text/calendar		[RFC2445]
text/css		[RFC2318]
text/directory		[RFC2425]
text/enriched		[RFC1896]
text/html		[RFC2854]
text/parityfec		[RFC3009]
text/plain		[RFC2646,RFC2046]
text/prs.lines.tag		[Lines]
text/rfc822-headers		[RFC1892]
text/richtext		[RFC2045,RFC2046]
text/rtf		[Lindner]
text/sgml		[RFC1874]
text/t140		[RFC2793]
text/tab-separated-values		[Lindner]
text/uri-list		[RFC2483]
text/vnd.DMClientScript		[Bradley]
text/vnd.IPTC.NITF		[IPTC]
text/vnd.IPTC.NewsML		[IPTC]
text/vnd.abc		[Allen]
text/vnd.curl		[Byrnes]
text/vnd.fly		[Gurney]
text/vnd.fmi.flexstor		[Hurtta]
text/vnd.in3d.3dml		[Powers]
text/vnd.in3d.spot		[Powers]
text/vnd.latex-z		[Lubos]
text/vnd.motorola.reflex		[Patton]
text/vnd.ms-mediapackage		[Nelson]
text/vnd.net2phone.commcenter.command		[Xie]
text/vnd.sun.j2me.app-descriptor		[G.Adams]
text/vnd.wap.si		[WAP-Forum]
text/vnd.wap.sl		[WAP-Forum]
text/vnd.wap.wml		[Stark]
text/vnd.wap.wmlscript		[Stark]
text/xml		[RFC3023]
text/xml-external-parsed-entity		[RFC3023]
video/BMPEG
video/BT656
video/CelB
video/DV		[RFC3189]
video/H261
video/H263
video/H263-1998
video/H263-2000
video/JPEG
video/MP1S
video/MP2P
video/MP2T
video/MP4V-ES		[RFC3016]
video/MPV
video/SMPTE292M		[RFC-avt-smpte292-video-08.txt]
video/mpeg		[RFC2045,RFC2046]
video/nv
video/parityfec		[RFC3009]
video/pointer		[RFC2862]
video/quicktime		[Lindner]
video/vnd.fvt		[Fuldseth]
video/vnd.motorola.video		[McGinty]
video/vnd.motorola.videop		[McGinty]
video/vnd.mpegurl		[Recktenwald]
video/vnd.nokia.interleaved-multimedia		[Kangaslampi]
video/vnd.objectvideo		[Clark]
video/vnd.vivo		[Wolfe]

12	PCMParmType	Lines: 676
Used to identify whether a PCM parameter is part of the wafer acceptance test (WAT) or customer specific parameter (CSP) list. The WAT and CSP list is negotiated between the customer and the foundry for a given technology.
Entity Instances
CSP		Customer Specific Parameter.
PSR		Product Specification Limit.
WAT		Wafer Acceptance Test.
WLR		Wafer Level Reliability.

13	SortWeight	Lines: 231
A relative representation of yield for a device or module.
Entity Instances
0		Bad.
100		All Good.
25		1/4 Good.
50		1/2 Good.
75		3/4 Good.

14	Status	Lines: 361 484 600
Describes the Status result for a vector test.
Entity Instances
ATH		H=actual H.
EHD		expect H D=actual Z.
EHF		expect H F=actual L.
ELB		expected L B=actual H.
ELE		expect L E=actual L.
EUA		expected unknown A=actual H.
EUL		expect unknown L=actual L.
EUZ		expect unknown Z=actual Z.
EZC		expect Z C=actual Z.
EZZ		expect Z.

15	TestResult	Lines: 353 367 374 382 476 490 497 505 592 606 613 621
Describes the test result for a parametric test.
Entity Instances
FAL		Failed.
FCS		Failed Censor.
FHL		Failed High Limit.
FLL		Failed Low Limit.
PAS		Passed.
SCV		Screened Valued.

16	UnitOfMeasure	Lines: 285 399 522 638 675
Code identifying a product unit of measure.
Entity Instances
10P		10-pack.
1BF		100 Board Feet.
1FC		20 Foot Container.
1GR		Gram/Cubic Centimeter.
1GT		10,000 Gallon Tankcar.
1KB		25 Kilogram Bulk Bag.
1KD		10 Kilogram Drum.
1KP		1000-pack.
1M2		1/Square Meter (1/M2).
1PA		20-Pack.
1PB		50 Pound Bag.
1PD		100 Pound Drum.
1PM		1/minute (1/min).
22S		Square Millimeter/Second (mm2/s).
2FC		40 Foot Container.
2GR		Gram/square meter.
2GT		20,000 Gallon Tankcar.
2KB		300 Kilogram Bulk Bag.
2KD		15 Kilogram Drum.
2PA		100-Pack.
3GR		Grams Per 100 Centimeters.
3KB		500 Kilogram Bulk Bag.
3KD		55 Gallon Drum.
3MH		Cubic Millimeters/Hour (mm3/hour).
4GR		Grams Per 100 Grams.
4KD		115 Kilogram Drum.
50P		50-pack.
5GR		Grams Per Cubic Centimeter.
6GR		Grams Per Square Centimeter.
7GR		Grams Per Square Meter.
ABC		Absorbance per centimeter (Absorbance per cm).
ABU		Absorbance per Unit (absorbance per unit).
ACC		Atoms per Cubic Centimeters (atoms per cu cm).
ACR		Acre.
ACS		Acidic strength/concentration.
ACT		Actual Pounds.
ACU		Activity unit (Activ.unit).
ALU		Aluminum Pounds Only.
AM1		Ampoule.
AMN		Ångstroms/Minute (Ångst/min).
AMP		Ampere.
ANG		Angstrom (A).
APB		Atomic Parts per Billion (atomic ppb).
APG		API Specific Gravity (API Grav).
APM		Atomic Parts per Million (atomic ppm).
APT		Atomic Parts per Trillion (atomic ppt).
APU		APHA Units (apha).
ASC		Atoms per Square Centimeters (atoms per sq cm).
ASM		Angstrom.
ASY		Assembly (ASY).
ATG		Atmospheric gauge.
ATM		Atmosphere absolute.
ATP		Atomic %.
ATY		Activity.
BAB		Base Box.
BAC		Batch.
BAE		Bale.
BAG		Bag.
BAL		Ball.
BAN		Band.
BAP		Batting Pound.
BAR		Bar.
BAS		Basket.
BAT		Batt.
BAW		Base Weight.
BEA		Beam.
BEC		Becquerel/kilogram.
BEL		Belt.
BHP		Brake HP.
BIL		Billet.
BIN		Bin.
BIT		Bit.
BKC		Bulk Car Load.
BLN		Balance.
BLO		Block.
BOA		Board.
BOF		Board Feet.
BOL		Bolt.
BOT		Bottle.
BOX		Box.
BRB		Bar absolute.
BRD		Barrels Per Day.
BRE		Barrel.
BRI		Barrel (Imperial).
BRM		Barrels Per Minute.
BTF		British Thermal Units (BTUs) Per Cubic Foot.
BTP		British Thermal Units (BTUs) Per Pound.
BTU		British Thermal Unit (BTU).
BUB		Bubbler.
BUC		Bucket.
BUD		Bushel, Dry Imperial.
BUK		Bunks.
BUL		Bulk.
BUN		Bundle.
BUP		Bulk Pack.
BUS		Bushel.
BYT		Bytes.
C0W		Counts per Wafer (Counts/wf).
C3M		Cubic centimeter per minute (cm3/minute).
CAA		Carat.
CAB		Carboy.
CAC		Card.
CAD		Candela.
CAG		Cartridge.
CAK		Cask.
CAL		Calorie.
CAN		Can.
CAO		Carload.
CAR		Car.
CAS		Case.
CAT		Canister.
CAW		Catchweight.
CC2		Centipoises per hour per square centimeters (cps per hr per sq cm).
CCC		Counts per Square Centimeters (Counts/cm2).
CD3		Cubic decimeter (Cubic dec).
CEL		Cell.
CEM		Centimeter.
CEP		Centipoises (CPS).
CET		Centiliter.
CGM		Centigram.
CHA		Chains (Land Survey).
CHE		Chest.
CM2		Square centimeter (cm2).
CMH		Centimeter/hour (cm/h).
CML		Colony/Milliliter (col/ml).
CMS		Centimeter/Second (cm/s).
CNN		Connector.
COG		Coil Group.
COI		Coil.
COL		Coulomb.
COM		Composite Product Pounds (Total Weight).
CON		Cone.
COT		Container.
COV		Cover.
CRA		Crate.
CRT		Carton.
CSE		Cassette.
CST		Centistokes.
CUB		Cubic centimeter.
CUC		Cubic centimeter/second.
CUF		Cubic Foot.
CUI		Cubic inch.
CUM		Cubic meter.
CUP		Cup.
CUY		Cubic yard.
CYC		Cycles.
CYL		Cylinder.
DAL		Dalton units (dalton).
DAY		Day.
DCB		Decibels.
DCG		Decagram.
DCL		Deciliter.
DCM		Defects per Square Centimeters (Defects/cm2).
DE1		Defects.
DE2		Degrees in Angles.
DE3		Degree.
DEA		Deal.
DEC		Decimeter.
DEF		Degree Fahrenheit.
DEG		Degree Celsius.
DEP		Dep. Factor.
DFW		Defects per Wafer (Defects/Wafer).
DGM		Decigram.
DIE		Die.
DIL		Display.
DIP		Dispenser.
DNC		Dynes per centimeter (Dynes per cm).
DOZ		Dozen.
DPM		Parts per Million per Day (ppm per day).
DRA		Dram.
DRU		Drum.
DRY		Dry Pounds.
EAC		Each.
ELE		Electrical Capacitance.
EML		Enzyme Units/Milliliter (Enzyme/ml).
ENU		Enzyme Units (Enzy.Units).
EQ2		Milliequivalent per 30 Kg (mequ/30Kg).
EQG		Milliequivalent per gram (milliequivalent per g).
EQK		Milliequivalent per Kilogram (mequ/Kg).
EQM		Milliequivalent per Millimeter (milliequivalent per mm).
FAR		Farads.
FFA		Femtofarad.
FIN		1/32 inch.
FLO		Fluid Ounce.
FOI		Fluid Ounce (Imperial).
FOO		Foot.
FOU		Fluid Ounce US.
FPS		Feet per second (Feet/s).
FRH		Sales FT3 at 60°F per hour (FTR/hour).
FRM		Sales FT3 at 60°F per minute (FTR/min).
FTR		Sales FT3 at 60°F, 14.7 psia (SFT3_60F_S).
FTS		Sales FT3 at 70°F, 14.7 psia (SFT3_70F_S).
FTT		1000 FT3 at 60°F, 14.7 psia (KFT3_60F_S).
FTU		1000 FT3 at 70°F, 14.7 psia (KFT3_70F_S).
FUU		Fuel Usage (Gallons).
G2S		Gram square per second (g²/s).
GAI		Gram act. ingrd. (g act.ing).
GAL		Gallon.
GAS		Gage Systems.
GAU		Gram Gold.
GCL		Gardner Color.
GEG		Keim/Gramm (keim/g).
GEQ		Gram per Equivalent (g/Eq).
GGM		Gram per gram mole (g/gmole).
GHG		Gram per Hectogram (g/hg).
GIH		Gigahertz.
GIJ		Gigajoules.
GIL		Gill (Imperial).
GM4		Gram per 100 Milliliters (g/100ml).
GME		Gram per Mole Equivalent (g/mole Eq).
GMO		Gram per Mol (g/mol).
GNL		Gram act.Ingrd per Liter (gai/liter).
GOB		Gross Barrels.
GOG		Gross Gallons.
GOH		Gigaohm (GOhm).
GOK		Gross Kilogram.
GOT		Gross Ton.
GOY		Gross Yard.
GPN		US Gallon per minute (gpm US).
GRA		Gram.
GRG		Great Gross (Dozen Gross).
GRK		Grams Per Kilogram.
GRL		Grams Per Liter.
GRM		Grams Per Milliliter.
GRN		Grain.
GRO		Gross.
GRP		Group.
HAG		Half Gallon.
HAH		Half Hour.
HAL		Half Liter.
HAN		Hank.
HEA		Heat lots.
HEC		Hectare.
HEL		Hectoliter.
HEP		Hectopascal.
HER		Hertz.
HGM		Hegman.
HNY		Henry.
HOS		Hours.
HOU		Hour.
HUA		Hundredth of a Carat.
HUB		Hundred Boxes.
HUC		Hundred Count.
HUS		Hundred Sheets.
HZM		Hertz per Minute (Hertz per min).
IH2		Inches of Water Gauge (inH2O-g).
IHG		Inches of Mercury Gauge (inHg-g).
ILB		Inch pounds (in.lb).
IMG		Imperial Gallons.
INC		Inch.
IPS		Inch per second (inch / sec).
JAR		Jar.
JKG		Joule/Kilogram (J/kg).
JMO		Joule/Mol (J/mol).
JOI		Joint.
JOU		Joule.
KAI		Kilogram act. Ingrd. (kg ac.ing.).
KAK		kg act.ingrd. / kg (kai/kg).
KBY		Kilobyte.
KCM		Kilogram per cm2 gauge (kg/cm2-g).
KD3		Kilogram per Cubic Decimeter (kg/dm3).
KEG		Keg.
KEL		Kelvin.
KGE		Container Fill Weight in Kg/Ea.
KGH		Kilogram per Hour (kg/h).
KGL		Kilograms per Liter (kg/L).
KGM		Kilogram/Mol (kg/mol).
KGS		Kilogram per Second (kg/s).
KHO		Kilometer/hour.
KIC		Kilogram per cubic meter.
KIE		Kilometer.
KIG		Kilogram.
KIH		Kilohertz.
KIK		Kilobecquerel/Kilogram.
KIL		Kiloampere.
KIM		Kilogram/square meter.
KIO		Kiloohm.
KIS		Kilogramm pro Sekunde.
KIT		Kit.
KIV		Kilovolt.
KIW		Kilowatt.
KJK		Kilojoule per kilogram (KJ/kg).
KJL		Kilojoule.
KJM		Kilojoule/Mol (KJ/mol).
KKG		Kilogram/Kilogram.
KMK		Cubic meter/Cubic meter (m3/m3).
KMN		Kelvin per Minute (K/min).
KMS		Kelvin per Second (K/s).
KNM		Kilonewton per square meter (kN/m2).
KNT		Kilonewton (ND).
KPA		Kilopascal (kPa).
KRU		Kreb Unit.
KTN		Kilotonne (kt).
KUD		Kubikdezimeter.
KUM		Kubikmeter pro Sekunde.
KVA		Kilovoltampere (kVA).
KWH		Kilowatt-hour.
KWR		Kilovolt ampere reactive hours (KVAH reac.).
LBH		US Pound per Hour (lb/hour).
LBM		US Pound per minute (lb/min).
LG2		Liter per Gram per Centimeter (l/g/cm).
LGC		Liters per Gram-Centimeters (l/g-cm).
LHK		Liter per 100 km (l/100 km).
LIF		Lifts.
LIM		Link.
LIQ		Liquid Pounds.
LIT		Liter.
LMI		Liter per Minute (l/min).
LMS		Liter per Molsecond (l/mol.s).
LOA		Load.
LOT		Lot.
LPD		Light Point Defects per Wafer (LPD/Wafer).
LPH		Liter per hour (l/hr).
LUG		Lug.
M15		Micron per 15 Square Millimeters (mu per 15 sq mm).
M20		Micron per 20 Square Millimeters (mu per 20 sq mm).
M25		Micron per 25 Square Millimeters (mu per 25 sq mm).
M26		Micron per 26 by 8 Millimeters (mu per 26 by 8 mm).
M2G		Meters square per gram (m sq per gram).
M3A		Sales m3 at 15 °C, 1 atmos (Sm3_15C_S).
M3B		Sales m3 at 21 °C, 1 atmos (Sm3_21C_S).
M3C		Sales m3 at 10 °C, 1 atmos (Sm3_10C_S).
M3D		Sales m3 at 43 °C, 1 bar (Sm3_43C_D).
M3E		Sales m3 at 9 °C, 1 bar (Sm3_9C_D).
M3F		Sales m3 at 15 °C, 1 bar (Sm3_15C_D).
M3G		Sales m3 at 27 °C, 1 atmos (Sm3_27C_S).
M3H		Cubic Meter per Hour (m3/h).
M3J		Sales m3 at 35 °C, 1 atmos (Sm3_35C_S).
M3K		Cubic Meter/Kilogram (m3/Kg).
M3M		Milliliter per Cubic Meter (ml/m3).
M3N		Mol per Cubic Meter (Mol/m3).
MAM		Milliamps/mm.
MAT		Mat.
MBY		Megabyte.
MBZ		Meterbar per Second (m.bar/s).
MC2		Millisecond per Centimeter (mS/cm).
MCA		Microampere (µA).
MCG		Microgram.
MCH		Micromhos (µmhos).
MCK		Microcuries per Kilogram (µci/kg).
MCL		Microcuries per Gaseous Liter (µc/l).
MCM		Milligrams Per Cubic Meter.
MCN		Metal Can.
MCP		Manifolded Cylinder Pack.
MCR		Micron.
MEG		Megagram.
MEH		Megahertz.
MEJ		Megajoule (MJ).
MEP		Megapascal.
MET		Meter.
MEW		Megawatt.
MFD		Microfarad (µF).
MGA		Milligram per Amp (mg per amp).
MGF		Milligram per Square Centimeter (mg/cm2).
MGG		Milligram per Gram (mg/g).
MGL		Microgram per Liter (µg/l).
MGM		Milligram.
MGO		Megohm (MOhm).
MGR		Micrograms per Gram (µg/g).
MGS		Milligram per Second (mg per sec).
MH1		Millimeter per Hour (mm/h).
MHC		Micromhos per Centimeter (µmhos/cm).
MHR		Meter per Hour (m/h).
MHV		Megavolt.
MIB		Million BTU's.
MIC		Mikrogram/cubic meter.
MIG		Micrograms Per Cubic Meter.
MIL		Mile.
MIM		Micrometer.
MIN		Minute.
MIP		Millipascal seconds.
MIS		Microsecond.
MIT		Miter.
MIV		Millivolt.
MIW		Milliwatt.
MJM		Wobbe Number (MJ/m3).
MJO		Millijoule.
MKG		Milligrams of KOH per Gram (mg KOH per g).
MKL		Millimol per Gram (mmol/g).
ML1		Milliliter per Liter (ml/l).
ML2		Milliliter per Liter (ml/l).
ML3		Mol per Liter (Mol/Liter).
ML4		Millimol per Liter (Millimol/l).
MLA		Milliampere.
MLB		Millibar.
MLC		Milligram/cubic meter.
MLG		Milliliter per Gallon (ml per gal).
MLI		Milliliter.
MLK		Milligram/kilogram.
MLL		Milligram/Liter.
MLM		Mole per Mole (mole/mole).
MLP		Mole Percent (% mole).
MLR		Microliter (µl).
MLS		Miles.
MLW		Milliliter act. Ingr. (ml act.in.).
MM3		Cubic Millimeter (mm3).
MMA		Millimeter per Year (mm/a).
MME		Millimeter.
MMG		Millimol/gram (mmol/g).
MMH		Millimeter H20.
MMK		Millimol/kilogram.
MMM		0.000001 meter (1 millionth of a meter). (Micrometer/Micron).
MMN		Meter per Minute (m/min).
MMO		Millimol.
MMS		Millimeter per Second (mm/s).
MNM		Millinewton per meter (mN/m).
MNT		Meganewton (MN).
MOK		Mol/kilogram.
MOL		Mol.
MON		Month.
MPB		Mass parts per billion (ppb(m)).
MPG		Miles per Gallon (US) (Mi/Gal(US)).
MPH		Megagrams Per Hour.
MPM		Mass Parts per Million (ppm(m)).
MPT		Mass Parts per Trillion (ppt(m)).
MPZ		Meterpascal per Second (m.Pa/s).
MQG		Mircoequivalent per Gram (microeq/g).
MRF		Millifarad (mF).
MS1		MilliSiemen per Centimeter (mS/cm).
MS2		Meter per Second Squared (m/s2).
MS3		Microsiemens per Centimeter (µS/cm).
MSC		Millisecond.
MSM		Milligrams Per Square Meter.
MTA		Millitesla.
MTQ		Meter pro Quadratsekunde.
MTR		Meter (m).
MTS		Meters per second.
MUL		Multichip - When 2 or more dies (chips) are merged into one package.
MVA		Megavoltampere (MVA).
MVS		Millivolts.
MVT		Millivolt.
MWH		Megawatt Hours (mwh).
MWR		Megavolt Ampere Reactive Hours (MVAH reac.).
MWT		Molecular Weight (mW).
MYS		Micro Siemens (mic. Siem.).
N2M		Newton/Square millimeter (N/mm2).
NAA		Nanoamps.
NAM		Nanometer.
NAS		Nanosecond.
NEB		Net Barrels.
NEG		Net Gallons.
NEI		Net Imperial Gallons.
NEL		Net Liters.
NEW		Newton.
NM2		Newton per Square Meter (N/m²).
NM3		Normal m3 at 0°C, 1 atmos (Normal m3).
NMH		Newton per Hour (N/h).
NMM		Newton per Millimeter (N/mm).
NMR		Normal m3 per Hour (Nm3/h).
NOL		Normality.
NPK		Nowpac Container (Nowpac).
NRG		Bar Gauge.
NRU		Nanofarad (nF).
NTU		Nephelometric Turbidity Units (NTU).
NTY		Equivalents per Liter (equ/l).
NUM		Numbers.
NWM		Newton per Meter (N/m).
NXM		Newton per 25 mm (N/25mm).
O2P		Percent Oxygen (% Oxygen).
OCT		Ohm/ct.
OHC		Ohm-Centimeter (ohm cm).
OHM		Ohm.
OMM		Ohm/mm.
ONE		One.
OPH		Operating hour (Oper. Hour).
OSQ		Ohm/sq.
OTP		One Thousand Pieces.
OUN		Ounce.
OVI		Ohm/via.
OZG		Ounce per Gallon (oz per gal).
PAC		Parcel.
PAD		Pad.
PAG		Package.
PAI		Pail.
PAK		Pack (PAK).
PAL		Pallet.
PAN		Panel.
PAR		Pair.
PAS		Pascal.
PAT		Packet.
PBA		PPBA Silicon (ppba Si).
PBW		Parts Per Billion by Weight (ppbw).
PC2		Parts per Square Centimeters (part per sq cm).
PCA		Percent Active (% Active).
PCL		Picocuries per Liter (pCi/l).
PEC		Percent.
PEG		Percentage.
PEH		Percent Per 1000 Hours.
PEN		Pennyweight.
PER		Per Hundred Pieces.
PEW		Percent Weight.
PF3		Per Cubic Foot (per cu ft).
PF4		Particles per Cubic Feet (particles per cu ft).
PFA		Percent Failed Area (Failed Area %).
PFR		Picofarad.
PH		PH Factor (pH).
PI2		Parts per Square Inch (part per sq in).
PID		Pint U.S. Dry.
PIE		Piece.
PIL		Pint - US liquid.
PL1		Parts per Liter (parts per l).
PL2		Parts per Milliliter (parts per ml).
PL3		Part per Millilitre (Part/ml).
PLA		Plate.
PLI		Pounds per Linear Inch (lb/Lin. In).
PLL		Pallet (Lift).
PLR		Per Liter.
PLT		Palette.
PLU		Pallet/Unit Load.
PMA		Percent Mass (%(m)).
PMI		Per Mille (%0).
PML		Particles per Milliliter (particles/mL).
PMO		Per Mille mass (%0(mass)).
PMP		Parts Per Million Platinum (ppm Pt).
PMV		Parts Per Million (weight/Vol) (ppm (w/v)).
PMW		Parts Per Million by Weight (ppmw).
PNJ		Particles per Injection (particles per inj).
PNT		Points.
POF		Pounds Per Foot.
POG		Pounds Per Gallon.
PON		Pound.
POP		Pounds Per Piece of Product.
POR		Pores.
POS		Pounds Per 1000 Square Feet.
POT		Pounds Per Thousand.
PP3		Parts per Million mole (ppm mole).
PP4		Parts per Billion Mole (ppb mole).
PPB		Parts per billion (US).
PPF		Parts per Ft3 (Parts/Ft3).
PPH		Parts Per Hundred (pph).
PPM		Parts per million.
PPP		Pounds Per Pound of Product.
PPT		Parts per Trillion (ppt).
PRS		Number of Persons.
PSA		Pounds per Square Inch Absolute.
PSC		Picosecond.
PSG		Pound per Square Inch Gauge (psi gauge).
PSI		PSI Unit (PSI).
PSS		Pascal second.
PSV		Poise.
PTL		Particles per Liter (Part/Liter).
PWF		Particles per Wafer (particles/wf).
QML		Kilomol (kmol).
QUA		Quart - US liquid.
RAC		Rack.
REA		Ream of 500 Sheets.
REE		Reel.
RIN		Ring.
RLU		Relative Light Unit (RLU).
ROD		Rod.
ROL		Roll.
RPM		Revolutions per Minute (Revs/min).
SAC		Sack.
SBB		Super Bulk Bag.
SCL		Scales.
SEC		Second.
SET		Set.
SHE		Sheet.
SHI		Shipment.
SHM		Sheet - Metric measure.
SHO		Shot.
SID		Disk (Disc).
SIE		Siemens per Meter (Siemens/m).
SKE		Skein.
SKI		Skid.
SLE		Sleeve.
SLI		Slip Sheet.
SMI		Square mile.
SMM		Square millimeter.
SPO		Spool.
SQF		Square foot.
SQI		Square inch.
SQK		Square kilometer.
SQM		Square meter.
SQS		Square meter/second.
SQU		Square.
SQY		Square Yard.
STI		Stick.
STM		Statute Mile.
STP		Steps.
STR		Strip.
STU		Stabilizer Units (SU).
SVU		Say Bolt Viscosity Units (SVU).
TAB		Tablet.
TAN		Tank.
TAR		Target pieces (target).
TAT		Tank Truck.
TES		Tesla.
THO		Thousand.
TM3		1/Cubic Meter (1/m3).
TNN		Tonne.
TOM		Ton per Cubic Meter (t/m3).
TON		Ton.
TOR		Torr.
TOT		Tote.
TPT		Pass Test (Pass).
TRA		Train.
TRF		Track Foot.
TRL		Trailer.
TRO		Troy.
TRU		Truckload.
TRY		Tray.
TRZ		Troy OZ.
TUB		Tube.
ULU		Unitless Unit of Measure.
UNT		Unit.
USG		US gallon.
USP		US pound.
UST		US ton.
VAL		VO mat. (Value).
VAP		Voltampere (VA).
VHN		Vickers Micro-Hardness (VHN10).
VIA		Vial.
VMP		Molar %.
VOL		Volt.
VPB		Volume Parts per Billion (ppb(V)).
VPC		Percent Volume (%(V)).
VPM		Volume Parts per Million (ppm(V)).
VPR		Per Mille Volume (%O(V)).
VPT		Volume parts per Trillion (ppt(V)).
VTA		Volts (Alternating Current).
VTD		Volts (Direct Current).
VTM		Volts Per Meter.
WAF		Wafer.
WAR		Watt.
WEE		Week.
WPT		Parts Per Trillion by Weight (pptw).
WRA		Wrap.
YAR		Yard.
YEA		Year.

Data Types

No	Name	Format	Data Type
1	BusinessProcessIdentifier	pattern = [0-9a-zA-Z]{1,12}	string
2	Contact		string
3	DUNSPlus4	pattern = [0-9]{9}[0-9a-zA-Z]{1,4}	string
4	DUNS	pattern = [0-9]{9}	string
5	GLN	pattern = [0-9]{13}	string
6	GTIN	pattern = [0-9]{14}	string
7	Hexadecimal	pattern = [0-9a-fA-F]{1,}	string
8	PercentAmount	totalDigits = 6	decimal
9	PipIdentifier	pattern = PIP\d{1}[A-Z]{1}\d{1,2}	string
10	PipVersion	pattern = \d{2}\.\d{2}\.\d{2}	string
11	VersionIdentifier	pattern = \d{2}\.\d{2}	string