RosettaNet XML Message Guidelines
SemiconductorProcessDataNotification
( 05 Dec 2007 11:16:54 )
This document has been prepared by RosettaNet (http://www.rosettanet.org) from requirements gathered during the cluster/segment workshops and in conformance with the RosettaNet methodology.

11SemiconductorProcessDataNotification
20..1|-- DocumentHeader
30..1|   |-- CorrelationInformation
40..1|   |   |-- ContractInformation
50..1|   |   |   |-- ContractIdentifier
60..1|   |   |   |-- ContractType
70..1|   |   |-- RequestingDocumentInformation
80..1|   |   |   |-- BusinessProcessInstanceIdentifier
90..1|   |   |   |-- RequestingDocumentCreationDateTime
101|   |   |   |-- RequestingDocumentInstanceIdentifier
110..1|   |   |   |-- ResponseDateTime
121|   |-- DocumentInformation
131|   |   |-- Creation
141|   |   |-- DocumentIdentification
151|   |   |   |-- Identifier
160..1|   |   |   |-- Type
171|   |   |   |-- Choice
181|   |   |   |   |-- StandardDocumentIdentification
190..1|   |   |   |   |   |-- Standard
201|   |   |   |   |   |-- Version
211|   |   |   |   |-- TpirPipIdentification
220..1|   |   |   |   |   |-- FileType
231|   |   |   |   |   |-- PartnerId
241|   |   |   |   |   |-- PipIdentifier
251|   |   |   |   |   |-- PipVersion
260..1|   |   |   |   |   |-- TpirBusinessProcessIdentifier
271|   |   |   |   |   |-- TpirPipVersion
280..1|   |   |   |   |   |-- Uri
290..1|   |   |-- DocumentManifest
301..n|   |   |   |-- ManifestItem
310..1|   |   |   |   |-- Description
320..1|   |   |   |   |-- Language
330..1|   |   |   |   |-- Length
341|   |   |   |   |-- MimeTypeQualifier
351|   |   |   |   |-- UniversalResourceIdentifier
360..1|   |   |   |-- MultipleType
371|   |   |   |-- NumberOfItems
380..1|   |   |-- DocumentSecurity
391|   |   |   |-- NonRepudiableReceipt
401|   |   |   |-- PersistentEncryption
411|   |   |   |-- PersistentSignature
420..1|   |-- HeaderVersion
431|   |-- Receiver
440..1|   |   |-- BusinessServiceInformation
451|   |   |   |-- ActionName
461|   |   |   |-- ProcessIdentifier
470..1|   |   |   |-- ProcessReference
480..1|   |   |   |-- ProcessState
491|   |   |   |-- ServiceName
500..n|   |   |-- ContactInformation
511|   |   |   |-- Contact
520..1|   |   |   |-- Email
530..1|   |   |   |-- Fax
540..1|   |   |   |-- Identifier
550..1|   |   |   |-- Phone
561|   |   |-- PartnerIdentification
570..1|   |   |   |-- PartnerName
581|   |   |   |-- Choice
591..n|   |   |   |   |-- AlternativeIdentifier
601|   |   |   |   |   |-- Authority
611|   |   |   |   |   |-- Identifier
621|   |   |   |   |-- DUNS
631|   |   |   |   |-- DUNSPlus4
641|   |   |   |   |-- GLN
651|   |-- Sender
660..1|   |   |-- BusinessServiceInformation
671|   |   |   |-- ActionName
681|   |   |   |-- ProcessIdentifier
690..1|   |   |   |-- ProcessReference
700..1|   |   |   |-- ProcessState
711|   |   |   |-- ServiceName
720..n|   |   |-- ContactInformation
731|   |   |   |-- Contact
740..1|   |   |   |-- Email
750..1|   |   |   |-- Fax
760..1|   |   |   |-- Identifier
770..1|   |   |   |-- Phone
781|   |   |-- PartnerIdentification
790..1|   |   |   |-- PartnerName
801|   |   |   |-- Choice
811..n|   |   |   |   |-- AlternativeIdentifier
821|   |   |   |   |   |-- Authority
831|   |   |   |   |   |-- Identifier
841|   |   |   |   |-- DUNS
851|   |   |   |   |-- DUNSPlus4
861|   |   |   |   |-- GLN
871|-- LotReport
880..1|   |-- BALocation
890..1|   |   |-- GlobalWorkInProcessLocationCode
900..1|   |   |-- Location
911|   |   |   |-- Choice
921..n|   |   |   |   |-- AlternativeIdentifier
931|   |   |   |   |   |-- Authority
941|   |   |   |   |   |-- Identifier
951|   |   |   |   |-- DUNS
961|   |   |   |   |-- DUNSPlus4
971|   |   |   |   |-- GLN
980..1|   |   |-- PhysicalAddress
991|   |   |   |-- AddressLine1
1000..1|   |   |   |-- AddressLine2
1010..1|   |   |   |-- AddressLine3
1020..1|   |   |   |-- AddressLine4
1030..1|   |   |   |-- AddressLine5
1041|   |   |   |-- CityName
1051|   |   |   |-- Country
1060..1|   |   |   |-- CountrySubdivision
1070..1|   |   |   |-- PostalCode
1080..1|   |   |   |-- PostOfficeBox
1090..1|   |   |-- ProprietaryLabel
1100..1|   |-- Confidentiality
1110..1|   |-- FabLocation
1120..1|   |   |-- GlobalWorkInProcessLocationCode
1130..1|   |   |-- Location
1141|   |   |   |-- Choice
1151..n|   |   |   |   |-- AlternativeIdentifier
1161|   |   |   |   |   |-- Authority
1171|   |   |   |   |   |-- Identifier
1181|   |   |   |   |-- DUNS
1191|   |   |   |   |-- DUNSPlus4
1201|   |   |   |   |-- GLN
1210..1|   |   |-- PhysicalAddress
1221|   |   |   |-- AddressLine1
1230..1|   |   |   |-- AddressLine2
1240..1|   |   |   |-- AddressLine3
1250..1|   |   |   |-- AddressLine4
1260..1|   |   |   |-- AddressLine5
1271|   |   |   |-- CityName
1281|   |   |   |-- Country
1290..1|   |   |   |-- CountrySubdivision
1300..1|   |   |   |-- PostalCode
1310..1|   |   |   |-- PostOfficeBox
1320..1|   |   |-- ProprietaryLabel
1330..1|   |-- FileDataVersion
1340..1|   |-- GlobalLotStatusCode
1351|   |-- Lot
1360..n|   |   |-- AlternativePN
1370..1|   |   |   |-- ProductName
1380..1|   |   |   |-- Revision
1391|   |   |   |-- Choice
1401..n|   |   |   |   |-- AlternativeIdentifier
1411|   |   |   |   |   |-- Authority
1421|   |   |   |   |   |-- Identifier
1431|   |   |   |   |-- GTIN
1440..n|   |   |-- ContractorLotNumber
1450..1|   |   |   |-- IdSuffix
1460..1|   |   |   |-- ManufacturingID
1470..1|   |   |-- CustomerLotNumber
1480..1|   |   |   |-- IdSuffix
1490..1|   |   |   |-- ManufacturingID
1500..1|   |   |-- CustomerPN
1510..1|   |   |   |-- ProductName
1520..1|   |   |   |-- Revision
1531|   |   |   |-- Choice
1541..n|   |   |   |   |-- AlternativeIdentifier
1551|   |   |   |   |   |-- Authority
1561|   |   |   |   |   |-- Identifier
1571|   |   |   |   |-- GTIN
1580..1|   |   |-- LotType
1590..1|   |   |-- NominalSize
1600..1|   |   |-- ProductName
1610..n|   |   |-- SubLot
1620..1|   |   |   |-- IdSuffix
1630..1|   |   |   |-- ManufacturingID
1640..1|   |   |-- Technology
1650..1|   |-- LotTimeStamp
1660..1|   |   |-- CompletionStatus
1670..1|   |   |-- LotEndDateTime
1680..1|   |   |-- LotStartDateTime
1690..n|   |-- OtherLocation
1700..1|   |   |-- GlobalWorkInProcessLocationCode
1710..1|   |   |-- Location
1721|   |   |   |-- Choice
1731..n|   |   |   |   |-- AlternativeIdentifier
1741|   |   |   |   |   |-- Authority
1751|   |   |   |   |   |-- Identifier
1761|   |   |   |   |-- DUNS
1771|   |   |   |   |-- DUNSPlus4
1781|   |   |   |   |-- GLN
1790..1|   |   |-- PhysicalAddress
1801|   |   |   |-- AddressLine1
1810..1|   |   |   |-- AddressLine2
1820..1|   |   |   |-- AddressLine3
1830..1|   |   |   |-- AddressLine4
1840..1|   |   |   |-- AddressLine5
1851|   |   |   |-- CityName
1861|   |   |   |-- Country
1870..1|   |   |   |-- CountrySubdivision
1880..1|   |   |   |-- PostalCode
1890..1|   |   |   |-- PostOfficeBox
1900..1|   |   |-- ProprietaryLabel
1910..1|   |-- QualityCode
1920..n|   |-- Wafer
1930..1|   |   |-- ProcessRevision
1940..1|   |   |-- ShortID
1951|   |   |-- WaferUniqueID
1960..1|   |-- WaferQuantity
1970..1|   |-- WaferSortLocation
1980..1|   |   |-- GlobalWorkInProcessLocationCode
1990..1|   |   |-- Location
2001|   |   |   |-- Choice
2011..n|   |   |   |   |-- AlternativeIdentifier
2021|   |   |   |   |   |-- Authority
2031|   |   |   |   |   |-- Identifier
2041|   |   |   |   |-- DUNS
2051|   |   |   |   |-- DUNSPlus4
2061|   |   |   |   |-- GLN
2070..1|   |   |-- PhysicalAddress
2081|   |   |   |-- AddressLine1
2090..1|   |   |   |-- AddressLine2
2100..1|   |   |   |-- AddressLine3
2110..1|   |   |   |-- AddressLine4
2120..1|   |   |   |-- AddressLine5
2131|   |   |   |-- CityName
2141|   |   |   |-- Country
2150..1|   |   |   |-- CountrySubdivision
2160..1|   |   |   |-- PostalCode
2170..1|   |   |   |-- PostOfficeBox
2180..1|   |   |-- ProprietaryLabel
2191|   |-- Choice
2201..n|   |   |-- AssemblyProcess
2211|   |   |   |-- AssemblyLotReport
2220..n|   |   |   |   |-- AlternateYield
2230..1|   |   |   |   |-- AssemblyLotID
2240..n|   |   |   |   |-- Calculation
2250..1|   |   |   |   |-- CustomerChipPN
2260..n|   |   |   |   |-- IncomingWaferLotReport
2270..1|   |   |   |   |   |-- CarrierReport
2280..n|   |   |   |   |   |   |-- CarrierID
2290..n|   |   |   |   |   |   |-- CarrierSlot
2300..1|   |   |   |   |   |   |   |-- Position
2310..1|   |   |   |   |   |   |   |-- Wafer
2320..1|   |   |   |   |   |   |   |   |-- ProcessRevision
2330..1|   |   |   |   |   |   |   |   |-- ShortID
2341|   |   |   |   |   |   |   |   |-- WaferUniqueID
2350..1|   |   |   |   |   |   |-- CarrierType
2361|   |   |   |   |   |   |-- Lot
2370..n|   |   |   |   |   |   |   |-- AlternativePN
2380..1|   |   |   |   |   |   |   |   |-- ProductName
2390..1|   |   |   |   |   |   |   |   |-- Revision
2401|   |   |   |   |   |   |   |   |-- Choice
2411..n|   |   |   |   |   |   |   |   |   |-- AlternativeIdentifier
2421|   |   |   |   |   |   |   |   |   |   |-- Authority
2431|   |   |   |   |   |   |   |   |   |   |-- Identifier
2441|   |   |   |   |   |   |   |   |   |-- GTIN
2450..n|   |   |   |   |   |   |   |-- ContractorLotNumber
2460..1|   |   |   |   |   |   |   |   |-- IdSuffix
2470..1|   |   |   |   |   |   |   |   |-- ManufacturingID
2480..1|   |   |   |   |   |   |   |-- CustomerLotNumber
2490..1|   |   |   |   |   |   |   |   |-- IdSuffix
2500..1|   |   |   |   |   |   |   |   |-- ManufacturingID
2510..1|   |   |   |   |   |   |   |-- CustomerPN
2520..1|   |   |   |   |   |   |   |   |-- ProductName
2530..1|   |   |   |   |   |   |   |   |-- Revision
2541|   |   |   |   |   |   |   |   |-- Choice
2551..n|   |   |   |   |   |   |   |   |   |-- AlternativeIdentifier
2561|   |   |   |   |   |   |   |   |   |   |-- Authority
2571|   |   |   |   |   |   |   |   |   |   |-- Identifier
2581|   |   |   |   |   |   |   |   |   |-- GTIN
2590..1|   |   |   |   |   |   |   |-- LotType
2600..1|   |   |   |   |   |   |   |-- NominalSize
2610..1|   |   |   |   |   |   |   |-- ProductName
2620..n|   |   |   |   |   |   |   |-- SubLot
2630..1|   |   |   |   |   |   |   |   |-- IdSuffix
2640..1|   |   |   |   |   |   |   |   |-- ManufacturingID
2650..1|   |   |   |   |   |   |   |-- Technology
2660..1|   |   |   |   |   |   |-- Orientation
2670..1|   |   |   |   |   |   |   |-- Notch
2680..1|   |   |   |   |   |   |   |-- Quadrant
2690..n|   |   |   |   |   |-- Chip
2700..1|   |   |   |   |   |   |-- ChipPN
2710..1|   |   |   |   |   |   |-- CustomerChipPN
2720..1|   |   |   |   |   |   |-- DieReticlePN
2730..1|   |   |   |   |   |   |-- ECIDReport
2740..1|   |   |   |   |   |   |   |-- ComponentNumber
2750..1|   |   |   |   |   |   |   |-- DecodedID
2760..1|   |   |   |   |   |   |   |-- Decoder
2770..1|   |   |   |   |   |   |   |-- ECIDType
2781|   |   |   |   |   |   |   |-- IntCoordinate
2790..1|   |   |   |   |   |   |   |   |-- X
2800..1|   |   |   |   |   |   |   |   |-- Y
2810..1|   |   |   |   |   |   |   |   |-- Z
2820..1|   |   |   |   |   |   |   |-- RawBits
2830..1|   |   |   |   |   |-- FabLocation
2840..1|   |   |   |   |   |   |-- GlobalWorkInProcessLocationCode
2850..1|   |   |   |   |   |   |-- Location
2861|   |   |   |   |   |   |   |-- Choice
2871..n|   |   |   |   |   |   |   |   |-- AlternativeIdentifier
2881|   |   |   |   |   |   |   |   |   |-- Authority
2891|   |   |   |   |   |   |   |   |   |-- Identifier
2901|   |   |   |   |   |   |   |   |-- DUNS
2911|   |   |   |   |   |   |   |   |-- DUNSPlus4
2921|   |   |   |   |   |   |   |   |-- GLN
2930..1|   |   |   |   |   |   |-- PhysicalAddress
2941|   |   |   |   |   |   |   |-- AddressLine1
2950..1|   |   |   |   |   |   |   |-- AddressLine2
2960..1|   |   |   |   |   |   |   |-- AddressLine3
2970..1|   |   |   |   |   |   |   |-- AddressLine4
2980..1|   |   |   |   |   |   |   |-- AddressLine5
2991|   |   |   |   |   |   |   |-- CityName
3001|   |   |   |   |   |   |   |-- Country
3010..1|   |   |   |   |   |   |   |-- CountrySubdivision
3020..1|   |   |   |   |   |   |   |-- PostalCode
3030..1|   |   |   |   |   |   |   |-- PostOfficeBox
3040..1|   |   |   |   |   |   |-- ProprietaryLabel
3050..1|   |   |   |   |   |-- OtherLocation
3060..1|   |   |   |   |   |   |-- GlobalWorkInProcessLocationCode
3070..1|   |   |   |   |   |   |-- Location
3081|   |   |   |   |   |   |   |-- Choice
3091..n|   |   |   |   |   |   |   |   |-- AlternativeIdentifier
3101|   |   |   |   |   |   |   |   |   |-- Authority
3111|   |   |   |   |   |   |   |   |   |-- Identifier
3121|   |   |   |   |   |   |   |   |-- DUNS
3131|   |   |   |   |   |   |   |   |-- DUNSPlus4
3141|   |   |   |   |   |   |   |   |-- GLN
3150..1|   |   |   |   |   |   |-- PhysicalAddress
3161|   |   |   |   |   |   |   |-- AddressLine1
3170..1|   |   |   |   |   |   |   |-- AddressLine2
3180..1|   |   |   |   |   |   |   |-- AddressLine3
3190..1|   |   |   |   |   |   |   |-- AddressLine4
3200..1|   |   |   |   |   |   |   |-- AddressLine5
3211|   |   |   |   |   |   |   |-- CityName
3221|   |   |   |   |   |   |   |-- Country
3230..1|   |   |   |   |   |   |   |-- CountrySubdivision
3240..1|   |   |   |   |   |   |   |-- PostalCode
3250..1|   |   |   |   |   |   |   |-- PostOfficeBox
3260..1|   |   |   |   |   |   |-- ProprietaryLabel
3270..1|   |   |   |   |   |-- QuantityDetail
3280..n|   |   |   |   |   |   |-- OperationGate
3290..1|   |   |   |   |   |   |   |-- OperationGateDescription
3300..1|   |   |   |   |   |   |   |-- QuantityIn
3310..1|   |   |   |   |   |   |   |-- QuantityOut
3320..1|   |   |   |   |   |   |   |-- QuantityRejected
3330..1|   |   |   |   |   |   |-- OverallQuantityIn
3340..1|   |   |   |   |   |   |-- OverallQuantityOut
3350..1|   |   |   |   |   |   |-- ProjectedPackagedYield
3360..1|   |   |   |   |   |   |-- WaferQuantity
3370..1|   |   |   |   |   |-- WaferLotID
3380..1|   |   |   |   |   |-- WaferSortLocation
3390..1|   |   |   |   |   |   |-- GlobalWorkInProcessLocationCode
3400..1|   |   |   |   |   |   |-- Location
3411|   |   |   |   |   |   |   |-- Choice
3421..n|   |   |   |   |   |   |   |   |-- AlternativeIdentifier
3431|   |   |   |   |   |   |   |   |   |-- Authority
3441|   |   |   |   |   |   |   |   |   |-- Identifier
3451|   |   |   |   |   |   |   |   |-- DUNS
3461|   |   |   |   |   |   |   |   |-- DUNSPlus4
3471|   |   |   |   |   |   |   |   |-- GLN
3480..1|   |   |   |   |   |   |-- PhysicalAddress
3491|   |   |   |   |   |   |   |-- AddressLine1
3500..1|   |   |   |   |   |   |   |-- AddressLine2
3510..1|   |   |   |   |   |   |   |-- AddressLine3
3520..1|   |   |   |   |   |   |   |-- AddressLine4
3530..1|   |   |   |   |   |   |   |-- AddressLine5
3541|   |   |   |   |   |   |   |-- CityName
3551|   |   |   |   |   |   |   |-- Country
3560..1|   |   |   |   |   |   |   |-- CountrySubdivision
3570..1|   |   |   |   |   |   |   |-- PostalCode
3580..1|   |   |   |   |   |   |   |-- PostOfficeBox
3590..1|   |   |   |   |   |   |-- ProprietaryLabel
3601|   |   |   |   |-- LotTimeStamp
3610..1|   |   |   |   |   |-- CompletionStatus
3620..1|   |   |   |   |   |-- LotEndDateTime
3630..1|   |   |   |   |   |-- LotStartDateTime
3640..1|   |   |   |   |-- MfgWorkWeek
3650..1|   |   |   |   |-- OperationInformationReport
3660..1|   |   |   |   |   |-- CarrierReport
3670..n|   |   |   |   |   |   |-- CarrierID
3680..n|   |   |   |   |   |   |-- CarrierSlot
3690..1|   |   |   |   |   |   |   |-- Position
3700..1|   |   |   |   |   |   |   |-- Wafer
3710..1|   |   |   |   |   |   |   |   |-- ProcessRevision
3720..1|   |   |   |   |   |   |   |   |-- ShortID
3731|   |   |   |   |   |   |   |   |-- WaferUniqueID
3740..1|   |   |   |   |   |   |-- CarrierType
3751|   |   |   |   |   |   |-- Lot
3760..n|   |   |   |   |   |   |   |-- AlternativePN
3770..1|   |   |   |   |   |   |   |   |-- ProductName
3780..1|   |   |   |   |   |   |   |   |-- Revision
3791|   |   |   |   |   |   |   |   |-- Choice
3801..n|   |   |   |   |   |   |   |   |   |-- AlternativeIdentifier
3811|   |   |   |   |   |   |   |   |   |   |-- Authority
3821|   |   |   |   |   |   |   |   |   |   |-- Identifier
3831|   |   |   |   |   |   |   |   |   |-- GTIN
3840..n|   |   |   |   |   |   |   |-- ContractorLotNumber
3850..1|   |   |   |   |   |   |   |   |-- IdSuffix
3860..1|   |   |   |   |   |   |   |   |-- ManufacturingID
3870..1|   |   |   |   |   |   |   |-- CustomerLotNumber
3880..1|   |   |   |   |   |   |   |   |-- IdSuffix
3890..1|   |   |   |   |   |   |   |   |-- ManufacturingID
3900..1|   |   |   |   |   |   |   |-- CustomerPN
3910..1|   |   |   |   |   |   |   |   |-- ProductName
3920..1|   |   |   |   |   |   |   |   |-- Revision
3931|   |   |   |   |   |   |   |   |-- Choice
3941..n|   |   |   |   |   |   |   |   |   |-- AlternativeIdentifier
3951|   |   |   |   |   |   |   |   |   |   |-- Authority
3961|   |   |   |   |   |   |   |   |   |   |-- Identifier
3971|   |   |   |   |   |   |   |   |   |-- GTIN
3980..1|   |   |   |   |   |   |   |-- LotType
3990..1|   |   |   |   |   |   |   |-- NominalSize
4000..1|   |   |   |   |   |   |   |-- ProductName
4010..n|   |   |   |   |   |   |   |-- SubLot
4020..1|   |   |   |   |   |   |   |   |-- IdSuffix
4030..1|   |   |   |   |   |   |   |   |-- ManufacturingID
4040..1|   |   |   |   |   |   |   |-- Technology
4050..1|   |   |   |   |   |   |-- Orientation
4060..1|   |   |   |   |   |   |   |-- Notch
4070..1|   |   |   |   |   |   |   |-- Quadrant
4080..1|   |   |   |   |   |-- Chip
4090..1|   |   |   |   |   |   |-- ChipPN
4100..1|   |   |   |   |   |   |-- CustomerChipPN
4110..1|   |   |   |   |   |   |-- DieReticlePN
4120..1|   |   |   |   |   |   |-- ECIDReport
4130..1|   |   |   |   |   |   |   |-- ComponentNumber
4140..1|   |   |   |   |   |   |   |-- DecodedID
4150..1|   |   |   |   |   |   |   |-- Decoder
4160..1|   |   |   |   |   |   |   |-- ECIDType
4171|   |   |   |   |   |   |   |-- IntCoordinate
4180..1|   |   |   |   |   |   |   |   |-- X
4190..1|   |   |   |   |   |   |   |   |-- Y
4200..1|   |   |   |   |   |   |   |   |-- Z
4210..1|   |   |   |   |   |   |   |-- RawBits
4220..1|   |   |   |   |   |-- ChipPeriodicity
4230..1|   |   |   |   |   |   |-- Description
4241|   |   |   |   |   |   |-- FloatCoordinate
4250..1|   |   |   |   |   |   |   |-- X
4260..1|   |   |   |   |   |   |   |-- Y
4270..1|   |   |   |   |   |   |   |-- Z
4280..1|   |   |   |   |   |-- ConsumableLotNumber
4290..1|   |   |   |   |   |-- ConsumableType
4300..1|   |   |   |   |   |-- Dimension
4310..1|   |   |   |   |   |   |-- Axis
4320..1|   |   |   |   |   |   |-- Maximum
4330..1|   |   |   |   |   |   |-- Minimum
4340..1|   |   |   |   |   |-- EquipmentID
4350..1|   |   |   |   |   |-- EquipmentType
4360..n|   |   |   |   |   |-- InlineProcessMeasurementReport
4370..1|   |   |   |   |   |   |-- Disposition
4380..n|   |   |   |   |   |   |-- MeasurementReport
4390..1|   |   |   |   |   |   |   |-- CensorFailCount
4400..1|   |   |   |   |   |   |   |-- ChipPeriodicity
4410..1|   |   |   |   |   |   |   |   |-- Description
4421|   |   |   |   |   |   |   |   |-- FloatCoordinate
4430..1|   |   |   |   |   |   |   |   |   |-- X
4440..1|   |   |   |   |   |   |   |   |   |-- Y
4450..1|   |   |   |   |   |   |   |   |   |-- Z
4460..1|   |   |   |   |   |   |   |-- ChipX
4470..1|   |   |   |   |   |   |   |-- ChipY
4480..1|   |   |   |   |   |   |   |-- CpK
4490..n|   |   |   |   |   |   |   |-- Dimension
4500..1|   |   |   |   |   |   |   |   |-- Axis
4510..1|   |   |   |   |   |   |   |   |-- Maximum
4520..1|   |   |   |   |   |   |   |   |-- Minimum
4530..1|   |   |   |   |   |   |   |-- ExecutionCount
4540..1|   |   |   |   |   |   |   |-- FailCount
4550..n|   |   |   |   |   |   |   |-- FloatCoordinate
4560..1|   |   |   |   |   |   |   |   |-- X
4570..1|   |   |   |   |   |   |   |   |-- Y
4580..1|   |   |   |   |   |   |   |   |-- Z
4590..n|   |   |   |   |   |   |   |-- IntCoordinate
4600..1|   |   |   |   |   |   |   |   |-- X
4610..1|   |   |   |   |   |   |   |   |-- Y
4620..1|   |   |   |   |   |   |   |   |-- Z
4630..1|   |   |   |   |   |   |   |-- MaxMeasurement
4640..1|   |   |   |   |   |   |   |-- Mean
4650..1|   |   |   |   |   |   |   |-- Measurement
4660..n|   |   |   |   |   |   |   |-- MeasurementFeatureReport
4670..1|   |   |   |   |   |   |   |   |-- AreaType
4680..1|   |   |   |   |   |   |   |   |-- ChannelType
4690..1|   |   |   |   |   |   |   |   |-- ChipPN
4700..1|   |   |   |   |   |   |   |   |-- DieReticlePN
4710..1|   |   |   |   |   |   |   |   |-- FeatureType
4720..1|   |   |   |   |   |   |   |   |-- LayerDescription
4730..1|   |   |   |   |   |   |   |   |-- MeasurementType
4740..1|   |   |   |   |   |   |   |   |-- Orientation
4750..1|   |   |   |   |   |   |   |   |   |-- Notch
4760..1|   |   |   |   |   |   |   |   |   |-- Quadrant
4770..1|   |   |   |   |   |   |   |   |-- Pitch
4780..1|   |   |   |   |   |   |   |   |-- PrimaryIdentifier
4790..1|   |   |   |   |   |   |   |   |-- ProcessRecipe
4800..1|   |   |   |   |   |   |   |   |-- TestStructureLocation
4810..n|   |   |   |   |   |   |   |-- MeasurementType
4820..n|   |   |   |   |   |   |   |-- MeasurementUnit
4831|   |   |   |   |   |   |   |   |-- Choice
4841|   |   |   |   |   |   |   |   |   |-- ProprietaryUnits
4851|   |   |   |   |   |   |   |   |   |   |-- Units
4861|   |   |   |   |   |   |   |   |   |-- UnitOfMeasure
4870..1|   |   |   |   |   |   |   |-- MinMeasurement
4880..1|   |   |   |   |   |   |   |-- Parameter
4890..1|   |   |   |   |   |   |   |-- PrimaryIdentifier
4900..1|   |   |   |   |   |   |   |-- Range
4910..1|   |   |   |   |   |   |   |-- SampleCount
4920..1|   |   |   |   |   |   |   |-- StdDev
4930..1|   |   |   |   |   |   |   |-- Sum
4940..1|   |   |   |   |   |   |   |-- SumOfSquares
4950..n|   |   |   |   |   |   |   |-- TestMap
4960..1|   |   |   |   |   |   |   |   |-- CenterX
4970..1|   |   |   |   |   |   |   |   |-- CenterY
4980..1|   |   |   |   |   |   |   |   |-- LogicalMax
4990..1|   |   |   |   |   |   |   |   |-- LogicalMin
5000..1|   |   |   |   |   |   |   |   |-- MeasurementUnit
5011|   |   |   |   |   |   |   |   |   |-- Choice
5021|   |   |   |   |   |   |   |   |   |   |-- ProprietaryUnits
5031|   |   |   |   |   |   |   |   |   |   |   |-- Units
5041|   |   |   |   |   |   |   |   |   |   |-- UnitOfMeasure
5050..1|   |   |   |   |   |   |   |   |-- PosDirX
5060..1|   |   |   |   |   |   |   |   |-- PosDirY
5070..1|   |   |   |   |   |   |   |   |-- RetDieRelationX
5080..1|   |   |   |   |   |   |   |   |-- RetDieRelationY
5090..1|   |   |   |   |   |   |   |   |-- RetDimensionX
5100..1|   |   |   |   |   |   |   |   |-- RetDimensionY
5110..1|   |   |   |   |   |   |   |   |-- WaferCoordinate
5120..1|   |   |   |   |   |   |   |   |   |-- MaxX
5130..1|   |   |   |   |   |   |   |   |   |-- MaxY
5140..1|   |   |   |   |   |   |   |   |   |-- MinX
5150..1|   |   |   |   |   |   |   |   |   |-- MinY
5160..n|   |   |   |   |   |   |   |-- TestParameterInformation
5170..1|   |   |   |   |   |   |   |   |-- Calculation
5180..1|   |   |   |   |   |   |   |   |-- CensorHLim
5190..1|   |   |   |   |   |   |   |   |-- CensorLLim
5200..1|   |   |   |   |   |   |   |   |-- Condition
5210..1|   |   |   |   |   |   |   |   |-- HighLimit
5220..1|   |   |   |   |   |   |   |   |-- Label
5230..1|   |   |   |   |   |   |   |   |-- LowLimit
5240..n|   |   |   |   |   |   |   |   |-- MeasurementUnit
5251|   |   |   |   |   |   |   |   |   |-- Choice
5261|   |   |   |   |   |   |   |   |   |   |-- ProprietaryUnits
5271|   |   |   |   |   |   |   |   |   |   |   |-- Units
5281|   |   |   |   |   |   |   |   |   |   |-- UnitOfMeasure
5290..1|   |   |   |   |   |   |   |   |-- Target
5300..1|   |   |   |   |   |   |-- PrimaryIdentifier
5310..1|   |   |   |   |   |   |-- TestFlag
5320..n|   |   |   |   |   |-- InlineSetupReport
5330..1|   |   |   |   |   |   |-- Disposition
5340..1|   |   |   |   |   |   |-- MeasOperationID
5350..1|   |   |   |   |   |   |-- MeasOperationName
5360..1|   |   |   |   |   |   |-- Orientation
5370..1|   |   |   |   |   |   |   |-- Notch
5380..1|   |   |   |   |   |   |   |-- Quadrant
5390..1|   |   |   |   |   |   |-- PrimaryIdentifier
5400..1|   |   |   |   |   |   |-- ProcessRecipe
5410..1|   |   |   |   |   |   |-- TestFlag
5420..1|   |   |   |   |   |   |-- TestTemperature
5431|   |   |   |   |   |   |   |-- TargetTestTemperature
5441|   |   |   |   |   |   |   |-- UnitOfMeasure
5451|   |   |   |   |   |-- LotTimeStamp
5460..1|   |   |   |   |   |   |-- CompletionStatus
5470..1|   |   |   |   |   |   |-- LotEndDateTime
5480..1|   |   |   |   |   |   |-- LotStartDateTime
5490..1|   |   |   |   |   |-- OperationID
5500..1|   |   |   |   |   |-- OperatorID
5510..1|   |   |   |   |   |-- Orientation
5520..1|   |   |   |   |   |   |-- Notch
5530..1|   |   |   |   |   |   |-- Quadrant
5540..n|   |   |   |   |   |-- ProcessRecipe
5550..n|   |   |   |   |   |-- SoftwareReport
5560..1|   |   |   |   |   |   |-- BuildID
5570..1|   |   |   |   |   |   |-- Name
5580..1|   |   |   |   |   |   |-- Type
5590..1|   |   |   |   |   |   |-- Version
5600..n|   |   |   |   |   |-- TestMap
5610..1|   |   |   |   |   |   |-- CenterX
5620..1|   |   |   |   |   |   |-- CenterY
5630..1|   |   |   |   |   |   |-- LogicalMax
5640..1|   |   |   |   |   |   |-- LogicalMin
5650..1|   |   |   |   |   |   |-- MeasurementUnit
5661|   |   |   |   |   |   |   |-- Choice
5671|   |   |   |   |   |   |   |   |-- ProprietaryUnits
5681|   |   |   |   |   |   |   |   |   |-- Units
5691|   |   |   |   |   |   |   |   |-- UnitOfMeasure
5700..1|   |   |   |   |   |   |-- PosDirX
5710..1|   |   |   |   |   |   |-- PosDirY
5720..1|   |   |   |   |   |   |-- RetDieRelationX
5730..1|   |   |   |   |   |   |-- RetDieRelationY
5740..1|   |   |   |   |   |   |-- RetDimensionX
5750..1|   |   |   |   |   |   |-- RetDimensionY
5760..1|   |   |   |   |   |   |-- WaferCoordinate
5770..1|   |   |   |   |   |   |   |-- MaxX
5780..1|   |   |   |   |   |   |   |-- MaxY
5790..1|   |   |   |   |   |   |   |-- MinX
5800..1|   |   |   |   |   |   |   |-- MinY
5810..n|   |   |   |   |   |-- TestSetup
5820..1|   |   |   |   |   |   |-- CustomerTestProgramEC
5830..1|   |   |   |   |   |   |-- CustomerTestProgramName
5840..1|   |   |   |   |   |   |-- PrimaryIdentifier
5850..1|   |   |   |   |   |   |-- SetupName
5860..1|   |   |   |   |   |   |-- SetupVersion
5870..1|   |   |   |   |   |   |-- TesterControlSoftware
5880..1|   |   |   |   |   |   |-- TesterType
5890..1|   |   |   |   |   |   |-- TestProgEC
5901|   |   |   |   |   |   |-- TestProgramName
5910..1|   |   |   |   |   |   |-- TestTemperature
5921|   |   |   |   |   |   |   |-- TargetTestTemperature
5931|   |   |   |   |   |   |   |-- UnitOfMeasure
5940..1|   |   |   |   |   |-- WaferShortID
5950..1|   |   |   |   |-- OpticalInspectionReport
5960..n|   |   |   |   |   |-- DefectInformation
5971|   |   |   |   |   |   |-- DefectCount
5980..n|   |   |   |   |   |   |-- DefectDescription
5991..n|   |   |   |   |   |   |-- DefectID
6000..1|   |   |   |   |   |   |-- DefectType
6010..1|   |   |   |   |   |-- PrimaryIdentifier
6020..1|   |   |   |   |-- OverallYield
6031|   |   |   |   |-- Package
6040..1|   |   |   |   |   |-- PackageDescription
6050..1|   |   |   |   |   |-- PackageFamily
6060..1|   |   |   |   |   |-- PackageType
6070..1|   |   |   |   |   |-- PhysicalDimension
6080..1|   |   |   |   |   |   |-- Height
6091|   |   |   |   |   |   |   |-- Unit
6101|   |   |   |   |   |   |   |-- Value
6110..1|   |   |   |   |   |   |-- Length
6121|   |   |   |   |   |   |   |-- Unit
6131|   |   |   |   |   |   |   |-- Value
6140..1|   |   |   |   |   |   |-- Width
6151|   |   |   |   |   |   |   |-- Unit
6161|   |   |   |   |   |   |   |-- Value
6170..1|   |   |   |   |   |-- PinCount
6180..1|   |   |   |   |-- PackageReport
6190..n|   |   |   |   |   |-- AssemblyMeasurementReport
6200..1|   |   |   |   |   |   |-- FailureMode
6210..n|   |   |   |   |   |   |-- Measurement
6220..n|   |   |   |   |   |   |-- PinInformation
6230..1|   |   |   |   |   |   |   |-- ChipPinName
6240..1|   |   |   |   |   |   |   |-- ModulePinName
6250..1|   |   |   |   |   |   |   |-- Pin
6260..1|   |   |   |   |   |   |   |-- Signal
6270..1|   |   |   |   |   |   |-- PrimaryIdentifier
6280..1|   |   |   |   |   |   |-- TesterAlarm
6290..1|   |   |   |   |   |   |-- TestResult
6300..n|   |   |   |   |   |   |-- TestType
6310..n|   |   |   |   |   |-- BuildInfoReport
6320..1|   |   |   |   |   |   |-- ComponentDescription
6330..1|   |   |   |   |   |   |-- ComponentID
6340..1|   |   |   |   |   |   |-- ComponentLocation
6351|   |   |   |   |   |   |-- ComponentNumber
6360..1|   |   |   |   |   |   |-- ComponentParentNumber
6370..1|   |   |   |   |   |   |-- ComponentSerialNumber
6380..1|   |   |   |   |   |   |-- ComponentType
6390..1|   |   |   |   |   |   |-- UserSite
6400..n|   |   |   |   |   |-- ECIDReport
6410..1|   |   |   |   |   |   |-- ComponentNumber
6420..1|   |   |   |   |   |   |-- DecodedID
6430..1|   |   |   |   |   |   |-- Decoder
6440..1|   |   |   |   |   |   |-- ECIDType
6451|   |   |   |   |   |   |-- IntCoordinate
6460..1|   |   |   |   |   |   |   |-- X
6470..1|   |   |   |   |   |   |   |-- Y
6480..1|   |   |   |   |   |   |   |-- Z
6490..1|   |   |   |   |   |   |-- RawBits
6500..n|   |   |   |   |   |-- FinalPackageReport
6510..1|   |   |   |   |   |   |-- ComponentNumber
6520..1|   |   |   |   |   |   |-- Keyword
6530..1|   |   |   |   |   |   |-- PrimaryIdentifier
6540..1|   |   |   |   |   |   |-- UserSite
6550..1|   |   |   |   |   |   |-- Value
6560..1|   |   |   |   |   |-- PackageDefectCount
6570..1|   |   |   |   |   |-- PackageDefectID
6580..n|   |   |   |   |   |-- PackageID
6590..n|   |   |   |   |   |-- PackageText
6600..1|   |   |   |   |   |-- PrimaryIdentifier
6610..1|   |   |   |   |-- ProductCategory
6620..1|   |   |   |   |-- QuantityDetail
6630..n|   |   |   |   |   |-- OperationGate
6640..1|   |   |   |   |   |   |-- OperationGateDescription
6650..1|   |   |   |   |   |   |-- QuantityIn
6660..1|   |   |   |   |   |   |-- QuantityOut
6670..1|   |   |   |   |   |   |-- QuantityRejected
6680..1|   |   |   |   |   |-- OverallQuantityIn
6690..1|   |   |   |   |   |-- OverallQuantityOut
6700..1|   |   |   |   |   |-- ProjectedPackagedYield
6710..1|   |   |   |   |   |-- WaferQuantity
6721..n|   |   |-- InlineProcess
6730..1|   |   |   |-- OperationInformationReport
6740..1|   |   |   |   |-- CarrierReport
6750..n|   |   |   |   |   |-- CarrierID
6760..n|   |   |   |   |   |-- CarrierSlot
6770..1|   |   |   |   |   |   |-- Position
6780..1|   |   |   |   |   |   |-- Wafer
6790..1|   |   |   |   |   |   |   |-- ProcessRevision
6800..1|   |   |   |   |   |   |   |-- ShortID
6811|   |   |   |   |   |   |   |-- WaferUniqueID
6820..1|   |   |   |   |   |-- CarrierType
6831|   |   |   |   |   |-- Lot
6840..n|   |   |   |   |   |   |-- AlternativePN
6850..1|   |   |   |   |   |   |   |-- ProductName
6860..1|   |   |   |   |   |   |   |-- Revision
6871|   |   |   |   |   |   |   |-- Choice
6881..n|   |   |   |   |   |   |   |   |-- AlternativeIdentifier
6891|   |   |   |   |   |   |   |   |   |-- Authority
6901|   |   |   |   |   |   |   |   |   |-- Identifier
6911|   |   |   |   |   |   |   |   |-- GTIN
6920..n|   |   |   |   |   |   |-- ContractorLotNumber
6930..1|   |   |   |   |   |   |   |-- IdSuffix
6940..1|   |   |   |   |   |   |   |-- ManufacturingID
6950..1|   |   |   |   |   |   |-- CustomerLotNumber
6960..1|   |   |   |   |   |   |   |-- IdSuffix
6970..1|   |   |   |   |   |   |   |-- ManufacturingID
6980..1|   |   |   |   |   |   |-- CustomerPN
6990..1|   |   |   |   |   |   |   |-- ProductName
7000..1|   |   |   |   |   |   |   |-- Revision
7011|   |   |   |   |   |   |   |-- Choice
7021..n|   |   |   |   |   |   |   |   |-- AlternativeIdentifier
7031|   |   |   |   |   |   |   |   |   |-- Authority
7041|   |   |   |   |   |   |   |   |   |-- Identifier
7051|   |   |   |   |   |   |   |   |-- GTIN
7060..1|   |   |   |   |   |   |-- LotType
7070..1|   |   |   |   |   |   |-- NominalSize
7080..1|   |   |   |   |   |   |-- ProductName
7090..n|   |   |   |   |   |   |-- SubLot
7100..1|   |   |   |   |   |   |   |-- IdSuffix
7110..1|   |   |   |   |   |   |   |-- ManufacturingID
7120..1|   |   |   |   |   |   |-- Technology
7130..1|   |   |   |   |   |-- Orientation
7140..1|   |   |   |   |   |   |-- Notch
7150..1|   |   |   |   |   |   |-- Quadrant
7160..1|   |   |   |   |-- Chip
7170..1|   |   |   |   |   |-- ChipPN
7180..1|   |   |   |   |   |-- CustomerChipPN
7190..1|   |   |   |   |   |-- DieReticlePN
7200..1|   |   |   |   |   |-- ECIDReport
7210..1|   |   |   |   |   |   |-- ComponentNumber
7220..1|   |   |   |   |   |   |-- DecodedID
7230..1|   |   |   |   |   |   |-- Decoder
7240..1|   |   |   |   |   |   |-- ECIDType
7251|   |   |   |   |   |   |-- IntCoordinate
7260..1|   |   |   |   |   |   |   |-- X
7270..1|   |   |   |   |   |   |   |-- Y
7280..1|   |   |   |   |   |   |   |-- Z
7290..1|   |   |   |   |   |   |-- RawBits
7300..1|   |   |   |   |-- ChipPeriodicity
7310..1|   |   |   |   |   |-- Description
7321|   |   |   |   |   |-- FloatCoordinate
7330..1|   |   |   |   |   |   |-- X
7340..1|   |   |   |   |   |   |-- Y
7350..1|   |   |   |   |   |   |-- Z
7360..1|   |   |   |   |-- ConsumableLotNumber
7370..1|   |   |   |   |-- ConsumableType
7380..1|   |   |   |   |-- Dimension
7390..1|   |   |   |   |   |-- Axis
7400..1|   |   |   |   |   |-- Maximum
7410..1|   |   |   |   |   |-- Minimum
7420..1|   |   |   |   |-- EquipmentID
7430..1|   |   |   |   |-- EquipmentType
7440..n|   |   |   |   |-- InlineProcessMeasurementReport
7450..1|   |   |   |   |   |-- Disposition
7460..n|   |   |   |   |   |-- MeasurementReport
7470..1|   |   |   |   |   |   |-- CensorFailCount
7480..1|   |   |   |   |   |   |-- ChipPeriodicity
7490..1|   |   |   |   |   |   |   |-- Description
7501|   |   |   |   |   |   |   |-- FloatCoordinate
7510..1|   |   |   |   |   |   |   |   |-- X
7520..1|   |   |   |   |   |   |   |   |-- Y
7530..1|   |   |   |   |   |   |   |   |-- Z
7540..1|   |   |   |   |   |   |-- ChipX
7550..1|   |   |   |   |   |   |-- ChipY
7560..1|   |   |   |   |   |   |-- CpK
7570..n|   |   |   |   |   |   |-- Dimension
7580..1|   |   |   |   |   |   |   |-- Axis
7590..1|   |   |   |   |   |   |   |-- Maximum
7600..1|   |   |   |   |   |   |   |-- Minimum
7610..1|   |   |   |   |   |   |-- ExecutionCount
7620..1|   |   |   |   |   |   |-- FailCount
7630..n|   |   |   |   |   |   |-- FloatCoordinate
7640..1|   |   |   |   |   |   |   |-- X
7650..1|   |   |   |   |   |   |   |-- Y
7660..1|   |   |   |   |   |   |   |-- Z
7670..n|   |   |   |   |   |   |-- IntCoordinate
7680..1|   |   |   |   |   |   |   |-- X
7690..1|   |   |   |   |   |   |   |-- Y
7700..1|   |   |   |   |   |   |   |-- Z
7710..1|   |   |   |   |   |   |-- MaxMeasurement
7720..1|   |   |   |   |   |   |-- Mean
7730..1|   |   |   |   |   |   |-- Measurement
7740..n|   |   |   |   |   |   |-- MeasurementFeatureReport
7750..1|   |   |   |   |   |   |   |-- AreaType
7760..1|   |   |   |   |   |   |   |-- ChannelType
7770..1|   |   |   |   |   |   |   |-- ChipPN
7780..1|   |   |   |   |   |   |   |-- DieReticlePN
7790..1|   |   |   |   |   |   |   |-- FeatureType
7800..1|   |   |   |   |   |   |   |-- LayerDescription
7810..1|   |   |   |   |   |   |   |-- MeasurementType
7820..1|   |   |   |   |   |   |   |-- Orientation
7830..1|   |   |   |   |   |   |   |   |-- Notch
7840..1|   |   |   |   |   |   |   |   |-- Quadrant
7850..1|   |   |   |   |   |   |   |-- Pitch
7860..1|   |   |   |   |   |   |   |-- PrimaryIdentifier
7870..1|   |   |   |   |   |   |   |-- ProcessRecipe
7880..1|   |   |   |   |   |   |   |-- TestStructureLocation
7890..n|   |   |   |   |   |   |-- MeasurementType
7900..n|   |   |   |   |   |   |-- MeasurementUnit
7911|   |   |   |   |   |   |   |-- Choice
7921|   |   |   |   |   |   |   |   |-- ProprietaryUnits
7931|   |   |   |   |   |   |   |   |   |-- Units
7941|   |   |   |   |   |   |   |   |-- UnitOfMeasure
7950..1|   |   |   |   |   |   |-- MinMeasurement
7960..1|   |   |   |   |   |   |-- Parameter
7970..1|   |   |   |   |   |   |-- PrimaryIdentifier
7980..1|   |   |   |   |   |   |-- Range
7990..1|   |   |   |   |   |   |-- SampleCount
8000..1|   |   |   |   |   |   |-- StdDev
8010..1|   |   |   |   |   |   |-- Sum
8020..1|   |   |   |   |   |   |-- SumOfSquares
8030..n|   |   |   |   |   |   |-- TestMap
8040..1|   |   |   |   |   |   |   |-- CenterX
8050..1|   |   |   |   |   |   |   |-- CenterY
8060..1|   |   |   |   |   |   |   |-- LogicalMax
8070..1|   |   |   |   |   |   |   |-- LogicalMin
8080..1|   |   |   |   |   |   |   |-- MeasurementUnit
8091|   |   |   |   |   |   |   |   |-- Choice
8101|   |   |   |   |   |   |   |   |   |-- ProprietaryUnits
8111|   |   |   |   |   |   |   |   |   |   |-- Units
8121|   |   |   |   |   |   |   |   |   |-- UnitOfMeasure
8130..1|   |   |   |   |   |   |   |-- PosDirX
8140..1|   |   |   |   |   |   |   |-- PosDirY
8150..1|   |   |   |   |   |   |   |-- RetDieRelationX
8160..1|   |   |   |   |   |   |   |-- RetDieRelationY
8170..1|   |   |   |   |   |   |   |-- RetDimensionX
8180..1|   |   |   |   |   |   |   |-- RetDimensionY
8190..1|   |   |   |   |   |   |   |-- WaferCoordinate
8200..1|   |   |   |   |   |   |   |   |-- MaxX
8210..1|   |   |   |   |   |   |   |   |-- MaxY
8220..1|   |   |   |   |   |   |   |   |-- MinX
8230..1|   |   |   |   |   |   |   |   |-- MinY
8240..n|   |   |   |   |   |   |-- TestParameterInformation
8250..1|   |   |   |   |   |   |   |-- Calculation
8260..1|   |   |   |   |   |   |   |-- CensorHLim
8270..1|   |   |   |   |   |   |   |-- CensorLLim
8280..1|   |   |   |   |   |   |   |-- Condition
8290..1|   |   |   |   |   |   |   |-- HighLimit
8300..1|   |   |   |   |   |   |   |-- Label
8310..1|   |   |   |   |   |   |   |-- LowLimit
8320..n|   |   |   |   |   |   |   |-- MeasurementUnit
8331|   |   |   |   |   |   |   |   |-- Choice
8341|   |   |   |   |   |   |   |   |   |-- ProprietaryUnits
8351|   |   |   |   |   |   |   |   |   |   |-- Units
8361|   |   |   |   |   |   |   |   |   |-- UnitOfMeasure
8370..1|   |   |   |   |   |   |   |-- Target
8380..1|   |   |   |   |   |-- PrimaryIdentifier
8390..1|   |   |   |   |   |-- TestFlag
8400..n|   |   |   |   |-- InlineSetupReport
8410..1|   |   |   |   |   |-- Disposition
8420..1|   |   |   |   |   |-- MeasOperationID
8430..1|   |   |   |   |   |-- MeasOperationName
8440..1|   |   |   |   |   |-- Orientation
8450..1|   |   |   |   |   |   |-- Notch
8460..1|   |   |   |   |   |   |-- Quadrant
8470..1|   |   |   |   |   |-- PrimaryIdentifier
8480..1|   |   |   |   |   |-- ProcessRecipe
8490..1|   |   |   |   |   |-- TestFlag
8500..1|   |   |   |   |   |-- TestTemperature
8511|   |   |   |   |   |   |-- TargetTestTemperature
8521|   |   |   |   |   |   |-- UnitOfMeasure
8531|   |   |   |   |-- LotTimeStamp
8540..1|   |   |   |   |   |-- CompletionStatus
8550..1|   |   |   |   |   |-- LotEndDateTime
8560..1|   |   |   |   |   |-- LotStartDateTime
8570..1|   |   |   |   |-- OperationID
8580..1|   |   |   |   |-- OperatorID
8590..1|   |   |   |   |-- Orientation
8600..1|   |   |   |   |   |-- Notch
8610..1|   |   |   |   |   |-- Quadrant
8620..n|   |   |   |   |-- ProcessRecipe
8630..n|   |   |   |   |-- SoftwareReport
8640..1|   |   |   |   |   |-- BuildID
8650..1|   |   |   |   |   |-- Name
8660..1|   |   |   |   |   |-- Type
8670..1|   |   |   |   |   |-- Version
8680..n|   |   |   |   |-- TestMap
8690..1|   |   |   |   |   |-- CenterX
8700..1|   |   |   |   |   |-- CenterY
8710..1|   |   |   |   |   |-- LogicalMax
8720..1|   |   |   |   |   |-- LogicalMin
8730..1|   |   |   |   |   |-- MeasurementUnit
8741|   |   |   |   |   |   |-- Choice
8751|   |   |   |   |   |   |   |-- ProprietaryUnits
8761|   |   |   |   |   |   |   |   |-- Units
8771|   |   |   |   |   |   |   |-- UnitOfMeasure
8780..1|   |   |   |   |   |-- PosDirX
8790..1|   |   |   |   |   |-- PosDirY
8800..1|   |   |   |   |   |-- RetDieRelationX
8810..1|   |   |   |   |   |-- RetDieRelationY
8820..1|   |   |   |   |   |-- RetDimensionX
8830..1|   |   |   |   |   |-- RetDimensionY
8840..1|   |   |   |   |   |-- WaferCoordinate
8850..1|   |   |   |   |   |   |-- MaxX
8860..1|   |   |   |   |   |   |-- MaxY
8870..1|   |   |   |   |   |   |-- MinX
8880..1|   |   |   |   |   |   |-- MinY
8890..n|   |   |   |   |-- TestSetup
8900..1|   |   |   |   |   |-- CustomerTestProgramEC
8910..1|   |   |   |   |   |-- CustomerTestProgramName
8920..1|   |   |   |   |   |-- PrimaryIdentifier
8930..1|   |   |   |   |   |-- SetupName
8940..1|   |   |   |   |   |-- SetupVersion
8950..1|   |   |   |   |   |-- TesterControlSoftware
8960..1|   |   |   |   |   |-- TesterType
8970..1|   |   |   |   |   |-- TestProgEC
8981|   |   |   |   |   |-- TestProgramName
8990..1|   |   |   |   |   |-- TestTemperature
9001|   |   |   |   |   |   |-- TargetTestTemperature
9011|   |   |   |   |   |   |-- UnitOfMeasure
9020..1|   |   |   |   |-- WaferShortID


Classes
NoNameDefinition
1AlternativeIdentifierIdentifies the specified code and the name of the organization that a code is utilized from.
2AlternativePNA user defined string to identify a part number for a wafer or packaged die which is associated with customerPN.
3AssemblyLotReportA report that presents the assembly lot data information.
4AssemblyMeasurementReportAssembly process parametric measurements report.
5AssemblyProcessAssembly process.
6BALocationDescribes where the wafer was sent for bond and assembly.
7BuildInfoReportOptions of obtaining more build information when building out the package.
8BusinessServiceInformationThe object allows the specification of the business service utilized within the partner company. This may or may not be the same as the information sent by the RNIF.
9CarrierReportA report that describes the material positioned in a holder.
10CarrierSlotDescribes the details of carrier positioning and wafer information.
11ChipPeriodicityDimensional. Describes the distance between chips in micron between established reference points in either the x- and or y-direction on a wafer.
12ChipPart number information about the chips on a wafer.
13ContactInformationThe business document must allow for the identification of the name of the department, service or individual to be contacted regarding the context of the business document.
14ContractInformationA block of information used to correlate a contract in an executing choreography.
15ContractorLotNumberUser defined alphanumeric string which is associated with customer lot number.
16CorrelationInformationA block of information used to correlate a requesting document to a responding document and to the contract in an executing choreography.
17CustomerLotNumberCustomer defined alphanumeric string used to identify the lot.
18CustomerPNA string which identifies Foundry defined, the Test Services defined or the customer proprietary defined part number for a wafer or packaged die.
19DefectInformationA report that aggregates visual defect information collected during the assembly process.
20DimensionDescribes the dimensional measurement range in X, Y or Z axis.
21DocumentHeaderThe object allows for the identification of the sender and receiver of the business document.
22DocumentIdentificationThe object specifies all information necessary to identify the business document.
23DocumentInformationThe object specifies information to identify the business document, a summary of attachments, and information about the business document security.
24DocumentManifestThe block provides a brief summary of attachments and Service Content.
25DocumentSecurityThe object provides additional granularity in specifying business document security (this is in addition to the specified PIP security).
26ECIDReportReport to collect electronic chip ID data.
27FabLocationDescribes where the wafer was fabricated.
28FinalPackageReportA report that provides additional, optional information about a packaged device. This class supports additional information concerning die being assembled into a package and to a card. This is the last step in the assembly process.
29FloatCoordinateX, Y and Z Coordinate values.
30HeightTo express the height of an object.
31IncomingWaferLotReportReport that describes logistical information about the incoming wafer lot to assembly.
32InlineProcessMeasurementReportReport that describes a measurement or group of inline process measurements.
33InlineProcessInline process.
34InlineSetupReportReport that provides set up information for MeasurementReport.
35IntCoordinateX, Y and Z Coordinate values.
36LengthTo express the length of an object.
37LocationThe business document must specify a location.
38LotReportReport that is common for reporting data collection for inline process and assembly process.
39LotTimeStampDefines the lot start and end times for a measurement activity.
40LotDescribes the lot information.
41ManifestItemThe object provides details about the specific attachment(s).
42MeasurementFeatureReportReport that provides additional information about the inline measurement.
43MeasurementReportReport that collects all the measurement statistics.
44MeasurementUnitDescribes the measurement unit.
45OperationGateThe assembly process can be viewed as a series of operations. Inspections are performed at some of the operations and "bad" material is removed from the process. The OperationGate holds the name of that operation where the inspection is performed and the quantity information (inputs/output/rejects) for that operation. More specific defect counts can be viewed by looking at the OpticalInspectionReport where OpticalInspecationReport.DefectInformation.DefectType equals OperationGate.OperationGateDescription.
46OperationInformationReportReport that provides information on the equipment used for a process or measurement.
47OpticalInspectionReportThe report of optical inspection done.
48OrientationDescribes the orientation of the wafer on a tool or carrier.
49OtherLocationDescribes the location where the wafer or packaged die in a lot or sublot was sent for additional fabrication, assembly or testing. This may be indicated by City, State, Country, Zip Code, DUNS, DUNS+4 or by proprietary label.
50PackageReportReport that describes the defects from package inspection. Associate with OpticalInspectionReport.
51PackageReport that describes key attributes of the packaging of the die.
52PartnerIdentificationThe business document must allow for the identity of one or more parties to the transaction.
53PhysicalAddressThe business document must provide a physical address for a party to the business transaction.
54PhysicalDimensionThe x and y dimensions of the physical package in mm.
55PinInformationReport that describes additional information about the pins on the package.
56ProprietaryUnitsDescribes a class where the sender defines the units of measure for the test. These units are not listed in code list UnitOfMeasure.
57QuantityDetailA set of quantity details to select.
58ReceiverThe object allows the identification of the receiving party of the business message.
59RequestingDocumentInformationA block of information used to correlate a requesting document to a responding document in an executing choreography.
60SemiconductorProcessDataNotificationA message wrapper or root element for PIP7C8.
61SenderThe object allows the identification of the initiating party of the business message.
62SoftwareReportSoftwareReport describes software type, software name, software version and softwareBuildID.
63StandardDocumentIdentificationThe object specifies additional information necessary to identify the standard business document.
64SubLotAlphanumeric string which describes a lot which has been separated from the Lot.
65TestMapDescribes the wafer orientation and configuration used by manufacturing test (metrology) equipment.
66TestParameterInformationDescribes optional attributes to provide additional information on the parameters of the test.
67TestSetupDescribes the identification information for tester set-up.
68TestTemperatureTemperature value in either Centigrade or Fahrenheit to identify at which a test is performed for lot or sublot.
69TpirPipIdentificationThe object specifies all information necessary to uniquely identify a TPIR-PIP within a Registry or trading partner repository.
70WaferCoordinateThe collection of business properties that describe the coordinate on a semiconductor wafer..
71WaferSortLocationDescribes where the wafer was sent for wafer sort.
72WaferDescribes key reference attributes to identify a wafer.
73WidthTo express the weight of an object.

Attributes
NoNameDefinitionType
1ActionNameThe name of Action. For RosettaNet usually any of Request/Confirm/Notify/Query/Response.string
2AddressLine1The first line of a physical address.string
3AddressLine2The second line of a physical address.string
4AddressLine3The third line of a physical address.string
5AddressLine4The fourth line of a physical address.string
6AddressLine5The fifth line of a physical address.string
7AlternateYieldThe calculation of the overall yield calculation by an alternate method.PercentAmount
8AreaTypeGeneral description to identify the structure that is being measured being in an active area e.g. transistor area, over gate oxide or in an inactive area (poly over field). Valid values are "Active", "Inactive", "Null".string
9AssemblyLotIDAn alphanumeric string that identifies the lot or lots of packaged part(s) (products(s) created during assembly.string
10AuthorityThe name of the organization that a code is utilized from.string
11BuildIDA string that identifies the build version of the software. Example: BuildID=Java, JDK, 118, o118-199990910.string
12BusinessProcessInstanceIdentifierThe identifier for the public business process instance being sent that both the sender and receiver can identify.string
13CalculationA string describing the mathematical expression to derive a result.string
14CarrierIDIdentify the carrier used to transport the product during wafer manufacturing.string
15CarrierTypeDescribes the material holder. Valid values are carrier, tape and reel, package tray, boat, wafer tray and user defined values.string
16CensorFailCountNumber of measurements that are excluded by the censor limit.integer
17CensorHLimFloat value for the high boundary for legitimate or valid test data.float
18CensorLLimFloat value for the low boundary for legitimate or valid test data.float
19CenterXThe vector in X direction for index units form the (0,0) coordinate to the index containing the physical center of the wafer. For PCM data the index is reticle steps. For Wafer Sort and Final Test data the index is die steps.float
20CenterYThe vector in Y direction for index units form the (0,0) coordinate to the index containing the physical center of the wafer. For PCM data the index is reticle steps. For Wafer Sort and Final Test data the index is die steps.float
21ChannelTypeIdentifies device channel type. Valid values are: "N", "P", "Null" and "Other".string
22ChipPNA string that describes the part number for the device.string
23ChipPNA string that describes the part number of the chip.string
24ChipPinNameAlphanumeric string to describe the name of the pin.string
25ChipXIdentifies the chip location in the x-direction on the wafer. Row designation is dependent upon orientation of the notch.integer
26ChipYIdentifies the chip location in the y-direction on the wafer. Row designation is dependent upon orientation of the notch.integer
27CityNameThe name of a city.string
28ComponentDescriptionA user defined description of the component.string
29ComponentIDA unique identification of the component per the componentType (e.g. Frame, Card). Note: The ChipID may be identified by waferid/X/Y. This may be an actual component serial number or may be the primary ECID value waferid/X/Y. If there is an invalid ECID read, the value that is typically used is lotnum/seq/bad-waferid/bad-X/bad-Y or equivalent.string
30ComponentLocationThe location of a sub-component on the parent component.string
31ComponentNumberA number associating a key value pair to a specific component in BuildInfoReport.integer
32ComponentNumberA number associating an ECIDReport to a specific component in BuildInfoReport.integer
33ComponentNumberA unique number associated with the component or subcomponent being tested relative to the device. In general the highest level of the componentNumber equals 0 and all identified subcomponents are componentNumber equal 1-n. Subsequent Reports can be associated to the sub-component via the componentNumber.integer
34ComponentParentNumberFor the highest level of packaged component the value is null. For any sub-component, the corresponding componentNumber is from a previous BuildInfoReport.integer
35ComponentSerialNumberA scribed serial number on the component.string
36ConditionA string specifying the test parameter, Example: Test temperature.string
37ConsumableLotNumberUser defined consumable lot used in manufacturing.string
38ConsumableTypeUser defined type of consumable used in the manufacturing process. Examples: chemicals, gases, solder type, substrate.string
39ContactThe name of the department, service or individual to be contacted within the organization.Contact
40ContractIdentifierUnique identification of a contract between the Sender and the Receiverstring
41ContractTypeThe type of the contract: an attribute describing the type of the ContractIndentification. Valid values are URI, URN,ebXMLCPA, or other values defined by partners.string
42CpKCalculated cpk for a process step or operation from the measurements in the file. Process capability, cpk, can be defined as the spread within which almost all of the parts or values within a distribution will fall, generally described as within +/- three (3) standard deviations or six (6) standard deviations.float
43CreationThe creation date and time of the specified Business Document (i.e. the Purchase Order date).dateTime
44CustomerChipPNCustomer proprietary product part number.string
45CustomerTestProgramECCustomer Supplied Test Program EC. In a foundry model, the customer can have a different test program EC than the one used by the test house.string
46CustomerTestProgramNameCustomer Supplied Test Program Name. In a foundry model, the customer can have a different test program name than the one used by the test house.string
47DUNSPlus4A identifier to specify a specific location within a business location.DUNSPlus4
48DUNSA number assigned by Dun and Bradstreet to identify a business location.DUNS
49DecodedIDValue that could represent waferID or lotID.string
50DecoderIdentifies the decoding scheme if ECID is used.string
51DefectCountQuantity of defects associated with a defectID.integer
52DefectDescriptionUser observation on the nature of a defect.string
53DefectIDUnique optical inspection identification for a defect type.string
54DefectTypeDefines the type of optical defects collected within an OpticalInspectionReport. Valid values are: "2ndOptical", "3rdOptical", "DVI" and user defined.string
55DescriptionA description of the attachment.string
56DescriptionA string that describes the kind of chip periodicity is being defined.string
57DieReticlePNA string which defines the unique part numbers for a chips associated with a multi-project wafers.string
58DieReticlePNA string which defines the unique part numbers for die associated with a multi-project wafer.string
59DispositionDisposition reason or result for an operation step. Valid values are: "Ship", "Hold", "Scrap", "Retest", "Other", "Null".string
60ECIDTypeWhen multiple types of electronic chip identification can be used, the ECIDTYPE field can be used to determine which type is being logged. e.g. Wafer_X_Y, MAC, GUID.string
61EmailThe electronic mail for the specified contact.string
62EquipmentIDIdentifies the tool used during a process or measurement.string
63EquipmentTypeIdentifies the tool type for a processing step or measurement.string
64ExecutionCountNumber of measurements attempted.integer
65FailCountNumber of failing measurements.integer
66FailureModeIdentifies the type of failure observed in the assembly parametric test.string
67FaxThe fax number for the specified contact.string
68FeatureTypeGeneral description to identify the type of feature being measured. Valid values are: "Line", "Space", "Hole", "Post", "Null" and "Other".string
69FileDataVersionUser defined changes i.e. rules changes to content of data in the data file transfer. Examples: version update to loaders, parsers, or operating system, specification limits etc.string
70GLNGlobal Location Number (GLN) - A identifier to identify legal entities, trading parties and location. GLN
71GTINGlobal Trade Identification Number (GTIN).GTIN
72GlobalLotStatusCodeDescribes lot or sublot status.string
73GlobalWorkInProcessLocationCodeReferences where fabrication, bond, assembly, test and related activities were performed on a lot or sublot.string
74HeaderVersionThe UN/CEFACT version of the document header.string
75HighLimitDescribes the high limit value for a test specification.float
76IdSuffixAn alphanumeric string that could be used to identify a lot at a location. The suffix string is user defined. It can be used to identify a lot split, a bond assembly location, wafer sort or final test location.string
77IdentifierIdentifies the role of the contact (i.e. Service Technician, Account Manager) in the Business Process.string
78IdentifierThe specified code to represent an entity (e.g. product, location, partner, etc.).string
79IdentifierThe unique identifier for the document being sent.string
80KeywordAn optional keyword.string
81LabelA string label to identify to the test parameter name.string
82LayerDescriptionGeneral description of the type of layer being measured. Valid values are: "Gate", "Contact", "Via", "Metal", "Diffusion", "Implant" and user defined.string
83LengthThe size of the attachment in bytes (i.e. 1 000 000 bytes)positiveInteger
84LogicalMaxThe logiscal maximum dimensions. For PCM data, units are reticle index steps. For Wafer Sort and Final Test data, units are die index steps.float
85LogicalMinThe logiscal minimum dimensions. For PCM data, units are reticle index steps. For Wafer Sort and Final Test data, units are die index steps.float
86LotEndDateTimeDefines the end time of a lot for a test.dateTime
87LotStartDateTimeDefines the start time of the lot for a test.dateTime
88LowLimitDescribes the low limit value for a test specification.float
89ManufacturingIDAlphanumeric string which describes the lot.string
90MaxMeasurementMaximum measurement collected from the measurements in the file.float
91MaxXThe maximum X coordinate on a semiconductor wafer.float
92MaxYThe maximum Y coodinate on a semiconductor wafer.float
93MaximumDescribes the maximum dimensional measurement for X, Y or Z axis.float
94MeanCalculated mean from the measurements in the file. The arithmetic mean is equal to the sum of the measurements divided by n, the number of measurements in the group.float
95MeasOperationIDOperation number that corresponds to the measurement operation name.string
96MeasOperationNameName of the operation step. This correlates to the MES name of the operation step.string
97MeasurementMeasurement in base unit.float
98MeasurementResultant value of the measurement.float
99MfgWorkWeekIdentification of the work week that the assembly process starts on an incoming wafer lot. The work week is identified by an integer ranging from 01 through 52.string
100MinMeasurementMinimum measurement collected from the measurements in the file.float
101MinXThe minimum X coodinate on a semiconductor wafer.float
102MinYThe minimum Y coodinate on a semiconductor wafer.float
103MinimumDescribes the minimum dimensional measurement for X, Y or Z axis.float
104ModulePinNameAlphanumeric string to describe the package pin name.string
105MultipleTypeIndicates whether the manifest contains documents of multiple types. True if yes, and False if no.boolean
106NameThe name of software type. Examples: AIX, Windows.string
107NominalSizeDescribes the diameter of the wafer in mm, or inches.float
108NonRepudiableReceiptThe value "true" will indicate that a signed acknowledgement for the business document is necessary.boolean
109NotchDescribes the orientation of the wafer notch in a tester: Valid options are: 12 o’clock; 3 o’clock, 6 o’clock, 9 o’clock, notch up, notch down, notch right or notch left, Up=U, Down=D, Left=L, or Right=R, 0, 90, 180 or 270 degrees.string
110NumberOfItemsTotal number of documents in the message. The physical count of the attachments in the payload plus the RosettaNet Business Message (for Service Content). The value of this field will be at least 1.positiveInteger
111OperationGateDescriptionA user defined description of the operation or operation gate in the assembly process. This data attribute is associated with data attributes qualityIn and qualityOut.string
112OperationIDIdentifies the operation or process step.string
113OperatorIDIdentifies the operator at a process step.string
114OverallQuantityInThe quantity of incoming product for calculating overall assembly yield.integer
115OverallQuantityOutThe quantity of outgoing product for calculating overall assembly yield.integer
116OverallYieldThe overall yield of the assembly process.PercentAmount
117PackageDefectCountQuantity of defects associated with a packageDefectID.integer
118PackageDefectIDUnique defect code at the package level.string
119PackageDescriptionDescription of the package.string
120PackageFamilyUser defined identification of the specific package family being used to assemble the product. Example: BGA, FBGA.string
121PackageIDUnique identifier for a package in an assembly lot. This is a user defined process.string
122PackageTextComment field to provide information about the package and assembly lot.string
123PackageTypeUser defined identification of the package type associated with the assembly lot. Example: Plastic, Organic, MCM.string
124ParameterA user-defined string description of the particular Parameter being measured, different from the fixed MeasurementType codelist.string
125PartnerIdThe Trading Partner Identification of MNC that is creating this TPIR PIP.DUNSPlus4
126PartnerNameThe name of the partner’s company/business.string
127PersistentEncryptionThe value "true" will indicate that the Business Document (including the header) needs to be encrypted when stored or transported.boolean
128PersistentSignatureThe value "true" will indicate that a signature is required to be stored with the document while stored or transported. boolean
129PhoneThe telephone number for the specified contact.string
130PinCountIdentifies the number of pins on the package. The number of pins are determined by the packageFamily.integer
131PinPin ID for each pin measured.integer
132PipIdentifierPIP Identification.[ i.e. PIP3A4]PipIdentifier
133PipVersionPIP version number (i.e. 02.02.00).PipVersion
134PitchDistance in nm between two measurement artifacts.string
135PosDirXThe positive direction of the X-axis. Values illustrate Up (U), Down (D), Left (L)and Right (R).float
136PosDirYThe positive direction of the Y-axis. Values illustrate Up (U), Down (D), Left (L)and Right (R).float
137PositionThe position of the wafer within the carrier.string
138PostOfficeBoxThe Post Office Box identifier used to identify a party's post office box.string
139PostalCodeIdentifying geographic location as specified by a national postal code.string
140PrimaryIdentifierIdentifier references the test attributes once per lot.integer
141PrimaryIdentifierReference to link the test report for a lot.integer
142PrimaryIdentifierReference to link the test report to a lot.integer
143ProcessIdentifierThe name of the PIP e.g. Notify of Forecast Reply.string
144ProcessRecipeUser defined recipe name associated with a tool.string
145ProcessReferenceThe URN for the PIP that includes Cluster/Segment/Process pattern used to identify the interface process (such as PIP3A4) string
146ProcessRevisionA decimal value, i.e. 1.0 that references the POR version.float
147ProcessStateThe business process (or service) state of the sender of a document. When a service receives this document, the receiver may use the state as a precondition.string
148ProductCategoryThe product category type which is associated with the lotID from the wafer manufacturer. Valid values: "Digital", "Analog", "RF Analog", "Memory", "Power Management", "Controller", "Logic", "Microprocessor" and other user defined.string
149ProductNameA customer defined descriptor or code name for a part being fabricated or tested at a Foundry or Test Service trading partner. Example are Neptune, Big Dog, Antares 6.string
150ProductNameThe name of the product.string
151ProjectedPackagedYieldThe projected package yield from an incoming wafer lot.integer
152ProprietaryLabelUser defined label to uniquely identify a facility that is represented in any of the scenarios.string
153QuadrantA user defined division of the wafer into 4 quadrants. Valid values: I, II, III, IV, Q1,Q2, Q3, Q4, Upper Left, Upper Right, Lower Left, Lower Right and User defined labels.string
154QualityCodeDesignate a quality condition of a lot. This can be a proprietary label defined by the Foundry of the Test Services trading partner.string
155QuantityInThe quantity of product in-gating or going into an assembly operation.integer
156QuantityOutThe quantity of product out-gating or exiting from an assembly operation.integer
157QuantityRejectedThe quantity of product that was rejected (failed) from an assembly operation.integer
158RangeCalculated range from the measurements in the file. Range is calculated by subtracting the low value from the highest value of the data collected in a group.float
159RawBitsRaw Bits data in hexadecimal format.Hexadecimal
160RequestingDocumentCreationDateTimeThe date-time of the requesting business document.dateTime
161RequestingDocumentInstanceIdentifierThe Business Document identification number that identifies the requesting Business Document.string
162ResponseDateTimeThe expected time to receive the response. This can not be greater than the PIP TimeToPerform.dateTime
163RetDieRelationXThe X coordinate of the center die within the center reticle.float
164RetDieRelationYThe Y coordinate of the center die within the center reticle.float
165RetDimensionXThe size of the reticle in the X direction , expressed in number of die incements.float
166RetDimensionYThe size of the reticle in the Y direction , expressed in number of die incements.float
167RevisionReferenced the specified product revision.string
168SampleCountDescribes the number of measurements on a wafer or die.integer
169ServiceNameThe name of the Business Activity with the "Request/Confirm" part removed. E.g., for the Activity "Request Purchase Order"==> "Purchase Order".string
170SetupNameA string that describes test conditions.string
171SetupVersionDescribes the version for the test conditions specified in setupName.float
172ShortIDAlternate identifier for the wafer unique ID.string
173SignalAlphanumeric string to describes the name of the signal pin.string
174StandardIdentifies the standard used to submit the business document. (e.g. RosettaNet).string
175StdDevCalculated standard deviation from the measurements in the file. The standard deviation of a set of n measurements is equal to the positive square root of the variance. The variance of a population of n measurements is a measure of dispersion defined as the average of the square of the deviations of the measurements about the mean.float
176SumOfSquaresCalculated sum of squares from the measurements in the file. The number of representations n of k by squares, allowing zeros and distinguishing signs and order, is denoted rk(n) . For example, consider the number of ways of representing 5 as the sum of two squares.float
177Sumcalculated sum from the measurements in the file. A sum is the result of addition of n, the number of measurements in a group.float
178TargetTestTemperatureThe targeted temperature value in either Centigrade or Fahrenheit at which a test is performed for lot or sublot.float
179TargetDescribes the expected value for the test.float
180TechnologyAn alphanumeric string that is associated with a fabrication technology. Example. CMOS8SF, MOS-11.string
181TestFlagDescribes the intended use of the test. Valid values are: "Production", "Engineering", "Nominal", "SubNominal" and "Other".string
182TestProgECA string that indicates the version number for the TestProgName (Req. #43) used for testing a lot or sublot.string
183TestProgramNameA string that describes the test program for either a lot or sublot.string
184TestStructureLocationIdentifies the measurement structure as bining in the scribe line (street) or in the circuit (die or chip). Suggested values are: "scribe", "in-die", "null".string
185TestTypeDescribes the results of a assembly process parametric test. Valid types are: Wirebond Pull, BallShear, Tensile Strength and other user defined.string
186TesterAlarmAn indicator status flag on whether the tester (equipment) was in alarm during a test.boolean
187TesterControlSoftwareDescribes the software and its version that control the tester.string
188TesterTypeThis object describes the tester model, version and ID number.string
189TpirBusinessProcessIdentifierA Business Process Identifier to uniquely define the TPIR-PIP 'role' within a Business Scenario at a company or MNC level. The identifier MUST be composed of alphanumeric characters only and its length MUST be between one and twelve characters.BusinessProcessIdentifier
190TpirPipVersionA TPIR-PIP Version Number (i.e., major and minor version number as XX.XX).VersionIdentifier
191TypeName of the Action Messagestring
192TypeThe type of software described by this item. Valid examples are: Operating system, OEM tool control, Software system, Local Software and user defined.string
193UnitsSpecial description or code of the units for the measurement value.string
194UniversalResourceIdentifierThe generic set of all names/addresses that are short strings that refer to resources. string
195UriDescribes the destination uri for the TPIR form.anyURI
196UserSiteIdentifies the corresponding device site number (0-1).integer
197UserSiteIdentifies the corresponding device site number.integer
198ValueAny character string value necessary for defining ASCI test results off card testers.string
199ValueThe worth of an object in the specified unit of measure.float
200VersionPIP3A4v01.00string
201VersionThe software version being utilized. Example: 4.1.3.string
202WaferLotIDUnique identifier for the incoming wafer lot from the Wafer Manufacturer or Test Services partner.string
203WaferQuantityIdentifies the number of wafers associated in a lot.integer
204WaferQuantityQuantity or number of wafers in an incoming wafer lot.integer
205WaferShortIDAlternate identifier for the wafer unique ID.string
206WaferUniqueIDAn alphanumeric string which describes the wafer serial number for traceability in a lot or sublot.string
207XCoordinate value for X-axis.integer
208YCoordinate value for Y-axis.integer
209ZCoordinate value for Z-axis.integer

Code Lists
1AxisLines: 431 450 739 758
Indicate three dimensional direction.
Entity Instances
XX-axis.
YY-axis.
ZZ-axis.

2CompletionStatusLines: 166 361 546 854
Describes the status of the lot or sublot at the end of testing.
Entity Instances
ABOAborted: process has been terminated; data is invalid and is purged.
COMCompleted: all process have been completed; data is valid and can be migrated.
SUSSuspend: process is partially done; data is valid and can be migrated.

3ComponentTypeLines: 638
Valid component values are: CAG, CHP, COR, CRD, FRM, MCM, MOD, NOD, SCM.
Entity Instances
CAGA cage containing multiple boards or cards.
CHPA row chip or die.
CORCore, a subcomponent of a chip (e.g. Mult-core processor).
CRDA card or board containing multiple module (MCM or SCM).
FRMA frame containing multiple cages and user definded.
MCMA multi chip module.
MODModule, a single packaged chip (SCM-e.g. Single Chip Module) or set of chips (MCM - e.g. Multi-Chip Module). Use this code when SCM or MCM can not be determined.
NODNode, a grouping of cards within a cage. A node may include cards, memory, and cooling unit systems.
SCMA single chip module.

4ConfidentialityLines: 110
A string which describes the level of security associated with the data, as defined by TPA.
Entity Instances
CONConfidential security level.
NONNo security restriction (None).
RESRestricted security level.

5CountrySubdivisionLines: 106 129 187 215 301 323 356
For representation of a Countries subdivisions RosettaNet has adopted ISO 3166-3; 1999. Refer to the following web page to get the latest version of the standard: http://www.iso.ch/iso/en/prods-services/iso3166ma/02iso-3166-code-lists/index.html If you need more information about the ISO standard please contact ISO for more details.

6CountryLines: 105 128 186 214 300 322 355
For representation of Country name RosettaNet has adopted ISO 3166-3; 1999. Refer to the following web page to get the latest version of the standard: http://www.iso.ch/iso/en/prods-services/iso3166ma/02iso-3166-code-lists/index.html If you need more information about the ISO standard please contact ISO for more details.

7FileTypeLines: 22
Describes the file type of the TPIR form (PDF, XDP or XML).
Entity Instances
PDFPortable Document Format.
XDPXML Data Package.
XMLeXtensible Markup Language.

8LanguageLines: 32
For representation of Language name RosettaNet has adopted ISO 639-2; 1998. Refer to the following web page to get the latest version of the standard: http://www.loc.gov/standards/iso639-2/iso639jac.html If you need more information about the ISO standard please contact ISO for more details.

9LotTypeLines: 158 259 398 706
Describes the mode in which product was tested.
Entity Instances
DEVDevelopment.
ENGEngineering - State where product is made using test processes on non-production tools or equipment.
EUHEUH type.
MFGManufacturing.
NCLNonConformingLot - Lots affected by a nonconformity to preset quality characteristics.
PLTPilot - The first lot of the product (never produced at the dedicated subcontractor).
PPDPre-Production.
PQCProcess Qualification Check - Process to qualify manufacturing processes in preparation for volume manufacturing.
PRDProduction - State where product is made using all production tools, processes, equipment, environment, facility, and cycle time.
RNDResearch and Development - Process for developing prototype products.
RWKRework - Parts sent back from further down the manufacturing line.
SVCService.
TSTTest - The manufacturing stage in which the packaged die is tested.

10MeasurementTypeLines: 473 481 781 789
General category of measurement.
Entity Instances
CDMCritical dimension measurement.
DPHDepth - the measurement of the depth of a feature. e.g. Depth of trench, contact, or via.
FLTFilm Thickness - the measure of the thickness of a thin film.
OLYOverlay - a measurement of how well an upper layer is aligned to the layers below.
RSYResistivity - the measurement of the resistive nature of a thin film.

11MimeTypeQualifierLines: 34
The MIME type as defined by IANA. Please refer to http://www.iana.org/assignments/media-types/ for a list of types.
Entity Instances
application/EDI-Consent[RFC1767]
application/EDI-X12[RFC1767]
application/EDIFACT[RFC1767]
application/activemessage[Shapiro]
application/andrew-inset[Borenstein]
application/applefile[Faltstrom]
application/atomicmail[Borenstein]
application/batch-SMTP[RFC2442]
application/beep+xml[RFC3080]
application/cals-1840[RFC1895]
application/cnrp+xml[RFCCNRP]
application/commonground[Glazer]
application/cpl+xml
application/cybercash[Eastlake]
application/dca-rft[Campbell]
application/dec-dx[Campbell]
application/dicom[RFC3240]
application/dvcs[RFC3029]
application/eshop[Katz]
application/font-tdpfr[RFC3073]
application/http[RFC2616]
application/hyperstudio[Domino]
application/iges[Parks]
application/index[RFC2652]
application/index.cmd[RFC2652]
application/index.obj[RFC2652]
application/index.response[RFC2652]
application/index.vnd[RFC2652]
application/iotp[RFC2935]
application/ipp[RFC2910]
application/isup[RFC3204]
application/mac-binhex40[Faltstrom]
application/macwriteii[Lindner]
application/marc[RFC2220]
application/mathematica[Van Nostern]
application/msword[Lindner]
application/news-message-id[RFC1036,Spencer]
application/news-transmission[RFC1036, Spencer]
application/ocsp-request[RFC2560]
application/ocsp-response[RFC2560]
application/octet-stream[RFC2045,RFC2046]
application/oda[RFC2045,RFC2046]
application/ogg[RFC-walleij-ogg-mediatype-08.txt]
application/parityfec[RFC3009]
application/pdf[Lindner]
application/pgp-encrypted[RFC3156]
application/pgp-keys[RFC3156]
application/pgp-signature[RFC3156]
application/pkcs10[RFC2311]
application/pkcs7-mime[RFC2311]
application/pkcs7-signature[RFC2311]
application/pkix-cert[RFC2585]
application/pkix-crl[RFC2585]
application/pkixcmp[RFC2510]
application/postscript[RFC2045,RFC2046]
application/prs.alvestrand.titrax-sheet[Alvestrand]
application/prs.cww[Rungchavalnont]
application/prs.nprend[Doggett]
application/prs.plucker[Janssen]
application/qsig[RFC3204]
application/reginfo+xml[RFC-ietf-sipping-reg-event-00.txt]
application/remote-printing[RFC1486,Rose]
application/riscos[Smith]
application/rtf[Lindner]
application/sdp[RFC2327]
application/set-payment[Korver]
application/set-payment-initiation[Korver]
application/set-registration[Korver]
application/set-registration-initiation[Korver]
application/sgml[RFC1874]
application/sgml-open-catalog[Grosso]
application/sieve[RFC3028]
application/slate[Crowley]
application/timestamp-query[RFC3161]
application/timestamp-reply[RFC3161]
application/tve-trigger[Welsh]
application/vemmi[RFC2122]
application/vnd.3M.Post-it-Notes[O'Brien]
application/vnd.3gpp.pic-bw-large[Meredith]
application/vnd.3gpp.pic-bw-small[Meredith]
application/vnd.3gpp.pic-bw-var[Meredith]
application/vnd.3gpp.sms[Meredith]
application/vnd.FloGraphIt[Floersch]
application/vnd.Mobius.DAF[Kabayama]
application/vnd.Mobius.DIS[Kabayama]
application/vnd.Mobius.MBK[Devasia]
application/vnd.Mobius.MQY[Devasia]
application/vnd.Mobius.MSL[Kabayama]
application/vnd.Mobius.PLC[Kabayama]
application/vnd.Mobius.TXF[Kabayama]
application/vnd.Quark.QuarkXPress[Scheidler]
application/vnd.accpac.simply.aso[Leow]
application/vnd.accpac.simply.imp[Leow]
application/vnd.acucobol[Lubin]
application/vnd.acucorp[Lubin]
application/vnd.adobe.xfdf[Perelman]
application/vnd.aether.imp[Moskowitz]
application/vnd.amiga.ami[Blumberg]
application/vnd.anser-web-certificate-issue-initiation[Mori]
application/vnd.anser-web-funds-transfer-initiation[Mori]
application/vnd.audiograph[Slusanschi]
application/vnd.blueice.multipass[Holmstrom]
application/vnd.bmi[Gotoh]
application/vnd.businessobjects[Imoucha]
application/vnd.canon-cpdl[Muto]
application/vnd.canon-lips[Muto]
application/vnd.cinderella[Kortenkamp]
application/vnd.claymore[Simpson]
application/vnd.commerce-battelle[Applebaum]
application/vnd.commonspace[Chandhok]
application/vnd.contact.cmsg[Patz]
application/vnd.cosmocaller[Dellutri]
application/vnd.ctc-posml[Kohlhepp]
application/vnd.cups-postscript[Sweet]
application/vnd.cups-raster[Sweet]
application/vnd.cups-raw[Sweet]
application/vnd.curl[Byrnes]
application/vnd.cybank[Helmee]
application/vnd.data-vision.rdz[Fields]
application/vnd.dna[Searcy]
application/vnd.dpgraph[Parker]
application/vnd.dreamfactory[Appleton]
application/vnd.dxr[Duffy]
application/vnd.ecdis-update[Buettgenbach]
application/vnd.ecowin.chart[Olsson]
application/vnd.ecowin.filerequest[Olsson]
application/vnd.ecowin.fileupdate[Olsson]
application/vnd.ecowin.series[Olsson]
application/vnd.ecowin.seriesrequest[Olsson]
application/vnd.ecowin.seriesupdate[Olsson]
application/vnd.enliven[Santinelli]
application/vnd.epson.esf[Hoshina]
application/vnd.epson.msf[Hoshina]
application/vnd.epson.quickanime[Gu]
application/vnd.epson.salt[Nagatomo]
application/vnd.epson.ssf[Hoshina]
application/vnd.ericsson.quickcall[Tidwell]
application/vnd.eudora.data[Resnick]
application/vnd.fdf[Zilles]
application/vnd.ffsns[Holstage]
application/vnd.framemaker[Wexler]
application/vnd.fsc.weblaunch[D.Smith]
application/vnd.fujitsu.oasys[Togashi]
application/vnd.fujitsu.oasys2[Togashi]
application/vnd.fujitsu.oasys3[Okudaira]
application/vnd.fujitsu.oasysgp[Sugimoto]
application/vnd.fujitsu.oasysprs[Ogita]
application/vnd.fujixerox.ddd[Onda]
application/vnd.fujixerox.docuworks[Taguchi]
application/vnd.fujixerox.docuworks.binder[Matsumoto]
application/vnd.fut-misnet[Pruulmann]
application/vnd.grafeq[Tupper]
application/vnd.groove-account[Joseph]
application/vnd.groove-help[Joseph]
application/vnd.groove-identity-message[Joseph]
application/vnd.groove-injector[Joseph]
application/vnd.groove-tool-message[Joseph]
application/vnd.groove-tool-template[Joseph]
application/vnd.groove-vcard[Joseph]
application/vnd.hbci[Hammann]
application/vnd.hhe.lesson-player[Jones]
application/vnd.hp-HPGL[Pentecost]
application/vnd.hp-PCL[Pentecost]
application/vnd.hp-PCLXL[Pentecost]
application/vnd.hp-hpid[Gupta]
application/vnd.hp-hps[Aubrey]
application/vnd.httphone[Lefevre]
application/vnd.hzn-3d-crossword[Minnis]
application/vnd.ibm.MiniPay[Herzberg]
application/vnd.ibm.afplinedata[Buis]
application/vnd.ibm.electronic-media[Tantlinger]
application/vnd.ibm.modcap[Hohensee]
application/vnd.ibm.secure-container[Tantlinger]
application/vnd.informix-visionary[Gales]
application/vnd.intercon.formnet[Gurak]
application/vnd.intertrust.digibox[Tomasello]
application/vnd.intertrust.nncp[Tomasello]
application/vnd.intu.qbo[Scratchley]
application/vnd.intu.qfx[Scratchley]
application/vnd.irepository.package+xml[Knowles]
application/vnd.is-xpr[Natarajan]
application/vnd.japannet-directory-service[Fujii]
application/vnd.japannet-jpnstore-wakeup[Yoshitake]
application/vnd.japannet-payment-wakeup[Fujii]
application/vnd.japannet-registration[Yoshitake]
application/vnd.japannet-registration-wakeup[Fujii]
application/vnd.japannet-setstore-wakeup[Yoshitake]
application/vnd.japannet-verification[Yoshitake]
application/vnd.japannet-verification-wakeup[Fujii]
application/vnd.jisp[Deckers]
application/vnd.kde.karbon[Faure]
application/vnd.kde.kchart[Faure]
application/vnd.kde.kformula[Faure]
application/vnd.kde.kivio[Faure]
application/vnd.kde.kontour[Faure]
application/vnd.kde.kpresenter[Faure]
application/vnd.kde.kspread[Faure]
application/vnd.kde.kword[Faure]
application/vnd.kenameaapp[DiGiorgio-Haag]
application/vnd.koan[Cole]
application/vnd.liberty-request+xml[McDowell]
application/vnd.llamagraphics.life-balance.desktop[White]
application/vnd.lotus-1-2-3[Wattenberger]
application/vnd.lotus-approach[Wattenberger]
application/vnd.lotus-freelance[Wattenberger]
application/vnd.lotus-notes[Laramie]
application/vnd.lotus-organizer[Wattenberger]
application/vnd.lotus-screencam[Wattenberger]
application/vnd.lotus-wordpro[Wattenberger]
application/vnd.mcd[Gotoh]
application/vnd.mediastation.cdkey[Flurry]
application/vnd.meridian-slingshot[Wedel]
application/vnd.micrografx.flo[Prevo]
application/vnd.micrografx.igx[Prevo]
application/vnd.mif[Wexler]
application/vnd.minisoft-hp3000-save[Bartram]
application/vnd.mitsubishi.misty-guard.trustweb[Tanaka]
application/vnd.mophun.application[Wennerstrom]
application/vnd.mophun.certificate[Wennerstrom]
application/vnd.motorola.flexsuite[Patton]
application/vnd.motorola.flexsuite.adsi[Patton]
application/vnd.motorola.flexsuite.fis[Patton]
application/vnd.motorola.flexsuite.gotap[Patton]
application/vnd.motorola.flexsuite.kmr[Patton]
application/vnd.motorola.flexsuite.ttc[Patton]
application/vnd.motorola.flexsuite.wem[Patton]
application/vnd.mozilla.xul+xml[McDaniel]
application/vnd.ms-artgalry[Slawson]
application/vnd.ms-asf[Fleischman]
application/vnd.ms-excel[Gill]
application/vnd.ms-lrm[Ledoux]
application/vnd.ms-powerpoint[Gill]
application/vnd.ms-project[Gill]
application/vnd.ms-tnef[Gill]
application/vnd.ms-works[Gill]
application/vnd.ms-wpl[Plastina]
application/vnd.mseq[Le Bodic]
application/vnd.msign[Borcherding]
application/vnd.music-niff[Butler]
application/vnd.musician[Adams]
application/vnd.netfpx[Mutz]
application/vnd.noblenet-directory[Solomon]
application/vnd.noblenet-sealer[Solomon]
application/vnd.noblenet-web[Solomon]
application/vnd.novadigm.EDM[Swenson]
application/vnd.novadigm.EDX[Swenson]
application/vnd.novadigm.EXT[Swenson]
application/vnd.obn[Hessling]
application/vnd.osa.netdeploy[Klos]
application/vnd.palm[Peacock]
application/vnd.pg.format[Gandert]
application/vnd.pg.osasli[Gandert]
application/vnd.powerbuilder6[Guy]
application/vnd.powerbuilder6-s[Guy]
application/vnd.powerbuilder7[Shilts]
application/vnd.powerbuilder7-s[Shilts]
application/vnd.powerbuilder75[Shilts]
application/vnd.powerbuilder75-s[Shilts]
application/vnd.previewsystems.box[Smolgovsky]
application/vnd.publishare-delta-tree[Ben-Kiki]
application/vnd.pvi.ptid1[Lamb]
application/vnd.pwg-multiplexed[RFC3391]
application/vnd.pwg-xhtml-print+xml[Wright]
application/vnd.rapid[Szekely]
application/vnd.s3sms[Tarkkala]
application/vnd.sealed.net[Lambert]
application/vnd.seemail[Webb]
application/vnd.shana.informed.formdata[Selzler]
application/vnd.shana.informed.formtemplate[Selzler]
application/vnd.shana.informed.interchange[Selzler]
application/vnd.shana.informed.package[Selzler]
application/vnd.smaf[Takahashi]
application/vnd.sss-cod[Dani]
application/vnd.sss-dtf[Bruno]
application/vnd.sss-ntf[Bruno]
application/vnd.street-stream[Levitt]
application/vnd.svd[Becker]
application/vnd.swiftview-ics[Widener]
application/vnd.triscape.mxs[Simonoff]
application/vnd.trueapp[Hepler]
application/vnd.truedoc[Chase]
application/vnd.ufdl[Manning]
application/vnd.uplanet.alert[Martin]
application/vnd.uplanet.alert-wbxml[Martin]
application/vnd.uplanet.bearer-choice[Martin]
application/vnd.uplanet.bearer-choice-wbxml[Martin]
application/vnd.uplanet.cacheop[Martin]
application/vnd.uplanet.cacheop-wbxml[Martin]
application/vnd.uplanet.channel[Martin]
application/vnd.uplanet.channel-wbxml[Martin]
application/vnd.uplanet.list[Martin]
application/vnd.uplanet.list-wbxml[Martin]
application/vnd.uplanet.listcmd[Martin]
application/vnd.uplanet.listcmd-wbxml[Martin]
application/vnd.uplanet.signal[Martin]
application/vnd.vcx[T.Sugimoto]
application/vnd.vectorworks[Pharr]
application/vnd.vidsoft.vidconference[Hess]
application/vnd.visio[Sandal]
application/vnd.visionary[Aravindakumar]
application/vnd.vividence.scriptfile[Risher]
application/vnd.vsf[Rowe]
application/vnd.wap.sic[WAP-Forum]
application/vnd.wap.slc[WAP-Forum]
application/vnd.wap.wbxml[Stark]
application/vnd.wap.wmlc[Stark]
application/vnd.wap.wmlscriptc[Stark]
application/vnd.webturbo[Rehem]
application/vnd.wrq-hp3000-labelled[Bartram]
application/vnd.wt.stf[Wohler]
application/vnd.wv.csp+wbxml[Salmi]
application/vnd.xara[Matthewman]
application/vnd.xfdl[Manning]
application/vnd.yellowriver-custom-menu[Yellow]
application/whoispp-query[RFC2957]
application/whoispp-response[RFC2958]
application/wita[Campbell]
application/wordperfect5.1[Lindner]
application/x400-bp[RFC1494]
application/xhtml+xml[RFC3236]
application/xml[RFC3023]
application/xml-dtd[RFC3023]
application/xml-external-parsed-entity[RFC3023]
application/zip[Lindner]
audio/32kadpcm[RFC2421,RFC2422]
audio/AMR[RFC3267]
audio/AMR-WB[RFC3267]
audio/CN[RFC3389]
audio/DAT12[RFC3190]
audio/DVI4
audio/EVRC[RFC-ietf-avt-evrc-smv-03.txt]
audio/EVRC0[RFC-ietf-avt-evrc-smv-03.txt]
audio/G.722.1[RFC3047]
audio/G722
audio/G723
audio/G726-16
audio/G726-24
audio/G726-32
audio/G726-40
audio/G728
audio/G729
audio/G729D
audio/G729E
audio/GSM
audio/GSM-EFR
audio/L16[RFC2586]
audio/L20[RFC3190]
audio/L24[RFC3190]
audio/L8
audio/LPC
audio/MP4A-LATM[RFC3016]
audio/MPA
audio/PCMA
audio/PCMU
audio/QCELP
audio/RED
audio/SMV[RFC-ietf-avt-evrc-smv-03.txt]
audio/SMV0[RFC-ietf-avt-evrc-smv-03.txt]
audio/VDVI
audio/basic[RFC2045,RFC2046]
audio/mpa-robust[RFC3119]
audio/mpeg[RFC3003]
audio/parityfec[RFC3009]
audio/prs.sid[Walleij]
audio/telephone-event[RFC2833]
audio/tone[RFC2833]
audio/vnd.3gpp.iufp[Belling]
audio/vnd.cisco.nse[Kumar]
audio/vnd.cns.anp1[McLaughlin]
audio/vnd.cns.inf1[McLaughlin]
audio/vnd.digital-winds[Strazds]
audio/vnd.everad.plj[Cicelsky]
audio/vnd.lucent.voice[Vaudreuil]
audio/vnd.nortel.vbk[Parsons]
audio/vnd.nuera.ecelp4800[Fox]
audio/vnd.nuera.ecelp7470[Fox]
audio/vnd.nuera.ecelp9600[Fox]
audio/vnd.octel.sbc[Vaudreuil]
audio/vnd.qcelp[Lundblade]
audio/vnd.rhetorex.32kadpcm[Vaudreuil]
audio/vnd.vmx.cvsd[Vaudreuil]
image/cgmComputer Graphics Metafile
image/g3fax[RFC1494]
image/gif[RFC2045,RFC2046]
image/ief[RFC1314] Image Exchange Format
image/jpeg[RFC2045,RFC2046]
image/naplps[Ferber]
image/png[Randers-Pehrson]
image/prs.btif[Simon]
image/prs.pti[Laun]
image/t38[RFC3362]
image/tiff[RFC3302] Tag Image File Format
image/tiff-fx[RFC3250] Tag Image File Format Fax eXtended
image/vnd.cns.inf2[McLaughlin]
image/vnd.djvu[Bottou]
image/vnd.dwg[Moline]
image/vnd.dxf[Moline]
image/vnd.fastbidsheet[Becker]
image/vnd.fpx[Spencer]
image/vnd.fst[Fuldseth]
image/vnd.fujixerox.edmics-mmr[Onda]
image/vnd.fujixerox.edmics-rlc[Onda]
image/vnd.globalgraphics.pgb[Bailey]
image/vnd.mix[Reddy]
image/vnd.ms-modi[Vaughan]
image/vnd.net-fpx[Spencer]
image/vnd.svf[Moline]
image/vnd.wap.wbmp[Stark]
image/vnd.xiff[S.Martin]
message/delivery-status[RFC1894]
message/disposition-notification[RFC2298]
message/external-body[RFC2045,RFC2046]
message/http[RFC2616]
message/news[RFC 1036, H.Spencer]
message/partial[RFC2045,RFC2046]
message/rfc822[RFC2045,RFC2046]
message/s-http[RFC2660]
message/sip[RFC3261]
message/sipfrag[RFC3420]
model/iges[Parks]
model/mesh[RFC2077]
model/vnd.dwf[Pratt]
model/vnd.flatland.3dml[Powers]
model/vnd.gdl[Babits]
model/vnd.gs-gdl[Babits]
model/vnd.gtw[Ozaki]
model/vnd.mts[Rabinovitch]
model/vnd.parasolid.transmit.binary[Parasolid]
model/vnd.parasolid.transmit.text[Parasolid]
model/vnd.vtu[Rabinovitch]
model/vrml[RFC2077]
multipart/alternative[RFC2045,RFC2046]
multipart/appledouble[Faltstrom]
multipart/byteranges[RFC2068]
multipart/digest[RFC2045,RFC2046]
multipart/encrypted[RFC1847]
multipart/form-data[RFC2388]
multipart/header-set[Crocker]
multipart/mixed[RFC2045,RFC2046]
multipart/parallel[RFC2045,RFC2046]
multipart/related[RFC2387]
multipart/report[RFC1892]
multipart/signed[RFC1847]
multipart/voice-message[RFC2421,RFC2423]
text/calendar[RFC2445]
text/css[RFC2318]
text/directory[RFC2425]
text/enriched[RFC1896]
text/html[RFC2854]
text/parityfec[RFC3009]
text/plain[RFC2646,RFC2046]
text/prs.lines.tag[Lines]
text/rfc822-headers[RFC1892]
text/richtext[RFC2045,RFC2046]
text/rtf[Lindner]
text/sgml[RFC1874]
text/t140[RFC2793]
text/tab-separated-values[Lindner]
text/uri-list[RFC2483]
text/vnd.DMClientScript[Bradley]
text/vnd.IPTC.NITF[IPTC]
text/vnd.IPTC.NewsML[IPTC]
text/vnd.abc[Allen]
text/vnd.curl[Byrnes]
text/vnd.fly[Gurney]
text/vnd.fmi.flexstor[Hurtta]
text/vnd.in3d.3dml[Powers]
text/vnd.in3d.spot[Powers]
text/vnd.latex-z[Lubos]
text/vnd.motorola.reflex[Patton]
text/vnd.ms-mediapackage[Nelson]
text/vnd.net2phone.commcenter.command[Xie]
text/vnd.sun.j2me.app-descriptor[G.Adams]
text/vnd.wap.si[WAP-Forum]
text/vnd.wap.sl[WAP-Forum]
text/vnd.wap.wml[Stark]
text/vnd.wap.wmlscript[Stark]
text/xml[RFC3023]
text/xml-external-parsed-entity[RFC3023]
video/BMPEG
video/BT656
video/CelB
video/DV[RFC3189]
video/H261
video/H263
video/H263-1998
video/H263-2000
video/JPEG
video/MP1S
video/MP2P
video/MP2T
video/MP4V-ES[RFC3016]
video/MPV
video/SMPTE292M[RFC-avt-smpte292-video-08.txt]
video/mpeg[RFC2045,RFC2046]
video/nv
video/parityfec[RFC3009]
video/pointer[RFC2862]
video/quicktime[Lindner]
video/vnd.fvt[Fuldseth]
video/vnd.motorola.video[McGinty]
video/vnd.motorola.videop[McGinty]
video/vnd.mpegurl[Recktenwald]
video/vnd.nokia.interleaved-multimedia[Kangaslampi]
video/vnd.objectvideo[Clark]
video/vnd.vivo[Wolfe]

12TestResultLines: 629
Describes the test result for a parametric test.
Entity Instances
FALFailed.
FCSFailed Censor.
FHLFailed High Limit.
FLLFailed Low Limit.
PASPassed.
SCVScreened Valued.

13UnitOfMeasureLines: 486 504 528 544 569 593 794 812 836 852 877 901
Code identifying a product unit of measure.
Entity Instances
10P10-pack.
1BF100 Board Feet.
1FC20 Foot Container.
1GRGram/Cubic Centimeter.
1GT10,000 Gallon Tankcar.
1KB25 Kilogram Bulk Bag.
1KD10 Kilogram Drum.
1KP1000-pack.
1M21/Square Meter (1/M2).
1PA20-Pack.
1PB50 Pound Bag.
1PD100 Pound Drum.
1PM1/minute (1/min).
22SSquare Millimeter/Second (mm2/s).
2FC40 Foot Container.
2GRGram/square meter.
2GT20,000 Gallon Tankcar.
2KB300 Kilogram Bulk Bag.
2KD15 Kilogram Drum.
2PA100-Pack.
3GRGrams Per 100 Centimeters.
3KB500 Kilogram Bulk Bag.
3KD55 Gallon Drum.
3MHCubic Millimeters/Hour (mm3/hour).
4GRGrams Per 100 Grams.
4KD115 Kilogram Drum.
50P50-pack.
5GRGrams Per Cubic Centimeter.
6GRGrams Per Square Centimeter.
7GRGrams Per Square Meter.
ABCAbsorbance per centimeter (Absorbance per cm).
ABUAbsorbance per Unit (absorbance per unit).
ACCAtoms per Cubic Centimeters (atoms per cu cm).
ACRAcre.
ACSAcidic strength/concentration.
ACTActual Pounds.
ACUActivity unit (Activ.unit).
ALUAluminum Pounds Only.
AM1Ampoule.
AMNÅngstroms/Minute (Ångst/min).
AMPAmpere.
ANGAngstrom (A).
APBAtomic Parts per Billion (atomic ppb).
APGAPI Specific Gravity (API Grav).
APMAtomic Parts per Million (atomic ppm).
APTAtomic Parts per Trillion (atomic ppt).
APUAPHA Units (apha).
ASCAtoms per Square Centimeters (atoms per sq cm).
ASMAngstrom.
ASYAssembly (ASY).
ATGAtmospheric gauge.
ATMAtmosphere absolute.
ATPAtomic %.
ATYActivity.
BABBase Box.
BACBatch.
BAEBale.
BAGBag.
BALBall.
BANBand.
BAPBatting Pound.
BARBar.
BASBasket.
BATBatt.
BAWBase Weight.
BEABeam.
BECBecquerel/kilogram.
BELBelt.
BHPBrake HP.
BILBillet.
BINBin.
BITBit.
BKCBulk Car Load.
BLNBalance.
BLOBlock.
BOABoard.
BOFBoard Feet.
BOLBolt.
BOTBottle.
BOXBox.
BRBBar absolute.
BRDBarrels Per Day.
BREBarrel.
BRIBarrel (Imperial).
BRMBarrels Per Minute.
BTFBritish Thermal Units (BTUs) Per Cubic Foot.
BTPBritish Thermal Units (BTUs) Per Pound.
BTUBritish Thermal Unit (BTU).
BUBBubbler.
BUCBucket.
BUDBushel, Dry Imperial.
BUKBunks.
BULBulk.
BUNBundle.
BUPBulk Pack.
BUSBushel.
BYTBytes.
C0WCounts per Wafer (Counts/wf).
C3MCubic centimeter per minute (cm3/minute).
CAACarat.
CABCarboy.
CACCard.
CADCandela.
CAGCartridge.
CAKCask.
CALCalorie.
CANCan.
CAOCarload.
CARCar.
CASCase.
CATCanister.
CAWCatchweight.
CC2Centipoises per hour per square centimeters (cps per hr per sq cm).
CCCCounts per Square Centimeters (Counts/cm2).
CD3Cubic decimeter (Cubic dec).
CELCell.
CEMCentimeter.
CEPCentipoises (CPS).
CETCentiliter.
CGMCentigram.
CHAChains (Land Survey).
CHEChest.
CM2Square centimeter (cm2).
CMHCentimeter/hour (cm/h).
CMLColony/Milliliter (col/ml).
CMSCentimeter/Second (cm/s).
CNNConnector.
COGCoil Group.
COICoil.
COLCoulomb.
COMComposite Product Pounds (Total Weight).
CONCone.
COTContainer.
COVCover.
CRACrate.
CRTCarton.
CSECassette.
CSTCentistokes.
CUBCubic centimeter.
CUCCubic centimeter/second.
CUFCubic Foot.
CUICubic inch.
CUMCubic meter.
CUPCup.
CUYCubic yard.
CYCCycles.
CYLCylinder.
DALDalton units (dalton).
DAYDay.
DCBDecibels.
DCGDecagram.
DCLDeciliter.
DCMDefects per Square Centimeters (Defects/cm2).
DE1Defects.
DE2Degrees in Angles.
DE3Degree.
DEADeal.
DECDecimeter.
DEFDegree Fahrenheit.
DEGDegree Celsius.
DEPDep. Factor.
DFWDefects per Wafer (Defects/Wafer).
DGMDecigram.
DIEDie.
DILDisplay.
DIPDispenser.
DNCDynes per centimeter (Dynes per cm).
DOZDozen.
DPMParts per Million per Day (ppm per day).
DRADram.
DRUDrum.
DRYDry Pounds.
EACEach.
ELEElectrical Capacitance.
EMLEnzyme Units/Milliliter (Enzyme/ml).
ENUEnzyme Units (Enzy.Units).
EQ2Milliequivalent per 30 Kg (mequ/30Kg).
EQGMilliequivalent per gram (milliequivalent per g).
EQKMilliequivalent per Kilogram (mequ/Kg).
EQMMilliequivalent per Millimeter (milliequivalent per mm).
FARFarads.
FFAFemtofarad.
FIN1/32 inch.
FLOFluid Ounce.
FOIFluid Ounce (Imperial).
FOOFoot.
FOUFluid Ounce US.
FPSFeet per second (Feet/s).
FRHSales FT3 at 60°F per hour (FTR/hour).
FRMSales FT3 at 60°F per minute (FTR/min).
FTRSales FT3 at 60°F, 14.7 psia (SFT3_60F_S).
FTSSales FT3 at 70°F, 14.7 psia (SFT3_70F_S).
FTT1000 FT3 at 60°F, 14.7 psia (KFT3_60F_S).
FTU1000 FT3 at 70°F, 14.7 psia (KFT3_70F_S).
FUUFuel Usage (Gallons).
G2SGram square per second (g²/s).
GAIGram act. ingrd. (g act.ing).
GALGallon.
GASGage Systems.
GAUGram Gold.
GCLGardner Color.
GEGKeim/Gramm (keim/g).
GEQGram per Equivalent (g/Eq).
GGMGram per gram mole (g/gmole).
GHGGram per Hectogram (g/hg).
GIHGigahertz.
GIJGigajoules.
GILGill (Imperial).
GM4Gram per 100 Milliliters (g/100ml).
GMEGram per Mole Equivalent (g/mole Eq).
GMOGram per Mol (g/mol).
GNLGram act.Ingrd per Liter (gai/liter).
GOBGross Barrels.
GOGGross Gallons.
GOHGigaohm (GOhm).
GOKGross Kilogram.
GOTGross Ton.
GOYGross Yard.
GPNUS Gallon per minute (gpm US).
GRAGram.
GRGGreat Gross (Dozen Gross).
GRKGrams Per Kilogram.
GRLGrams Per Liter.
GRMGrams Per Milliliter.
GRNGrain.
GROGross.
GRPGroup.
HAGHalf Gallon.
HAHHalf Hour.
HALHalf Liter.
HANHank.
HEAHeat lots.
HECHectare.
HELHectoliter.
HEPHectopascal.
HERHertz.
HGMHegman.
HNYHenry.
HOSHours.
HOUHour.
HUAHundredth of a Carat.
HUBHundred Boxes.
HUCHundred Count.
HUSHundred Sheets.
HZMHertz per Minute (Hertz per min).
IH2Inches of Water Gauge (inH2O-g).
IHGInches of Mercury Gauge (inHg-g).
ILBInch pounds (in.lb).
IMGImperial Gallons.
INCInch.
IPSInch per second (inch / sec).
JARJar.
JKGJoule/Kilogram (J/kg).
JMOJoule/Mol (J/mol).
JOIJoint.
JOUJoule.
KAIKilogram act. Ingrd. (kg ac.ing.).
KAKkg act.ingrd. / kg (kai/kg).
KBYKilobyte.
KCMKilogram per cm2 gauge (kg/cm2-g).
KD3Kilogram per Cubic Decimeter (kg/dm3).
KEGKeg.
KELKelvin.
KGEContainer Fill Weight in Kg/Ea.
KGHKilogram per Hour (kg/h).
KGLKilograms per Liter (kg/L).
KGMKilogram/Mol (kg/mol).
KGSKilogram per Second (kg/s).
KHOKilometer/hour.
KICKilogram per cubic meter.
KIEKilometer.
KIGKilogram.
KIHKilohertz.
KIKKilobecquerel/Kilogram.
KILKiloampere.
KIMKilogram/square meter.
KIOKiloohm.
KISKilogramm pro Sekunde.
KITKit.
KIVKilovolt.
KIWKilowatt.
KJKKilojoule per kilogram (KJ/kg).
KJLKilojoule.
KJMKilojoule/Mol (KJ/mol).
KKGKilogram/Kilogram.
KMKCubic meter/Cubic meter (m3/m3).
KMNKelvin per Minute (K/min).
KMSKelvin per Second (K/s).
KNMKilonewton per square meter (kN/m2).
KNTKilonewton (ND).
KPAKilopascal (kPa).
KRUKreb Unit.
KTNKilotonne (kt).
KUDKubikdezimeter.
KUMKubikmeter pro Sekunde.
KVAKilovoltampere (kVA).
KWHKilowatt-hour.
KWRKilovolt ampere reactive hours (KVAH reac.).
LBHUS Pound per Hour (lb/hour).
LBMUS Pound per minute (lb/min).
LG2Liter per Gram per Centimeter (l/g/cm).
LGCLiters per Gram-Centimeters (l/g-cm).
LHKLiter per 100 km (l/100 km).
LIFLifts.
LIMLink.
LIQLiquid Pounds.
LITLiter.
LMILiter per Minute (l/min).
LMSLiter per Molsecond (l/mol.s).
LOALoad.
LOTLot.
LPDLight Point Defects per Wafer (LPD/Wafer).
LPHLiter per hour (l/hr).
LUGLug.
M15Micron per 15 Square Millimeters (mu per 15 sq mm).
M20Micron per 20 Square Millimeters (mu per 20 sq mm).
M25Micron per 25 Square Millimeters (mu per 25 sq mm).
M26Micron per 26 by 8 Millimeters (mu per 26 by 8 mm).
M2GMeters square per gram (m sq per gram).
M3ASales m3 at 15 °C, 1 atmos (Sm3_15C_S).
M3BSales m3 at 21 °C, 1 atmos (Sm3_21C_S).
M3CSales m3 at 10 °C, 1 atmos (Sm3_10C_S).
M3DSales m3 at 43 °C, 1 bar (Sm3_43C_D).
M3ESales m3 at 9 °C, 1 bar (Sm3_9C_D).
M3FSales m3 at 15 °C, 1 bar (Sm3_15C_D).
M3GSales m3 at 27 °C, 1 atmos (Sm3_27C_S).
M3HCubic Meter per Hour (m3/h).
M3JSales m3 at 35 °C, 1 atmos (Sm3_35C_S).
M3KCubic Meter/Kilogram (m3/Kg).
M3MMilliliter per Cubic Meter (ml/m3).
M3NMol per Cubic Meter (Mol/m3).
MAMMilliamps/mm.
MATMat.
MBYMegabyte.
MBZMeterbar per Second (m.bar/s).
MC2Millisecond per Centimeter (mS/cm).
MCAMicroampere (µA).
MCGMicrogram.
MCHMicromhos (µmhos).
MCKMicrocuries per Kilogram (µci/kg).
MCLMicrocuries per Gaseous Liter (µc/l).
MCMMilligrams Per Cubic Meter.
MCNMetal Can.
MCPManifolded Cylinder Pack.
MCRMicron.
MEGMegagram.
MEHMegahertz.
MEJMegajoule (MJ).
MEPMegapascal.
METMeter.
MEWMegawatt.
MFDMicrofarad (µF).
MGAMilligram per Amp (mg per amp).
MGFMilligram per Square Centimeter (mg/cm2).
MGGMilligram per Gram (mg/g).
MGLMicrogram per Liter (µg/l).
MGMMilligram.
MGOMegohm (MOhm).
MGRMicrograms per Gram (µg/g).
MGSMilligram per Second (mg per sec).
MH1Millimeter per Hour (mm/h).
MHCMicromhos per Centimeter (µmhos/cm).
MHRMeter per Hour (m/h).
MHVMegavolt.
MIBMillion BTU's.
MICMikrogram/cubic meter.
MIGMicrograms Per Cubic Meter.
MILMile.
MIMMicrometer.
MINMinute.
MIPMillipascal seconds.
MISMicrosecond.
MITMiter.
MIVMillivolt.
MIWMilliwatt.
MJMWobbe Number (MJ/m3).
MJOMillijoule.
MKGMilligrams of KOH per Gram (mg KOH per g).
MKLMillimol per Gram (mmol/g).
ML1Milliliter per Liter (ml/l).
ML2Milliliter per Liter (ml/l).
ML3Mol per Liter (Mol/Liter).
ML4Millimol per Liter (Millimol/l).
MLAMilliampere.
MLBMillibar.
MLCMilligram/cubic meter.
MLGMilliliter per Gallon (ml per gal).
MLIMilliliter.
MLKMilligram/kilogram.
MLLMilligram/Liter.
MLMMole per Mole (mole/mole).
MLPMole Percent (% mole).
MLRMicroliter (µl).
MLSMiles.
MLWMilliliter act. Ingr. (ml act.in.).
MM3Cubic Millimeter (mm3).
MMAMillimeter per Year (mm/a).
MMEMillimeter.
MMGMillimol/gram (mmol/g).
MMHMillimeter H20.
MMKMillimol/kilogram.
MMM 0.000001 meter (1 millionth of a meter). (Micrometer/Micron).
MMNMeter per Minute (m/min).
MMOMillimol.
MMSMillimeter per Second (mm/s).
MNMMillinewton per meter (mN/m).
MNTMeganewton (MN).
MOKMol/kilogram.
MOLMol.
MONMonth.
MPBMass parts per billion (ppb(m)).
MPGMiles per Gallon (US) (Mi/Gal(US)).
MPHMegagrams Per Hour.
MPMMass Parts per Million (ppm(m)).
MPTMass Parts per Trillion (ppt(m)).
MPZMeterpascal per Second (m.Pa/s).
MQGMircoequivalent per Gram (microeq/g).
MRFMillifarad (mF).
MS1MilliSiemen per Centimeter (mS/cm).
MS2Meter per Second Squared (m/s2).
MS3Microsiemens per Centimeter (µS/cm).
MSCMillisecond.
MSMMilligrams Per Square Meter.
MTAMillitesla.
MTQMeter pro Quadratsekunde.
MTRMeter (m).
MTSMeters per second.
MULMultichip - When 2 or more dies (chips) are merged into one package.
MVAMegavoltampere (MVA).
MVSMillivolts.
MVTMillivolt.
MWHMegawatt Hours (mwh).
MWRMegavolt Ampere Reactive Hours (MVAH reac.).
MWTMolecular Weight (mW).
MYSMicro Siemens (mic. Siem.).
N2MNewton/Square millimeter (N/mm2).
NAANanoamps.
NAMNanometer.
NASNanosecond.
NEBNet Barrels.
NEGNet Gallons.
NEINet Imperial Gallons.
NELNet Liters.
NEWNewton.
NM2Newton per Square Meter (N/m²).
NM3Normal m3 at 0°C, 1 atmos (Normal m3).
NMHNewton per Hour (N/h).
NMMNewton per Millimeter (N/mm).
NMRNormal m3 per Hour (Nm3/h).
NOLNormality.
NPKNowpac Container (Nowpac).
NRGBar Gauge.
NRUNanofarad (nF).
NTUNephelometric Turbidity Units (NTU).
NTYEquivalents per Liter (equ/l).
NUMNumbers.
NWMNewton per Meter (N/m).
NXMNewton per 25 mm (N/25mm).
O2PPercent Oxygen (% Oxygen).
OCTOhm/ct.
OHCOhm-Centimeter (ohm cm).
OHMOhm.
OMMOhm/mm.
ONEOne.
OPHOperating hour (Oper. Hour).
OSQOhm/sq.
OTPOne Thousand Pieces.
OUNOunce.
OVIOhm/via.
OZGOunce per Gallon (oz per gal).
PACParcel.
PADPad.
PAGPackage.
PAIPail.
PAKPack (PAK).
PALPallet.
PANPanel.
PARPair.
PASPascal.
PATPacket.
PBAPPBA Silicon (ppba Si).
PBWParts Per Billion by Weight (ppbw).
PC2Parts per Square Centimeters (part per sq cm).
PCAPercent Active (% Active).
PCLPicocuries per Liter (pCi/l).
PECPercent.
PEGPercentage.
PEHPercent Per 1000 Hours.
PENPennyweight.
PERPer Hundred Pieces.
PEWPercent Weight.
PF3Per Cubic Foot (per cu ft).
PF4Particles per Cubic Feet (particles per cu ft).
PFAPercent Failed Area (Failed Area %).
PFRPicofarad.
PHPH Factor (pH).
PI2Parts per Square Inch (part per sq in).
PIDPint U.S. Dry.
PIEPiece.
PILPint - US liquid.
PL1Parts per Liter (parts per l).
PL2Parts per Milliliter (parts per ml).
PL3Part per Millilitre (Part/ml).
PLAPlate.
PLIPounds per Linear Inch (lb/Lin. In).
PLLPallet (Lift).
PLRPer Liter.
PLTPalette.
PLUPallet/Unit Load.
PMAPercent Mass (%(m)).
PMIPer Mille (%0).
PMLParticles per Milliliter (particles/mL).
PMOPer Mille mass (%0(mass)).
PMPParts Per Million Platinum (ppm Pt).
PMVParts Per Million (weight/Vol) (ppm (w/v)).
PMWParts Per Million by Weight (ppmw).
PNJParticles per Injection (particles per inj).
PNTPoints.
POFPounds Per Foot.
POGPounds Per Gallon.
PONPound.
POPPounds Per Piece of Product.
PORPores.
POSPounds Per 1000 Square Feet.
POTPounds Per Thousand.
PP3Parts per Million mole (ppm mole).
PP4Parts per Billion Mole (ppb mole).
PPBParts per billion (US).
PPFParts per Ft3 (Parts/Ft3).
PPHParts Per Hundred (pph).
PPMParts per million.
PPPPounds Per Pound of Product.
PPTParts per Trillion (ppt).
PRSNumber of Persons.
PSAPounds per Square Inch Absolute.
PSCPicosecond.
PSGPound per Square Inch Gauge (psi gauge).
PSIPSI Unit (PSI).
PSSPascal second.
PSVPoise.
PTLParticles per Liter (Part/Liter).
PWFParticles per Wafer (particles/wf).
QMLKilomol (kmol).
QUAQuart - US liquid.
RACRack.
REAReam of 500 Sheets.
REEReel.
RINRing.
RLURelative Light Unit (RLU).
RODRod.
ROLRoll.
RPMRevolutions per Minute (Revs/min).
SACSack.
SBBSuper Bulk Bag.
SCLScales.
SECSecond.
SETSet.
SHESheet.
SHIShipment.
SHMSheet - Metric measure.
SHOShot.
SIDDisk (Disc).
SIESiemens per Meter (Siemens/m).
SKESkein.
SKISkid.
SLESleeve.
SLISlip Sheet.
SMISquare mile.
SMMSquare millimeter.
SPOSpool.
SQFSquare foot.
SQISquare inch.
SQKSquare kilometer.
SQMSquare meter.
SQSSquare meter/second.
SQUSquare.
SQYSquare Yard.
STIStick.
STMStatute Mile.
STPSteps.
STRStrip.
STUStabilizer Units (SU).
SVUSay Bolt Viscosity Units (SVU).
TABTablet.
TANTank.
TARTarget pieces (target).
TATTank Truck.
TESTesla.
THOThousand.
TM31/Cubic Meter (1/m3).
TNNTonne.
TOMTon per Cubic Meter (t/m3).
TONTon.
TORTorr.
TOTTote.
TPTPass Test (Pass).
TRATrain.
TRFTrack Foot.
TRLTrailer.
TROTroy.
TRUTruckload.
TRYTray.
TRZTroy OZ.
TUBTube.
ULUUnitless Unit of Measure.
UNTUnit.
USGUS gallon.
USPUS pound.
USTUS ton.
VALVO mat. (Value).
VAPVoltampere (VA).
VHNVickers Micro-Hardness (VHN10).
VIAVial.
VMPMolar %.
VOLVolt.
VPBVolume Parts per Billion (ppb(V)).
VPCPercent Volume (%(V)).
VPMVolume Parts per Million (ppm(V)).
VPRPer Mille Volume (%O(V)).
VPTVolume parts per Trillion (ppt(V)).
VTAVolts (Alternating Current).
VTDVolts (Direct Current).
VTMVolts Per Meter.
WAFWafer.
WARWatt.
WEEWeek.
WPTParts Per Trillion by Weight (pptw).
WRAWrap.
YARYard.
YEAYear.

14UnitLines: 609 612 615
To express the unit type of measurement.
Entity Instances
10P10-pack.
1BF100 Board Feet.
1FC20 Foot Container.
1GRGram/Cubic Centimeter.
1GT10,000 Gallon Tankcar.
1KB25 Kilogram Bulk Bag.
1KD10 Kilogram Drum.
1KP1000-pack.
1M21/Square Meter (1/M2).
1PA20-Pack.
1PB50 Pound Bag.
1PD100 Pound Drum.
1PM1/minute (1/min).
22SSquare Millimeter/Second (mm2/s).
2FC40 Foot Container.
2GRGram/square meter.
2GT20,000 Gallon Tankcar.
2KB300 Kilogram Bulk Bag.
2KD15 Kilogram Drum.
2PA100-Pack.
3GRGrams Per 100 Centimeters.
3KB500 Kilogram Bulk Bag.
3KD55 Gallon Drum.
3MHCubic Millimeters/Hour (mm3/hour).
4GRGrams Per 100 Grams.
4KD115 Kilogram Drum.
50P50-pack.
5GRGrams Per Cubic Centimeter.
6GRGrams Per Square Centimeter.
7GRGrams Per Square Meter.
ABCAbsorbance per centimeter (Absorbance per cm).
ABUAbsorbance per Unit (absorbance per unit).
ACCAtoms per Cubic Centimeters (atoms per cu cm).
ACRAcre.
ACSAcidic strength/concentration.
ACTActual Pounds.
ACUActivity unit (Activ.unit).
ALUAluminum Pounds Only.
AM1Ampoule.
AMNÅngstroms/Minute (Ångst/min).
AMPAmpere.
ANGAngstrom (A).
APBAtomic Parts per Billion (atomic ppb).
APGAPI Specific Gravity (API Grav).
APMAtomic Parts per Million (atomic ppm).
APTAtomic Parts per Trillion (atomic ppt).
APUAPHA Units (apha).
ASCAtoms per Square Centimeters (atoms per sq cm).
ASMAngstrom.
ASYAssembly (ASY).
ATGAtmospheric gauge.
ATMAtmosphere absolute.
ATPAtomic %.
ATYActivity.
BABBase Box.
BACBatch.
BAEBale.
BAGBag.
BALBall.
BANBand.
BAPBatting Pound.
BARBar.
BASBasket.
BATBatt.
BAWBase Weight.
BEABeam.
BECBecquerel/kilogram.
BELBelt.
BHPBrake HP.
BILBillet.
BINBin.
BITBit.
BKCBulk Car Load.
BLNBalance.
BLOBlock.
BOABoard.
BOFBoard Feet.
BOLBolt.
BOTBottle.
BOXBox.
BRBBar absolute.
BRDBarrels Per Day.
BREBarrel.
BRIBarrel (Imperial).
BRMBarrels Per Minute.
BTFBritish Thermal Units (BTUs) Per Cubic Foot.
BTPBritish Thermal Units (BTUs) Per Pound.
BTUBritish Thermal Unit (BTU).
BUBBubbler.
BUCBucket.
BUDBushel, Dry Imperial.
BUKBunks.
BULBulk.
BUNBundle.
BUPBulk Pack.
BUSBushel.
BYTBytes.
C0WCounts per Wafer (Counts/wf).
C3MCubic centimeter per minute (cm3/minute).
CAACarat.
CABCarboy.
CACCard.
CADCandela.
CAGCartridge.
CAKCask.
CALCalorie.
CANCan.
CAOCarload.
CARCar.
CASCase.
CATCanister.
CAWCatchweight.
CC2Centipoises per hour per square centimeters (cps per hr per sq cm).
CCCCounts per Square Centimeters (Counts/cm2).
CD3Cubic decimeter (Cubic dec).
CELCell.
CEMCentimeter.
CEPCentipoises (CPS).
CETCentiliter.
CGMCentigram.
CHAChains (Land Survey).
CHEChest.
CM2Square centimeter (cm2).
CMHCentimeter/hour (cm/h).
CMLColony/Milliliter (col/ml).
CMSCentimeter/Second (cm/s).
CNNConnector.
COGCoil Group.
COICoil.
COLCoulomb.
COMComposite Product Pounds (Total Weight).
CONCone.
COTContainer.
COVCover.
CRACrate.
CRTCarton.
CSECassette.
CSTCentistokes.
CUBCubic centimeter.
CUCCubic centimeter/second.
CUFCubic Foot.
CUICubic inch.
CUMCubic meter.
CUPCup.
CUYCubic yard.
CYCCycles.
CYLCylinder.
DALDalton units (dalton).
DAYDay.
DCBDecibels.
DCGDecagram.
DCLDeciliter.
DCMDefects per Square Centimeters (Defects/cm2).
DE1Defects.
DE2Degrees in Angles.
DE3Degree.
DEADeal.
DECDecimeter.
DEFDegree Fahrenheit.
DEGDegree Celsius.
DEPDep. Factor.
DFWDefects per Wafer (Defects/Wafer).
DGMDecigram.
DIEDie.
DILDisplay.
DIPDispenser.
DNCDynes per centimeter (Dynes per cm).
DOZDozen.
DPMParts per Million per Day (ppm per day).
DRADram.
DRUDrum.
DRYDry Pounds.
EACEach.
ELEElectrical Capacitance.
EMLEnzyme Units/Milliliter (Enzyme/ml).
ENUEnzyme Units (Enzy.Units).
EQ2Milliequivalent per 30 Kg (mequ/30Kg).
EQGMilliequivalent per gram (milliequivalent per g).
EQKMilliequivalent per Kilogram (mequ/Kg).
EQMMilliequivalent per Millimeter (milliequivalent per mm).
FARFarads.
FFAFemtofarad.
FIN1/32 inch.
FLOFluid Ounce.
FOIFluid Ounce (Imperial).
FOOFoot.
FOUFluid Ounce US.
FPSFeet per second (Feet/s).
FRHSales FT3 at 60°F per hour (FTR/hour).
FRMSales FT3 at 60°F per minute (FTR/min).
FTRSales FT3 at 60°F, 14.7 psia (SFT3_60F_S).
FTSSales FT3 at 70°F, 14.7 psia (SFT3_70F_S).
FTT1000 FT3 at 60°F, 14.7 psia (KFT3_60F_S).
FTU1000 FT3 at 70°F, 14.7 psia (KFT3_70F_S).
FUUFuel Usage (Gallons).
G2SGram square per second (g²/s).
GAIGram act. ingrd. (g act.ing).
GALGallon.
GASGage Systems.
GAUGram Gold.
GCLGardner Color.
GEGKeim/Gramm (keim/g).
GEQGram per Equivalent (g/Eq).
GGMGram per gram mole (g/gmole).
GHGGram per Hectogram (g/hg).
GIHGigahertz.
GIJGigajoules.
GILGill (Imperial).
GM4Gram per 100 Milliliters (g/100ml).
GMEGram per Mole Equivalent (g/mole Eq).
GMOGram per Mol (g/mol).
GNLGram act.Ingrd per Liter (gai/liter).
GOBGross Barrels.
GOGGross Gallons.
GOHGigaohm (GOhm).
GOKGross Kilogram.
GOTGross Ton.
GOYGross Yard.
GPNUS Gallon per minute (gpm US).
GRAGram.
GRGGreat Gross (Dozen Gross).
GRKGrams Per Kilogram.
GRLGrams Per Liter.
GRMGrams Per Milliliter.
GRNGrain.
GROGross.
GRPGroup.
HAGHalf Gallon.
HAHHalf Hour.
HALHalf Liter.
HANHank.
HEAHeat lots.
HECHectare.
HELHectoliter.
HEPHectopascal.
HERHertz.
HGMHegman.
HNYHenry.
HOSHours.
HOUHour.
HUAHundredth of a Carat.
HUBHundred Boxes.
HUCHundred Count.
HUSHundred Sheets.
HZMHertz per Minute (Hertz per min).
IH2Inches of Water Gauge (inH2O-g).
IHGInches of Mercury Gauge (inHg-g).
ILBInch pounds (in.lb).
IMGImperial Gallons.
INCInch.
IPSInch per second (inch / sec).
JARJar.
JKGJoule/Kilogram (J/kg).
JMOJoule/Mol (J/mol).
JOIJoint.
JOUJoule.
KAIKilogram act. Ingrd. (kg ac.ing.).
KAKkg act.ingrd. / kg (kai/kg).
KBYKilobyte.
KCMKilogram per cm2 gauge (kg/cm2-g).
KD3Kilogram per Cubic Decimeter (kg/dm3).
KEGKeg.
KELKelvin.
KGEContainer Fill Weight in Kg/Ea.
KGHKilogram per Hour (kg/h).
KGLKilograms per Liter (kg/L).
KGMKilogram/Mol (kg/mol).
KGSKilogram per Second (kg/s).
KHOKilometer/hour.
KICKilogram per cubic meter.
KIEKilometer.
KIGKilogram.
KIHKilohertz.
KIKKilobecquerel/Kilogram.
KILKiloampere.
KIMKilogram/square meter.
KIOKiloohm.
KISKilogramm pro Sekunde.
KITKit.
KIVKilovolt.
KIWKilowatt.
KJKKilojoule per kilogram (KJ/kg).
KJLKilojoule.
KJMKilojoule/Mol (KJ/mol).
KKGKilogram/Kilogram.
KMKCubic meter/Cubic meter (m3/m3).
KMNKelvin per Minute (K/min).
KMSKelvin per Second (K/s).
KNMKilonewton per square meter (kN/m2).
KNTKilonewton (ND).
KPAKilopascal (kPa).
KRUKreb Unit.
KTNKilotonne (kt).
KUDKubikdezimeter.
KUMKubikmeter pro Sekunde.
KVAKilovoltampere (kVA).
KWHKilowatt-hour.
KWRKilovolt ampere reactive hours (KVAH reac.).
LBHUS Pound per Hour (lb/hour).
LBMUS Pound per minute (lb/min).
LG2Liter per Gram per Centimeter (l/g/cm).
LGCLiters per Gram-Centimeters (l/g-cm).
LHKLiter per 100 km (l/100 km).
LIFLifts.
LIMLink.
LIQLiquid Pounds.
LITLiter.
LMILiter per Minute (l/min).
LMSLiter per Molsecond (l/mol.s).
LOALoad.
LOTLot.
LPDLight Point Defects per Wafer (LPD/Wafer).
LPHLiter per hour (l/hr).
LUGLug.
M15Micron per 15 Square Millimeters (mu per 15 sq mm).
M20Micron per 20 Square Millimeters (mu per 20 sq mm).
M25Micron per 25 Square Millimeters (mu per 25 sq mm).
M26Micron per 26 by 8 Millimeters (mu per 26 by 8 mm).
M2GMeters square per gram (m sq per gram).
M3ASales m3 at 15 °C, 1 atmos (Sm3_15C_S).
M3BSales m3 at 21 °C, 1 atmos (Sm3_21C_S).
M3CSales m3 at 10 °C, 1 atmos (Sm3_10C_S).
M3DSales m3 at 43 °C, 1 bar (Sm3_43C_D).
M3ESales m3 at 9 °C, 1 bar (Sm3_9C_D).
M3FSales m3 at 15 °C, 1 bar (Sm3_15C_D).
M3GSales m3 at 27 °C, 1 atmos (Sm3_27C_S).
M3HCubic Meter per Hour (m3/h).
M3JSales m3 at 35 °C, 1 atmos (Sm3_35C_S).
M3KCubic Meter/Kilogram (m3/Kg).
M3MMilliliter per Cubic Meter (ml/m3).
M3NMol per Cubic Meter (Mol/m3).
MAMMilliamps/mm.
MATMat.
MBYMegabyte.
MBZMeterbar per Second (m.bar/s).
MC2Millisecond per Centimeter (mS/cm).
MCAMicroampere (µA).
MCGMicrogram.
MCHMicromhos (µmhos).
MCKMicrocuries per Kilogram (µci/kg).
MCLMicrocuries per Gaseous Liter (µc/l).
MCMMilligrams Per Cubic Meter.
MCNMetal Can.
MCPManifolded Cylinder Pack.
MCRMicron.
MEGMegagram.
MEHMegahertz.
MEJMegajoule (MJ).
MEPMegapascal.
METMeter.
MEWMegawatt.
MFDMicrofarad (µF).
MGAMilligram per Amp (mg per amp).
MGFMilligram per Square Centimeter (mg/cm2).
MGGMilligram per Gram (mg/g).
MGLMicrogram per Liter (µg/l).
MGMMilligram.
MGOMegohm (MOhm).
MGRMicrograms per Gram (µg/g).
MGSMilligram per Second (mg per sec).
MH1Millimeter per Hour (mm/h).
MHCMicromhos per Centimeter (µmhos/cm).
MHRMeter per Hour (m/h).
MHVMegavolt.
MIBMillion BTU's.
MICMikrogram/cubic meter.
MIGMicrograms Per Cubic Meter.
MILMile.
MIMMicrometer.
MINMinute.
MIPMillipascal seconds.
MISMicrosecond.
MITMiter.
MIVMillivolt.
MIWMilliwatt.
MJMWobbe Number (MJ/m3).
MJOMillijoule.
MKGMilligrams of KOH per Gram (mg KOH per g).
MKLMillimol per Gram (mmol/g).
ML1Milliliter per Liter (ml/l).
ML2Milliliter per Liter (ml/l).
ML3Mol per Liter (Mol/Liter).
ML4Millimol per Liter (Millimol/l).
MLAMilliampere.
MLBMillibar.
MLCMilligram/cubic meter.
MLGMilliliter per Gallon (ml per gal).
MLIMilliliter.
MLKMilligram/kilogram.
MLLMilligram/Liter.
MLMMole per Mole (mole/mole).
MLPMole Percent (% mole).
MLRMicroliter (µl).
MLSMiles.
MLWMilliliter act. Ingr. (ml act.in.).
MM3Cubic Millimeter (mm3).
MMAMillimeter per Year (mm/a).
MMEMillimeter.
MMGMillimol/gram (mmol/g).
MMHMillimeter H20.
MMKMillimol/kilogram.
MMM 0.000001 meter (1 millionth of a meter). (Micrometer/Micron).
MMNMeter per Minute (m/min).
MMOMillimol.
MMSMillimeter per Second (mm/s).
MNMMillinewton per meter (mN/m).
MNTMeganewton (MN).
MOKMol/kilogram.
MOLMol.
MONMonth.
MPBMass parts per billion (ppb(m)).
MPGMiles per Gallon (US) (Mi/Gal(US)).
MPHMegagrams Per Hour.
MPMMass Parts per Million (ppm(m)).
MPTMass Parts per Trillion (ppt(m)).
MPZMeterpascal per Second (m.Pa/s).
MQGMircoequivalent per Gram (microeq/g).
MRFMillifarad (mF).
MS1MilliSiemen per Centimeter (mS/cm).
MS2Meter per Second Squared (m/s2).
MS3Microsiemens per Centimeter (µS/cm).
MSCMillisecond.
MSMMilligrams Per Square Meter.
MTAMillitesla.
MTQMeter pro Quadratsekunde.
MTRMeter (m).
MTSMeters per second.
MULMultichip - When 2 or more dies (chips) are merged into one package.
MVAMegavoltampere (MVA).
MVSMillivolts.
MVTMillivolt.
MWHMegawatt Hours (mwh).
MWRMegavolt Ampere Reactive Hours (MVAH reac.).
MWTMolecular Weight (mW).
MYSMicro Siemens (mic. Siem.).
N2MNewton/Square millimeter (N/mm2).
NAANanoamps.
NAMNanometer.
NASNanosecond.
NEBNet Barrels.
NEGNet Gallons.
NEINet Imperial Gallons.
NELNet Liters.
NEWNewton.
NM2Newton per Square Meter (N/m²).
NM3Normal m3 at 0°C, 1 atmos (Normal m3).
NMHNewton per Hour (N/h).
NMMNewton per Millimeter (N/mm).
NMRNormal m3 per Hour (Nm3/h).
NOLNormality.
NPKNowpac Container (Nowpac).
NRGBar Gauge.
NRUNanofarad (nF).
NTUNephelometric Turbidity Units (NTU).
NTYEquivalents per Liter (equ/l).
NUMNumbers.
NWMNewton per Meter (N/m).
NXMNewton per 25 mm (N/25mm).
O2PPercent Oxygen (% Oxygen).
OCTOhm/ct.
OHCOhm-Centimeter (ohm cm).
OHMOhm.
OMMOhm/mm.
ONEOne.
OPHOperating hour (Oper. Hour).
OSQOhm/sq.
OTPOne Thousand Pieces.
OUNOunce.
OVIOhm/via.
OZGOunce per Gallon (oz per gal).
PACParcel.
PADPad.
PAGPackage.
PAIPail.
PAKPack (PAK).
PALPallet.
PANPanel.
PARPair.
PASPascal.
PATPacket.
PBAPPBA Silicon (ppba Si).
PBWParts Per Billion by Weight (ppbw).
PC2Parts per Square Centimeters (part per sq cm).
PCAPercent Active (% Active).
PCLPicocuries per Liter (pCi/l).
PECPercent.
PEGPercentage.
PEHPercent Per 1000 Hours.
PENPennyweight.
PERPer Hundred Pieces.
PEWPercent Weight.
PF3Per Cubic Foot (per cu ft).
PF4Particles per Cubic Feet (particles per cu ft).
PFAPercent Failed Area (Failed Area %).
PFRPicofarad.
PHPH Factor (pH).
PI2Parts per Square Inch (part per sq in).
PIDPint U.S. Dry.
PIEPiece.
PILPint - US liquid.
PL1Parts per Liter (parts per l).
PL2Parts per Milliliter (parts per ml).
PL3Part per Millilitre (Part/ml).
PLAPlate.
PLIPounds per Linear Inch (lb/Lin. In).
PLLPallet (Lift).
PLRPer Liter.
PLTPalette.
PLUPallet/Unit Load.
PMAPercent Mass (%(m)).
PMIPer Mille (%0).
PMLParticles per Milliliter (particles/mL).
PMOPer Mille mass (%0(mass)).
PMPParts Per Million Platinum (ppm Pt).
PMVParts Per Million (weight/Vol) (ppm (w/v)).
PMWParts Per Million by Weight (ppmw).
PNJParticles per Injection (particles per inj).
PNTPoints.
POFPounds Per Foot.
POGPounds Per Gallon.
PONPound.
POPPounds Per Piece of Product.
PORPores.
POSPounds Per 1000 Square Feet.
POTPounds Per Thousand.
PP3Parts per Million mole (ppm mole).
PP4Parts per Billion Mole (ppb mole).
PPBParts per billion (US).
PPFParts per Ft3 (Parts/Ft3).
PPHParts Per Hundred (pph).
PPMParts per million.
PPPPounds Per Pound of Product.
PPTParts per Trillion (ppt).
PRSNumber of Persons.
PSAPounds per Square Inch Absolute.
PSCPicosecond.
PSGPound per Square Inch Gauge (psi gauge).
PSIPSI Unit (PSI).
PSSPascal second.
PSVPoise.
PTLParticles per Liter (Part/Liter).
PWFParticles per Wafer (particles/wf).
QMLKilomol (kmol).
QUAQuart - US liquid.
RACRack.
REAReam of 500 Sheets.
REEReel.
RINRing.
RLURelative Light Unit (RLU).
RODRod.
ROLRoll.
RPMRevolutions per Minute (Revs/min).
SACSack.
SBBSuper Bulk Bag.
SCLScales.
SECSecond.
SETSet.
SHESheet.
SHIShipment.
SHMSheet - Metric measure.
SHOShot.
SIDDisk (Disc).
SIESiemens per Meter (Siemens/m).
SKESkein.
SKISkid.
SLESleeve.
SLISlip Sheet.
SMISquare mile.
SMMSquare millimeter.
SPOSpool.
SQFSquare foot.
SQISquare inch.
SQKSquare kilometer.
SQMSquare meter.
SQSSquare meter/second.
SQUSquare.
SQYSquare Yard.
STIStick.
STMStatute Mile.
STPSteps.
STRStrip.
STUStabilizer Units (SU).
SVUSay Bolt Viscosity Units (SVU).
TABTablet.
TANTank.
TARTarget pieces (target).
TATTank Truck.
TESTesla.
THOThousand.
TM31/Cubic Meter (1/m3).
TNNTonne.
TOMTon per Cubic Meter (t/m3).
TONTon.
TORTorr.
TOTTote.
TPTPass Test (Pass).
TRATrain.
TRFTrack Foot.
TRLTrailer.
TROTroy.
TRUTruckload.
TRYTray.
TRZTroy OZ.
TUBTube.
ULUUnitless Unit of Measure.
UNTUnit.
USGUS gallon.
USPUS pound.
USTUS ton.
VALVO mat. (Value).
VAPVoltampere (VA).
VHNVickers Micro-Hardness (VHN10).
VIAVial.
VMPMolar %.
VOLVolt.
VPBVolume Parts per Billion (ppb(V)).
VPCPercent Volume (%(V)).
VPMVolume Parts per Million (ppm(V)).
VPRPer Mille Volume (%O(V)).
VPTVolume parts per Trillion (ppt(V)).
VTAVolts (Alternating Current).
VTDVolts (Direct Current).
VTMVolts Per Meter.
WAFWafer.
WARWatt.
WEEWeek.
WPTParts Per Trillion by Weight (pptw).
WRAWrap.
YARYard.
YEAYear.

Data Types
NoNameFormatData Type
1BusinessProcessIdentifierpattern = [0-9a-zA-Z]{1,12}
string
2Contactstring
3DUNSPlus4pattern = [0-9]{9}[0-9a-zA-Z]{1,4}
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4DUNSpattern = [0-9]{9}
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5GLNpattern = [0-9]{13}
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6GTINpattern = [0-9]{14}
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7Hexadecimalpattern = [0-9a-fA-F]{1,}
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8PercentAmounttotalDigits = 6
decimal
9PipIdentifierpattern = PIP\d{1}[A-Z]{1}\d{1,2}
string
10PipVersionpattern = \d{2}\.\d{2}\.\d{2}
string
11VersionIdentifierpattern = \d{2}\.\d{2}
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XML Data Types
NoNameDefinition
1anyURIRepresents a URI as defined by RFC 2396. An anyURI value can be absolute or relative, and may have an optional fragment identifier.
2booleanRepresents Boolean values, which are either "true" or "false".
3dateTimeRepresents a specific instance of time. The pattern for dateTime is CCYY-MM-DDThh:mm:ss where CC represents the century, YY the year, MM the month, and DD the day, preceded by an optional leading negative (-) character to indicate a negative number. If the negative character is omitted, positive (+) is assumed. The T is the date/time separator and hh, mm, and ss represent hour, minute, and second respectively. Additional digits can be used to increase the precision of fractional seconds if desired. For example, the format ss.ss... with any number of digits after the decimal point is supported. The fractional seconds part is optional.
This representation may be immediately followed by a "Z" to indicate Coordinated Universal Time (UTC) or to indicate the time zone. For example, the difference between the local time and Coordinated Universal Time, immediately followed by a sign, + or -, followed by the difference from UTC represented as hh:mm (minutes is required). If the time zone is included, both hours and minutes must be present.
4decimalA data type that contains decimal numbers scaled by a power of 10.
5floatRepresents single-precision 32-bit floating-point numbers.
6integerRepresents a sequence of decimal digits with an optional leading sign (+ or -). This data type is derived from decimal.
7positiveIntegerRepresents an integer that is greater than zero. This data type is derived from nonNegativeInteger.
8stringRepresents character string.